Renesas R5F566NDHDBG#20

Overview

R5F566NDHDBG#20 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 4 MB on-chip code flash (dual-bank), 1 MB SRAM (including 32 KB ECC RAM), Ethernet MAC + PHY, CAN (3 channels), and GLCDC/DRW2D graphics acceleration - deployed in industrial HMIs, networked gateways, and real-time control systems requiring deterministic timing and IEC 60730 compliance.

For engineers reviewing the R5F566NDHDBG#20 datasheet, R5F566NDHDBG#20 pinout, R5F566NDHDBG#20 application, or R5F566NDHDBG#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-C), 120 MHz real-time execution (698 CoreMark), dual-bank flash for safe firmware updates, integrated Ethernet+USB+CAN connectivity, and hardware-accelerated 2D graphics rendering for embedded GUIs.

Technical Context

The R5F566NDHDBG#20 implements the RXv3 CPU core with 16×32-bit general-purpose registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. Its memory subsystem includes 4 MB code flash with zero-wait 120 MHz access, 1 MB SRAM (512 KB + 512 KB expansion), and 32 KB ECC RAM supporting SEC-DED error correction.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU), PCLKA (120 MHz for ETHERC/GLCDC/DRW2D), PCLKB (60 MHz for timers/A/D), and PCLKC/PCLKD (60 MHz for S12AD units). The device integrates dedicated DMA controllers (DMACAa: 8 ch, EXDMAC: 2 ch, DTCb: 1 ch) and event-linking capability (123 internal signals) to offload CPU interrupt handling in real-time applications.

Key Specifications

Pinout & Package

Package: PLQP0176KB-C - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, 13 × 13 array excluding corner balls, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MCU applications.

Compared with R5F566NEHDFB#30, the R5F566NDHDBG#20 delivers 2× flash capacity and integrated PHY for standalone Ethernet nodes; versus R5F572MDHDFB#30, it trades EtherCAT support and clock speed for lower power and broader peripheral compatibility in general-purpose gateway designs.

Availability

R5F566NDHDBG#20 is available at Aetrix Electronics and suitable for industrial HMIs, smart gateways, motor control hubs, and medical data loggers requiring stable component supply, long lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F566NDHDBG#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX66N Group - including R5F566NDHDBG#20 - was designed for real-time, safety-critical embedded systems demanding high computational throughput, rich connectivity (Ethernet/CAN/USB), and hardware-accelerated graphics for human-machine interfaces.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NDHDBG#20?

The R5F566NDHDBG#20 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark points under benchmark conditions. This performance stems from its RXv3 CPU core with optimized pipeline, double-precision FPU, and zero-wait-state 4 MB flash access - enabling deterministic real-time execution in demanding applications like motor control and industrial gateways.

Does the R5F566NDHDBG#20 include an integrated Ethernet PHY?

Yes, the R5F566NDHDBG#20 integrates a full IEEE 802.3u-compliant Ethernet PHY supporting 10/100 Mbps operation in both full- and half-duplex modes. It supports MII and RMII interfaces, Magic Packet™ wake-on-LAN, and IEEE 802.3x flow control - eliminating the need for an external PHY chip in most embedded networking designs.

What package type and pin count does the R5F566NDHDBG#20 use?

The R5F566NDHDBG#20 uses the PLQP0176KB-C package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 24 mm × 24 mm body size, 0.5 mm ball pitch, and –40°C to +85°C operating temperature range (D-version). This BGA variant supports high I/O density and thermal performance for complex HMI and gateway applications.

How does the dual-bank flash architecture benefit firmware updates on the R5F566NDHDBG#20?

The R5F566NDHDBG#20's dual-bank flash allows background programming: one bank executes active firmware while the other is erased and reprogrammed. This enables zero-downtime field updates, critical for industrial HMIs and gateways that must remain operational during maintenance - with no risk of corruption due to power loss mid-update.

Which safety standards does the R5F566NDHDBG#20 support for functional safety certification?

The R5F566NDHDBG#20 includes hardware features aligned with IEC 60730 Class B requirements: oscillation-stop detection, independent watchdog timer (IWDT) with windowing, CRC calculation unit, A/D converter self-diagnostic, register write protection, and memory ECC. These enable certified implementations in household appliances, industrial controls, and medical auxiliary equipment.