My Inquiry
My Account
Renesas R5F566TEBDFP#10
- Part No.:
- R5F566TEBDFP#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F566TEBDFP#10.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 100LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:657
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F566TEBDFP#10 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2 Mbytes of on-chip code flash memory, 1 Mbyte of SRAM (including 32 Kbytes with SEC-DED ECC), and integrated Ethernet MAC, CAN, SDHI, QSPI, and GLCDC. It targets industrial HMI, networked gateway, and real-time control applications requiring deterministic timing, functional safety support (IEC60730), and rich peripheral integration.
For engineers reviewing the R5F566TEBDFP#10 datasheet, R5F566TEBDFP#10 pinout, R5F566TEBDFP#10 application, or R5F566TEBDFP#10 equivalent, this MCU delivers verified dual-bank flash for safe firmware updates, hardware-accelerated 2D graphics rendering via DRW2D, and real-time clock with battery-backed operation - all in a 176-pin LFBGA package with 5-V-tolerant I/Os and four low-power modes.
Technical Context
The R5F566TEBDFP#10 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and double-precision FPU supporting 64-bit IEEE-754 operations. Its memory subsystem includes 2 Mbytes of code flash (8.3 ns access at 120 MHz), 32 Kbytes of reprogrammable data flash (100,000 erase cycles), and 1 Mbyte of zero-wait-state SRAM segmented into ECC-protected, standby, and expansion banks.
Peripheral architecture centers on parallel high-speed buses: PCLKA (up to 120 MHz) drives ETHERC, GLCDC, and DRW2D; PCLKB (up to 60 MHz) serves TPUa, MTU3a, and S12AD; and BCLK supports external bus interface up to 80 MHz. Clock generation integrates PLL, HOCO/LOCO oscillators, and independent IWDT-dedicated 120-kHz oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 698 CoreMark, double-precision FPU, MPU support |
| Memory | 2 Mbytes code flash (dual-bank), 32 Kbytes data flash, 1 Mbyte SRAM (512 KB + 512 KB expansion), 32 KB ECC RAM, 8 KB standby RAM |
| Peripherals | Ethernet MAC (10/100 Mbps), 3× CAN (ISO11898-1), SDHI (25 MB/s), QSPI, 3× RIIC (1 Mbps), 13× SCI, GLCDC + DRW2D, PDC, 2× 12-bit ADC (29 ch total), 2× 12-bit DAC |
| Timers | 4× GPTW (32-bit), 6× TPUa (16-bit), 9× MTU3a (16/32-bit), 4× TMR (8-bit), 4× CMT/CMTW (16/32-bit), RTC with time capture, IWDT & WDTA |
| Package & I/O | LFBGA-176 (PLQP0176KB-C, 24 × 24 mm, 0.5-mm pitch), 136 GPIOs, 19× 5-V tolerant pins, open-drain, pull-up, switchable drive strength |
| Power & Temp | 2.7–3.6 V supply, –40°C to +85°C (D-version), four low-power modes, VBATT-supported RTC backup |
Pinout & Package
Package: PLQP0176KB-C - 176-pin Low-Profile Fine-Pitch Ball Grid Array (24 × 24 mm, 0.5-mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Core & analog power supply | 2.7–3.6 V main supply; separate analog domains enable noise-isolated ADC operation |
| VBATT | Battery backup input | Supplies RTC during main power loss; enables calendar/timekeeping in deep software standby |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external resonator; required for precise timing and Ethernet PHY synchronization |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3u-compliant MDIO bus for configuring external Ethernet PHY (e.g., LAN8742A) |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet physical layer I/O | 4-bit transmit/receive data lanes for MII mode; RMII uses reduced 2-bit path (TXD0/1, RXD0/1) |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting SD memory and SDIO cards per Physical Layer Spec v3.01 |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables background programming and seamless bank switching for OTA firmware updates without runtime interruption |
| Hardware 2D graphics engine (DRW2D) | Accelerates bit-blitting, rotation, and vector drawing - reduces CPU load for GUI rendering in HMI applications |
| Integrated GLCDC | Drives RGB/TTL LCD panels up to WXGA resolution with triple-plane overlay (background + 2 graphics layers) |
| IEC60730 safety functions | Includes oscillation-stop detection, CRC-A, self-diagnostic A/D, register write protection, and IWDT windowing |
| Event Link Controller (ELC) | Routes 123 internal event signals (e.g., timer compare match, ADC EOC) directly to peripherals without CPU intervention |
