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Renesas R5F566NNDDFB#10
- Part No.:
- R5F566NNDDFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F566NNDDFB#10.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:480
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Product details
Overview
R5F566NNDDFB#10 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 4-MB on-chip code flash (dual-bank), 1-MB SRAM (including 32-KB ECC RAM), and integrated Ethernet MAC, CAN, SDHI, QSPI, and GLCDC. It targets industrial HMI, networked gateway, and real-time control applications requiring deterministic timing, functional safety support (IEC60730), and rich peripheral integration.
For engineers reviewing the R5F566NNDDFB#10 datasheet, R5F566NNDDFB#10 pinout, R5F566NNDDFB#10 application, or R5F566NNDDFB#10 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-C (176-pin LQFP, 24 × 24 mm, 0.5-mm pitch), validated pin functions, real-world use cases, and two confirmed alternative parts with documented technical and application differences.
Technical Context
The R5F566NNDDFB#10 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, supporting little-endian or big-endian data arrangement and 113 instructions including DSP and floating-point operations. Its memory subsystem includes dual-bank 4-MB code flash enabling background programming and bank-swapping, plus 1-MB SRAM with 32-KB ECC-protected region for fault-tolerant execution.
Peripheral architecture integrates Ethernet MAC (10/100 Mbps, MII/RMII), three CAN channels (ISO11898-1, 32 mailboxes each), SDHI (25 MB/s), QSPI, and a full-featured graphics subsystem (GLCDC + DRW2D). Clocking uses PLL-based synthesis with independent PCLKA (up to 120 MHz) and PCLKB (up to 60 MHz) domains to optimize performance and power across modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 698 CoreMark, double-precision FPU (IEEE-754) |
| Memory | 4-MB code flash (dual-bank, BGO), 32-KB data flash (100k cycles), 1-MB SRAM (no wait states), 32-KB ECC RAM (SEC-DED) |
| Package | PLQP0176KB-C, 176-pin LQFP, 24 × 24 mm, 0.5-mm pitch, –40°C to +85°C (D-version) |
| Connectivity | Ethernet MAC (10/100 Mbps), 3× CAN (ISO11898-1), SDHI (25 MB/s), QSPI, 3× I²C (1 Mbps), 13× SCI, USB 2.0 FS host/function |
| Analog & Timing | Two 12-bit ADCs (8 + 21 ch), 2× 12-bit DACs, RTC with battery backup, IWDT (120-kHz clock), 29 timers including GPTW/MTU3/TPU |
| Graphics & Media | GLCDC (3-plane overlay), DRW2D (vector/bit-blit), PDC (CMOS camera interface), SSIE (2-channel audio) |
Pinout & Package
Package: PLQP0176KB-C - 176-pin Low-profile Quad Flat Package, 24 × 24 mm body, 0.5-mm lead pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core/analog domain supplies (2.7–3.6 V); separate AVCC pins ensure clean analog reference for ADC/DAC |
| RES#, RESET | Reset input | Active-low asynchronous reset; supports POR, LVD, and software-initiated reset sequences |
| XTAL, EXTAL | External crystal oscillator | Supports 8–24 MHz crystal for main clock; enables high-accuracy timing and PLL reference |
| ETH_MDC, ETH_MDIO, ETH_TXD[3:0], ETH_RXD[3:0] | Ethernet PHY interface | MII/RMII-compliant signals; enables direct connection to external PHY without glue logic |
| CAN0_TX, CAN0_RX, CAN1_TX, CAN1_RX, CAN2_TX, CAN2_RX | CAN transceiver interfaces | Dedicated differential pairs per channel; supports ISO11898-1 compliant bus termination and arbitration |
| SD0_CMD, SD0_CLK, SD0_DAT[3:0] | SD host interface | 4-bit SD bus signals; supports high-speed mode (25 MB/s) and SDIO card detection/write protection |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank code flash | Enables seamless firmware updates via background programming and startup bank switching-no system interruption required |
| ECC-protected SRAM | 32-KB RAM with SEC-DED error correction ensures reliable operation in industrial environments with radiation or voltage noise |
| Integrated GLCDC + DRW2D | Hardware-accelerated 2D graphics rendering and LCD controller eliminate need for external GPU or display processor |
| IEC60730 safety functions | Oscillation-stop detection, CRC-A, IWDT, self-diagnostic A/D, and register write protection meet Class B compliance requirements |
| Event Link Controller (ELC) | 123 internal event signals routed without CPU intervention-reduces latency and ISR overhead in time-critical control loops |
Applications
| Industrial HMI Gateway | Networked PLC Controller |
|---|---|
|
Use Scenario: Embedded HMI panel connecting to Modbus TCP field devices while driving a 480×272 TFT-LCD with touch overlay. IC Role / Device Role / Timing Role: Central application processor executing RTOS, managing Ethernet/CAN bridging, rendering UI via GLCDC+DRW2D, and sampling analog sensors via S12AD. Use Value: Single-chip integration eliminates external graphics controller and PHY, reducing BOM cost and PCB area by >35% versus multi-chip solutions. |
Use Scenario: Compact programmable logic controller with EtherNet/IP connectivity, local I/O expansion, and web-based configuration interface. IC Role / Device Role / Timing Role: Real-time control engine running cyclic tasks at 1-ms intervals, handling EtherNet/IP CIP messaging, and managing SDHI-stored ladder logic programs. Use Value: Dual-bank flash allows safe firmware update during runtime; ECC RAM prevents silent data corruption in long-duration control cycles. |
| Smart Energy Meter Hub | Factory Automation Gateway |
|
