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Renesas R5F566NNDDBG#20

Part No.:
R5F566NNDDBG#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR5F566NNDDBG#20.pdf
Description:
IC MCU 32BIT 4MB FLASH 176LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:135

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Product details

Overview

R5F566NNDDBG#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), double-precision IEEE-754 FPU, Ethernet MAC, CAN (3 channels), and SD host interface - deployed in industrial HMI, networked gateway, and motor control applications requiring real-time determinism and functional safety support.

For engineers reviewing the R5F566NNDDBG#20 datasheet, R5F566NNDDBG#20 pinout, R5F566NNDDBG#20 application, or R5F566NNDDBG#20 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-C (176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch), validated peripheral timing constraints, and confirmed alternative MCU options for IEC60730-compliant embedded designs.

Technical Context

The R5F566NNDDBG#20 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, double-precision FPU, MPU, and collective register bank save for fast context switching. It integrates dual-bank flash enabling background programming and bank-swapped boot, plus 32 KB data flash rated for 100,000 erase/write cycles.

Clock architecture includes main crystal oscillator (8–24 MHz), PLL for system clock generation (up to 120 MHz), independent IWDT-dedicated 120-kHz oscillator, and selectable PCLK domains (PCLKA up to 120 MHz for ETHERC/GLCDC, PCLKB up to 60 MHz for timers/ADC). Real-time clock supports battery-backed operation and time-capture with event-triggered timestamping.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max - enables deterministic real-time execution with 698 CoreMark performance and IEEE-754 double-precision floating-point math.
Memory 4 MB code flash (dual-bank), 1 MB SRAM (no wait states), 32 KB ECC RAM - supports secure firmware updates, large buffer handling, and error-corrected critical data storage.
Peripherals Ethernet MAC (10/100 Mbps), CAN (3 channels, 32 mailboxes each), SDHI (25 MB/s), QSPI, GLCDC + DRW2D - enables full-featured HMI and connectivity without external co-processors.
Analog Two 12-bit ADC units (8 + 21 channels), 2× 12-bit DAC, on-chip temperature sensor - provides high-resolution sensing and closed-loop control for motor drives and power systems.
Security & Safety TSIP encryption engine (AES-128/192/256), CRC accelerator, IWDT with window function, self-diagnostic A/D, register write protection - meets IEC60730 Class B requirements out-of-box.
Power & Temp 2.7–3.6 V supply, –40°C to +85°C (D-version), four low-power modes including deep software standby with 8 KB backup RAM - suitable for unattended industrial edge nodes.

Pinout & Package

Package: PLQP0176KB-C - 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VCC / AVCC0 / AVCC1 Core & analog power supply Must be decoupled individually; AVCC0/AVCC1 require separate 100-nF ceramic capacitors for ADC/DAC reference stability.
VBATT Battery backup supply Connects to coin cell to maintain RTC operation during main power loss - enables calendar retention and alarm wake-up.
RES# Active-low reset input Asynchronous reset pin; internal pull-up ensures reliable release from power-on; compatible with open-drain reset supervisors.
XTAL / EXTAL Main crystal oscillator terminals Supports 8–24 MHz fundamental-mode crystals; internal load capacitors configurable via registers (no external caps required).
MD0 / MD1 Mode setting pins Determine boot source (SCI/USB/FINE) and memory configuration at power-up; must be pulled high/low per target boot mode.
ETXD0–ETXD3 / ETRX0–ETRX3 Ethernet PHY interface Direct MII/RMII connection to external PHY; requires controlled impedance routing (50 Ω ±10%) and length-matched pairs.

Key Features

Feature Design Value
Dual-bank flash architecture Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating downtime during field upgrades.
Event Link Controller (ELC) Hardware interconnect between 123 internal peripherals eliminates CPU polling - e.g., TPU capture triggers ADC conversion without ISR overhead.
GLCDC + DRW2D graphics pipeline Offloads pixel composition, alpha blending, and 2D rendering from CPU - reduces frame buffer bandwidth and enables 800×480 LCD with <5% CPU load.
IEC60730-ready diagnostics Includes oscillation-stop detection, CRC-A, IWDT windowing, A/D self-test, and register lock bits - reduces certification effort for Class B safety applications.
Flexible clock domain partitioning PCLKA (120 MHz), PCLKB (60 MHz), PCLKC/D (60 MHz) allow independent peripheral clock scaling - optimizes power vs. throughput for ADC, timers, and Ethernet.

Applications

Industrial HMI Gateway Networked Motor Drive Controller

Use Scenario: Standalone panel PC controlling PLC I/O, displaying real-time process data, and relaying Modbus TCP over Ethernet.

IC Role / Device Role / Timing Role: Primary application processor executing RTOS, driving 800×480 RGB LCD via GLCDC, managing Ethernet stack, and servicing CANopen slave nodes.

Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash enables zero-downtime firmware patches; TSIP secures remote update payloads.

Use Scenario: Compact servo drive with position feedback, current sensing, and EtherCAT master capability for multi-axis coordination.

IC Role / Device Role / Timing Role: Real-time motion controller running PID loops at 20 kHz, synchronizing PWM outputs (GPTW), sampling dual 12-bit ADCs, and managing EtherCAT frame timing.

Use Value: PCLKA-synchronized GPTW and ADC ensure sub-µs jitter; ELC links encoder capture to PWM dead-time adjustment; ECC RAM protects trajectory buffers.

