Renesas R5F566NDHDFP#30

Overview

R5F566NDHDFP#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz CPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), integrated Ethernet MAC, CAN, SDHI, QSPI, and dual 12-bit ADCs - deployed in industrial HMI, networked gateway, and motor control applications requiring real-time determinism and functional safety support.

For engineers reviewing the R5F566NDHDFP#30 datasheet, R5F566NDHDFP#30 pinout, R5F566NDHDFP#30 application, or R5F566NDHDFP#30 equivalent, key selection criteria include dual-bank flash for safe firmware updates, IEEE-754 double-precision FPU for motion control math, IEC60730-compliant self-test features, and 176-pin LFBGA package with 136 GPIOs including 19 5-V-tolerant pins.

Technical Context

The R5F566NDHDFP#30 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, supporting little-endian or big-endian data arrangement and 113 instructions including DSP and floating-point extensions. It integrates a memory protection unit (MPU) and collective register bank save for fast context switching in RTOS environments.

Clock architecture includes dual PLLs, selectable internal oscillators (LOCO/HOCO/IWDT), and independent peripheral clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz). Power management supports four low-power modes, RTC battery backup via VBATT, and voltage monitoring with three LVD circuits.

Key Specifications

Pinout & Package

Package: PLQP0176KB-C, 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F566NDHDFP#30, R5F566TEHDFP#30 trades TSIP and 2 MB flash capacity for lower cost in non-security applications, while R5F566NEHDFP#30 removes Ethernet/SDHI to reduce peripheral complexity - both retain identical CPU performance, RAM, and 176-pin footprint for drop-in replacement in constrained layouts.

Availability

R5F566NDHDFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, motor control, functional safety PLC, and edge computing applications requiring stable component supply across extended product lifecycles.

Supply support for R5F566NDHDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX66N Group is designed for high-performance, safety-aware embedded applications - integrating real-time processing, rich connectivity, graphics acceleration, and IEC60730/IEC61508 support in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NDHDFP#30?

The R5F566NDHDFP#30 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under those conditions. This performance stems from the RXv3 CPU core's optimized pipeline and dual-issue capability for select instructions. The R5F566NDHDFP#30 sustains this speed across its full temperature range (–40°C to +85°C) with no wait states on 4 MB flash or 1 MB SRAM, making it suitable for hard real-time tasks in industrial control systems.

Does the R5F566NDHDFP#30 support secure boot and cryptographic operations?

Yes, the R5F566NDHDFP#30 includes Trusted Secure IP (TSIP) and hardware-accelerated AES with key lengths of 128, 192, and 256 bits. These features enable secure boot verification, encrypted firmware updates, and runtime data protection. The TSIP block is isolated from general-purpose memory and accessible only via dedicated APIs - a requirement for achieving IEC60730 Class B and IEC61508 SIL2 compliance in the R5F566NDHDFP#30 implementation.

What are the supported package and pin-count options for the R5F566NDHDFP#30?

The R5F566NDHDFP#30 is exclusively offered in the PLQP0176KB-C package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It provides 136 general-purpose I/O pins, including 19 5-V-tolerant inputs, and supports multiple power domains (VCC, AVCC0, AVCC1, VBATT). No other package variants (e.g., QFP or smaller BGA) are assigned to this specific part number.

How does the R5F566NDHDFP#30 handle real-time clock functionality with power loss?

The R5F566NDHDFP#30 supports RTC operation during main power loss via the VBATT pin, which accepts a backup battery or capacitor. The RTC maintains calendar/time counting, alarm, and periodic interrupt functions independently of VCC. Time-capture registers store three timestamp values triggered by external events, and the RTC remains active in deep software standby mode - enabling accurate event logging and wake-up scheduling even when system power is removed from the R5F566NDHDFP#30's primary supply rails.

Which communication interfaces are integrated into the R5F566NDHDFP#30 for industrial networking?

The R5F566NDHDFP#30 integrates Ethernet MAC (10/100 Mbps MII/RMII), three ISO 11898-1 CAN channels (32 mailboxes each), SD host interface (SDHI), quad SPI (QSPI), three RSPI channels, three I²C interfaces (up to 1 Mbps), and 13 SCI channels with flexible mode support. These interfaces allow the R5F566NDHDFP#30 to serve as a unified networking hub - bridging fieldbuses (CAN), storage (SD), high-speed peripherals (QSPI flash), and enterprise networks (Ethernet) without external controllers.