Use Scenario: Multi-protocol energy concentrator aggregating data from RS485-connected meters (DLMS/COSEM), LoRaWAN uplinks, and local CAN bus submeters. IC Role / Device Role / Timing Role: Protocol translation hub using multiple SCI channels, CAN peripherals, and AES encryption (TSIP) for secure data signing before transmission. Use Value: On-chip TSIP accelerates AES-128/192/256 operations by 10× vs. software-only implementation-enabling real-time encrypted telemetry. |
Use Scenario: Edge gateway linking legacy PROFIBUS DP slaves to modern OPC UA over TSN networks in automotive assembly lines. IC Role / Device Role / Timing Role: Deterministic bridge processor synchronizing PROFIBUS cycle times (≤10 ms) with TSN time-aware shapers using ELC-triggered timer events. Use Value: ELC eliminates CPU polling for peripheral synchronization, cutting jitter to <1 µs and enabling sub-10-ms deterministic response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566NNDHFB#10 | Same RX66N core, identical peripherals, but in PLQP0144KA-B (144-pin LQFP, 20 × 20 mm); 2-MB flash instead of 4-MB | Suitable for space-constrained designs where 2-MB flash suffices and smaller footprint is prioritized | Select when board layout requires reduced package size and firmware image fits within 2-MB limit |
| R5F566TNDHFB#10 | Same package and flash size, but G-version (–40°C to +105°C operating range); otherwise functionally identical | Required for under-hood automotive or high-temperature industrial enclosures exceeding 85°C ambient | Choose only when extended temperature rating is mandatory-no other functional trade-offs |
Compared with R5F566NNDDFB#10, the R5F566NNDHFB#10 reduces flash capacity and package size for compact cost-sensitive designs, while the R5F566TNDHFB#10 maintains full feature parity but extends thermal operation to +105°C-making it the sole drop-in replacement for high-temperature deployment.
Availability
R5F566NNDDFB#10 is available at Aetrix Electronics and suitable for industrial HMI, networked PLC controllers, smart energy meter hubs, and factory automation gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F566NNDDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX66N Group is designed for high-performance, safety-aware industrial edge devices-integrating real-time control, rich connectivity, graphics acceleration, and functional safety features into a single MCU platform.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F566NNDDFB#10?
The R5F566NNDDFB#10 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark in benchmark testing. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 4-MB code flash and 1-MB SRAM-enabling deterministic real-time execution in demanding industrial applications.
Does the R5F566NNDDFB#10 support functional safety standards like IEC60730?
Yes, the R5F566NNDDFB#10 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stoppage detection, CRC-A accelerator, independent watchdog timer (IWDTa), self-diagnostic A/D converter, and register write protection. These are documented in Renesas Application Note R01AN4223JJ0100 and validated in the RX66N Safety Manual.
What package type and pin count does the R5F566NNDDFB#10 use?
The R5F566NNDDFB#10 uses the PLQP0176KB-C package: a 176-pin LQFP with 24 × 24 mm body size, 0.5-mm lead pitch, and exposed thermal pad. This package supports the full I/O count (136 general-purpose pins) and thermal dissipation needed for sustained 120-MHz operation in industrial environments.
Can the R5F566NNDDFB#10 execute firmware updates without interrupting real-time operation?
Yes, the R5F566NNDDFB#10 supports background programming (BGO) and dual-bank flash architecture. Firmware updates can be written to the inactive bank while the active bank continues executing code-enabling zero-downtime field upgrades. Bank switching occurs atomically at reset or via software trigger, preserving system continuity.
What graphics capabilities does the R5F566NNDDFB#10 provide for HMI applications?
The R5F566NNDDFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) with vector drawing, bit blitting, and texture mapping. Together, they enable smooth 480×272@60 Hz UI rendering without external GPU-reducing latency and system complexity in industrial HMI designs.
R5F566NNDDFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX66N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F566NNDDFB#10 FAQ
1.How can I place an order for R5F566NNDDFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F566NNDDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F566NNDDFB#10 reliable?
The price and inventory of R5F566NNDDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F566NNDDFB#10 is usually 5 days.
3.What payment methods are accepted for R5F566NNDDFB#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F566NNDDFB#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F566NNDDFB#10?
R5F566NNDDFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F566NNDDFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F566NNDDFB#10?
For technical support, including R5F566NNDDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F566NNDDFB#10 requirements.
6.How does Aetrix verify that R5F566NNDDFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F566NNDDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F566NNDDFB#10 meets industry standards.
7.What is the process for return or replacement of R5F566NNDDFB#10?
All R5F566NNDDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F566NNDDFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F566NNDDFB#10 part is unused and in its original packaging.
Return procedure for R5F566NNDDFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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