Smart Energy Meter Hub Building Automation Gateway

Use Scenario: DIN-rail mounted meter concentrator aggregating data from RS485-connected smart meters and transmitting via LTE/Ethernet to cloud.

IC Role / Device Role / Timing Role: Data aggregation MCU with multiple SCI interfaces (RS485/Modbus), SDHI for local logging, and Ethernet/USB for upstream comms.

Use Value: 13 SCI channels support concurrent protocol stacks; 4 MB flash stores firmware + encrypted log history; TSIP encrypts meter data before transmission.

Use Scenario: BACnet/IP-to-BACnet MS/TP gateway bridging HVAC controllers across IP networks and legacy field buses.

IC Role / Device Role / Timing Role: Protocol translation engine running BACnet stack, managing CAN/SCI/RSPI interfaces, and maintaining real-time schedule via RTC and alarm interrupts.

Use Value: Hardware-accelerated CRC and AES reduce BACnet security overhead; battery-backed RTC maintains scheduling during brownouts; 182 GPIOs support diverse field bus transceivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F566NNDDFK#30 Same RX66N core, identical peripherals, but in PLQP0144KA-B (144-pin LQFP, 20 × 20 mm) - 25 fewer GPIOs, no PDC or GLCDC. Lacks parallel camera interface and graphic-LCD controller - unsuitable for display-centric HMI but fits compact motor control boards. Select when footprint and cost constrain design, and graphics/CMOS camera functions are unnecessary.
R5F566TNDDBG#20 Same package and pinout, but RX66T variant: optimized timer subsystem (MTU3b), higher PWM resolution, no Ethernet MAC or SDHI. Targeted at high-precision motor control (e.g., servo inverters); replaces Ethernet/SD with enhanced PWM and encoder interfaces. Choose for applications demanding >16-bit PWM resolution and advanced phase-control, where networking is handled externally.

Compared with R5F566NNDDBG#20, the R5F566NNDDFK#30 sacrifices display and imaging peripherals for smaller footprint and lower cost, while the R5F566TNDDBG#20 trades connectivity for superior motor control timing precision - both retain identical toolchain and software compatibility within the RX66N/T family.

Availability

R5F566NNDDBG#20 is available at Aetrix Electronics and suitable for industrial HMI, networked motor control, smart energy metering, and building automation gateways requiring stable component supply across multi-year production cycles.

Supply support for R5F566NNDDBG#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX66N Group is designed for high-performance industrial applications demanding real-time responsiveness, rich connectivity, functional safety, and graphical user interfaces - targeting HMI, gateway, and motor control systems.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NNDDBG#20?

The R5F566NNDDBG#20 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under those conditions. This performance stems from the RXv3 CPU core's efficient instruction set, zero-wait-state 1 MB SRAM, and dual-issue capable pipeline - making it suitable for real-time industrial control tasks where deterministic latency matters.

Does the R5F566NNDDBG#20 support Ethernet and CAN simultaneously?

Yes, the R5F566NNDDBG#20 integrates one Ethernet MAC (10/100 Mbps) and three independent CAN channels (ISO 11898-1 compliant, 32 mailboxes each), all operable concurrently. Its dedicated EDMAC and CAN DMA channels offload packet processing, enabling simultaneous protocol stacks such as EtherCAT master + CANopen slave without CPU saturation.

What package type and pin count does the R5F566NNDDBG#20 use?

The R5F566NNDDBG#20 uses the PLQP0176KB-C package: a 176-pin LFBGA with 24 × 24 mm body size and 0.5-mm pitch. This package supports all RX66N peripherals including GLCDC, PDC, Ethernet, and 182 GPIOs - confirmed in Renesas datasheet R01DS0344EJ0120, Table 1.2.

How does the R5F566NNDDBG#20 meet IEC60730 Class B requirements?

The R5F566NNDDBG#20 includes hardware-level IEC60730 features: oscillation-stop detection, CRC-A accelerator, windowed IWDT, A/D converter self-test, register write protection, and memory ECC. These are documented in Section 1.12 of R01DS0344EJ0120 and enable certified Class B compliance without external components or software-only workarounds.

Is there on-chip flash with background programming capability in the R5F566NNDDBG#20?

Yes, the R5F566NNDDBG#20 includes 4 MB of on-chip code flash with background programming (BGO) and dual-bank architecture. This allows firmware updates while the application runs from the active bank - critical for zero-downtime field upgrades in industrial equipment using the R5F566NNDDBG#20.

R5F566NNDDBG#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
RX66N
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F566NNDDBG#20 FAQ

1.How can I place an order for R5F566NNDDBG#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F566NNDDBG#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F566NNDDBG#20 reliable?

The price and inventory of R5F566NNDDBG#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F566NNDDBG#20 is usually 5 days.

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4.How is shipping managed for R5F566NNDDBG#20?

R5F566NNDDBG#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F566NNDDBG#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F566NNDDBG#20?

For technical support, including R5F566NNDDBG#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F566NNDDBG#20 requirements.

6.How does Aetrix verify that R5F566NNDDBG#20 is sourced from the original manufacturer or authorized distributors?

All R5F566NNDDBG#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F566NNDDBG#20 meets industry standards.

7.What is the process for return or replacement of R5F566NNDDBG#20?

All R5F566NNDDBG#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F566NNDDBG#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F566NNDDBG#20 part is unused and in its original packaging.

Return procedure for R5F566NNDDBG#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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