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Renesas R5F566NNHDFP#30

Part No.:
R5F566NNHDFP#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F566NNHDFP#30.pdf
Description:
IC MCU 32BIT 4MB FLASH 100LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:196

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Product details

Overview

R5F566NNHDFP#30 from Renesas is a 120 MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), and integrated Ethernet MAC, CAN, SDHI, QSPI, and GLCDC. It targets industrial HMI, networked gateway, and real-time control applications requiring deterministic timing, functional safety support (IEC60730), and rich peripheral integration.

For engineers reviewing the R5F566NNHDFP#30 datasheet, R5F566NNHDFP#30 pinout, R5F566NNHDFP#30 application, or R5F566NNHDFP#30 equivalent, key selection criteria include its 176-pin LFBGA package, dual-bank flash for safe firmware updates, 12-bit dual A/D converters (29 total channels), hardware-accelerated 2D graphics (DRW2D), and built-in TSIP encryption engine - all operating across –40°C to +105°C.

Technical Context

The R5F566NNHDFP#30 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, supporting little-endian or big-endian data arrangement and 113 instructions including DSP and floating-point operations. Its memory subsystem integrates 4 MB dual-bank code flash (8.3 ns access at 120 MHz), 512 KB main SRAM, 512 KB expansion SRAM, and 32 KB ECC RAM with SEC-DED error correction.

Peripheral architecture includes three independent CAN channels (ISO11898-1 compliant, 32 mailboxes each), an Ethernet controller (10/100 Mbps MII/RMII), SD host interface (25 MB/s high-speed mode), and parallel data capture unit (PDC) - all coordinated via Event Link Controller (ELC) for CPU-offload event chaining without software intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max, 698 CoreMark, double-precision FPU (IEEE-754)
Memory 4 MB code flash (dual-bank), 1 MB SRAM (512 KB + 512 KB), 32 KB ECC RAM (SEC-DED)
Analog Peripherals Two 12-bit A/D units (8 + 21 channels), two 12-bit D/A channels, on-die temperature sensor
Communication Ethernet MAC (10/100 Mbps), 3× CAN, 13× SCI, 3× I²C, 3× RSPI, 1× QSPI, 1× SDHI, 1× USB 2.0 FS
Graphics & Timing GLCDC + DRW2D 2D engine, RTC with battery backup, 29 timers including GPTW, MTU3a, TPUa
Security & Safety TSIP encryption IP (AES-128/192/256), IEC60730 self-test functions, MPU, register write protection
Package & Temp LFBGA-176 (13 × 13 mm, 0.8 mm pitch), –40°C to +105°C (G-version)

Pinout & Package

Package: PLBG0176GA-A, 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VCC / AVCC0 / AVCC1 Core & analog power supply 2.7–3.6 V operation; separate analog domains enable noise-sensitive ADC/DAC stability
VBATT Battery backup supply Enables RTC operation during main power loss; supports coin-cell or supercap backup
XTAL / EXTAL Main crystal oscillator input/output Supports 8–24 MHz external crystal for precise system clock generation
RES# Active-low reset input Hardware reset assertion; synchronous release ensures deterministic initialization state
IRQ0–IRQ15 External interrupt inputs 16 dedicated edge-sensitive pins for fast asynchronous event handling without polling
MD0–MD3 Mode configuration pins Determine boot source (SCI/USB/FINE) and operating mode at power-on reset

Key Features

Feature Design Value
Dual-bank flash architecture Enables background programming and safe firmware update without halting execution or losing real-time responsiveness
Event Link Controller (ELC) Hardware interconnect for 123 internal events; eliminates CPU overhead in timer-triggered ADC sampling or PWM synchronization
Trusted Secure IP (TSIP) On-die AES accelerator with key wrapping and secure boot support - no external crypto IC required for basic firmware authentication
GLCDC + DRW2D graphics pipeline Direct frame buffer management and hardware-accelerated 2D rendering (blit, rotate, fill) reduce CPU load in GUI-driven HMIs
IEC60730 compliance features Integrated oscillation-stop detection, CRC accelerators, IWDT windowing, and A/D self-diagnostic - reduces external safety component count

Applications

Industrial HMI Gateway Smart Building Controller

Use Scenario: Centralized building automation panel with touch LCD, Ethernet backhaul, and local CAN bus to HVAC/sensor nodes.

IC Role / Device Role / Timing Role: Main application processor running RTOS, managing GLCDC-driven UI, synchronizing CAN message scheduling via ELC, and servicing SDHI for firmware logging.

Use Value: Dual-bank flash enables over-the-air updates without service interruption; DRW2D renders smooth animations at <1% CPU load.

Use Scenario: DIN-rail mounted controller aggregating Modbus RTU field devices via RSPI/SCI and forwarding to cloud via Ethernet.

IC Role / Device Role / Timing Role: Protocol translation hub with deterministic CAN/Modbus timing, hardware CRC offload, and TSIP-secured TLS handshake acceleration.

Use Value: Integrated Ethernet MAC + PHY interface eliminates external PHY BOM; 32 KB ECC RAM protects critical control state against bit flips.

Networked Motor Drive Medical Diagnostic Interface

Use Scenario: Brushless motor drive with real-time current sensing, field-oriented control, and EtherCAT slave interface.

