Renesas R5F566NNHDBD#20

Overview

R5F566NNHDBD#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 4 MB on-chip code flash with dual-bank support, 1 MB SRAM (including 32 KB ECC RAM), and integrated Ethernet MAC, CAN, SDHI, QSPI, and GLCDC for industrial HMI and networked embedded control applications.

For engineers reviewing the R5F566NNHDBD#20 datasheet, R5F566NNHDBD#20 pinout, R5F566NNHDBD#20 application, or R5F566NNHDBD#20 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +85°C temperature grade, 120-MHz real-time performance with 698 CoreMark, and hardware-accelerated graphics (DRW2D) and secure boot (TSIP) capabilities.

Technical Context

The R5F566NNHDBD#20 implements the RXv3 CPU core with 16×32-bit general-purpose registers, double-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. It supports little-endian or big-endian data arrangement and executes instructions in single-cycle timing at 120 MHz.

Its clock system integrates dual PLLs, selectable HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, enabling independent domain clocks: ICLK (120 MHz), PCLKA (120 MHz for ETHERC/GLCDC), PCLKB (60 MHz for timers/A/D), and BCLK (80 MHz external bus). The MPU enforces memory protection across 4 GB linear address space.

Key Specifications

Pinout & Package

Package: PLQP0176KB-C - 176-pin Low-Profile Quad Flat Package (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F566NNHDBD#20, the R5F566NNDDBD#20 reduces flash capacity and removes TSIP for lower cost, while the R5F566TNDDBD#20 trades graphics/Ethernet for extended temperature and retained security-enabling thermal-hardened control without display overhead.

Availability

R5F566NNHDBD#20 is available at Aetrix Electronics and suitable for industrial HMI panels, networked PLC controllers, smart energy gateways, and medical diagnostic device interfaces requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F566NNHDBD#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX66N Group is designed for high-performance, secure, and graphics-rich industrial applications-integrating real-time control, connectivity, human-machine interaction, and functional safety features in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NNHDBD#20?

The R5F566NNHDBD#20 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark in benchmark testing. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose 32-bit registers, and optimized pipeline-enabling deterministic real-time response in industrial control loops and HMI rendering tasks. The R5F566NNHDBD#20 sustains this speed across its full 4 MB flash and 1 MB SRAM without wait states.

Does the R5F566NNHDBD#20 support secure boot and cryptographic acceleration?

Yes, the R5F566NNHDBD#20 includes Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption and authenticated decryption of firmware images. TSIP provides tamper-resistant key storage and hardware-accelerated cryptographic operations-critical for secure boot, firmware updates, and data confidentiality in medical and industrial applications. The R5F566NNHDBD#20 leverages TSIP to enforce chain-of-trust without burdening the RXv3 core.

What graphics and display capabilities does the R5F566NNHDBD#20 offer?

The R5F566NNHDBD#20 integrates a Graphic-LCD Controller (GLCDC) supporting triple-plane overlay (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) for hardware-accelerated bit blitting, rotation, and vector drawing. It supports 32-/16-bpp graphics and CLUT formats, enabling high-fidelity UI rendering on TFT panels up to VGA resolution. These features eliminate CPU overhead in R5F566NNHDBD#20-based HMI designs.

How many CAN channels and mailboxes does the R5F566NNHDBD#20 provide?

The R5F566NNHDBD#20 integrates three independent CAN modules compliant with ISO 11898-1, each supporting 32 dedicated mailboxes for standard and extended frames. This enables concurrent handling of multiple CAN networks-e.g., one for sensor data, one for actuator commands, and one for diagnostics-without software arbitration. The R5F566NNHDBD#20's mailbox architecture ensures deterministic message filtering and transmission scheduling.

What is the package type and temperature range of the R5F566NNHDBD#20?

The R5F566NNHDBD#20 uses the PLQP0176KB-C package: a 176-pin LFBGA with 24 mm × 24 mm footprint and 0.5 mm pitch. It is rated for the industrial D-version temperature range of –40°C to +85°C. This package supports high-density PCB layouts and thermal dissipation requirements typical of fanless industrial controllers. The R5F566NNHDBD#20's pinout and thermal profile are validated for continuous operation within this range under specified voltage and load conditions.