IC Role / Device Role / Timing Role: Real-time motion controller using GPTW for synchronized PWM generation, S12AD for 29-channel analog acquisition, and ELC for trigger chaining.

Use Value: 120 MHz CPU + hardware FPU delivers sub-1 µs current loop execution; MTU3a complementary PWM outputs drive 3-phase inverters with programmable dead time.

Use Scenario: Portable ultrasound front-end with CMOS image sensor interface, real-time beamforming, and encrypted patient data storage.

IC Role / Device Role / Timing Role: Sensor interface processor handling PDC-based camera capture, DRW2D-assisted waveform overlay, and TSIP-encrypted SDHI writes.

Use Value: Parallel Data Capture Unit acquires full-frame sensor data at up to 60 fps; on-chip AES-256 secures PHI before SD card write.

Equivalent & Alternatives

The following parts are listed as comparable options for similar MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F566NNDHFP#30 Same RX66N family, identical 176-pin LFBGA package, but 2 MB code flash (vs. 4 MB) and 512 KB SRAM (vs. 1 MB) Suitable for cost-sensitive designs where firmware size < 2 MB and RAM footprint ≤ 512 KB Select when application firmware fits within 2 MB and ECC RAM requirement is ≤ 16 KB
R5F566TNDHFP#30 Same package and memory size, but lacks Ethernet MAC, GLCDC, DRW2D, and SDHI peripherals Targeted at non-networked, non-graphical embedded control with focus on CAN/USB/ADC performance Choose when Ethernet, graphics, and SDIO are unnecessary - reduces BOM cost and simplifies layout

Compared with R5F566NNHDFP#30, R5F566NNDHFP#30 trades flash/SRAM capacity for lower unit cost while retaining identical peripheral set and timing; R5F566TNDHFP#30 removes high-integration features (Ethernet, GLCDC, SDHI) to serve leaner real-time control roles - both require firmware and layout validation due to non-pin-compatible memory/peripheral configurations.

Availability

R5F566NNHDFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart building controllers, networked motor drives, and medical diagnostic interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F566NNHDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX66N Group is designed for high-performance, safety-aware industrial applications demanding real-time determinism, rich connectivity (Ethernet/CAN/USB), and integrated graphics - targeting HMI, gateway, and control systems with IEC60730 compliance needs.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NNHDFP#30?

The R5F566NNHDFP#30 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under benchmark conditions. This performance stems from its RXv3 CPU core with dual-issue capability, on-chip 32-bit multiplier/divider, and optimized instruction pipeline - enabling deterministic real-time response in industrial control loops and protocol stacks.

Does the R5F566NNHDFP#30 support dual-bank flash for safe firmware updates?

Yes, the R5F566NNHDFP#30 includes a dual-bank code flash architecture that allows background programming and bank swapping during runtime. This enables seamless firmware updates without halting application execution - critical for uptime-sensitive systems like building controllers or medical devices where reboot-induced downtime is unacceptable.

What graphics capabilities does the R5F566NNHDFP#30 provide for HMI applications?

The R5F566NNHDFP#30 integrates a Graphic-LCD Controller (GLCDC) and 2D Drawing Engine (DRW2D) supporting 32-/16-bpp graphics, CLUT formats, and hardware-accelerated operations including bit blitting, rotation, and fill. These features reduce CPU load in GUI rendering - for example, DRW2D can overlay waveforms on live sensor data with <1% CPU utilization.

How many CAN channels and mailboxes does the R5F566NNHDFP#30 support?

The R5F566NNHDFP#30 integrates three independent CAN modules compliant with ISO11898-1, each supporting 32 dedicated mailboxes for standard and extended frames. This enables concurrent handling of multiple CAN networks - such as separate buses for motor control, diagnostics, and sensor aggregation - without software arbitration overhead.

What security features are included in the R5F566NNHDFP#30 for firmware protection?

The R5F566NNHDFP#30 includes Trusted Secure IP (TSIP) with AES-128/192/256 encryption, secure boot verification, and key wrapping. It also provides memory protection unit (MPU), register write protection, and IEC60730 self-test functions - collectively enabling secure firmware authentication, tamper-resistant storage, and runtime integrity monitoring without external security ICs.

R5F566NNHDFP#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX66N
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F566NNHDFP#30 FAQ

1.How can I place an order for R5F566NNHDFP#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F566NNHDFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F566NNHDFP#30 reliable?

The price and inventory of R5F566NNHDFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F566NNHDFP#30 is usually 5 days.

3.What payment methods are accepted for R5F566NNHDFP#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F566NNHDFP#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F566NNHDFP#30?

R5F566NNHDFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F566NNHDFP#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F566NNHDFP#30?

For technical support, including R5F566NNHDFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F566NNHDFP#30 requirements.

6.How does Aetrix verify that R5F566NNHDFP#30 is sourced from the original manufacturer or authorized distributors?

All R5F566NNHDFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F566NNHDFP#30 meets industry standards.

7.What is the process for return or replacement of R5F566NNHDFP#30?

All R5F566NNHDFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F566NNHDFP#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F566NNHDFP#30 part is unused and in its original packaging.

Return procedure for R5F566NNHDFP#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F566NNHDFP#30 Tags

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