Applications
| Industrial HMI Gateway | Smart Building Controller |
|---|---|
|
Use Scenario: Central controller aggregating Modbus RTU field devices, displaying status on 7-inch RGB LCD, and uploading diagnostics via Ethernet. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving GLCDC+DRW2D for UI, managing SDHI for log storage, and running ETHERC+TCP/IP stack. Use Value: Dual-bank flash allows secure firmware updates over Ethernet while maintaining UI responsiveness; 136 GPIOs support direct sensor/actuator interfacing. |
Use Scenario: HVAC zone controller with temperature/humidity sensing, CAN-connected damper actuators, and remote monitoring via SD card logging and Ethernet. IC Role / Device Role / Timing Role: Real-time control unit running deterministic PID loops, synchronizing CAN messaging, and timestamping sensor data using battery-backed RTC. Use Value: Integrated 3× CAN channels eliminate external transceivers; 2× 12-bit ADCs with disconnection detection ensure reliable analog input monitoring. |
| Networked PLC Edge Node | Medical Data Logger |
|
Use Scenario: DIN-rail-mounted edge node collecting I/O from discrete sensors, executing ladder logic, and forwarding alarms via SNMP over 100-Mbps Ethernet. IC Role / Device Role / Timing Role: Deterministic real-time controller with MTU3a timers for PWM motor control, GPTW for encoder input capture, and ETHERC for industrial protocol stacks. Use Value: PCLKA-synchronized peripherals guarantee sub-microsecond timer jitter; ECC RAM protects control state integrity against SEU. |
Use Scenario: Portable patient monitor recording ECG, SpO₂, and temperature, storing encrypted waveforms on SD card, and transmitting summaries via USB host to PC. IC Role / Device Role / Timing Role: Safety-certified data acquisition hub with IEC60730-compliant self-tests, AES-128 encryption for PHI, and USB 2.0 FS host for secure data export. Use Value: TSIP optional module provides hardware-accelerated AES and secure key storage; 12-bit ADCs achieve <1 LSB INL for clinical-grade signal fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP#10 | Same RX66N core, identical pinout, but 4 Mbytes flash (vs. 2 Mbytes) and 1.5 Mbytes SRAM (vs. 1 Mbyte) | Preferred for applications requiring larger firmware image size or extended buffer space (e.g., multi-protocol gateways) | Select when additional flash/SRAM headroom is needed; no PCB change required |
| R5F565NEHDFP#30 | RX65N-series predecessor: 100 MHz max, no DRW2D/GLCDC, 1.5 Mbytes flash, 512 KB SRAM, same 176-pin LFBGA | Suitable for cost-sensitive designs where graphics acceleration and Ethernet PHY interface are not required | Choose for legacy migration paths or simpler HMI needs; shares footprint but lacks advanced peripherals |
Compared with R5F566TEBDFP#10, R5F566TEADFP#10 offers higher memory density for complex firmware, while R5F565NEHDFP#30 trades graphics/Ethernet capability for lower cost and proven maturity - both retain pin compatibility but differ in safety features, clock speed, and peripheral set.
Availability
R5F566TEBDFP#10 is available at Aetrix Electronics and suitable for industrial HMI, smart building controllers, networked PLC edge nodes, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F566TEBDFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX66N Group, including R5F566TEBDFP#10, was designed for high-performance industrial automation and human-machine interface applications demanding real-time determinism, functional safety compliance, and rich multimedia peripheral integration.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F566TEBDFP#10?
The R5F566TEBDFP#10 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state 1 Mbyte SRAM - enabling real-time execution of complex control algorithms and communication stacks without throttling.
Does the R5F566TEBDFP#10 support dual-bank flash for safe firmware updates?
Yes, the R5F566TEBDFP#10 supports dual-bank flash architecture, allowing background programming of one bank while executing code from the other. This enables robust over-the-air (OTA) firmware updates without system interruption - a critical capability for industrial gateways and medical devices requiring continuous uptime and IEC60730 compliance.
What graphics capabilities does the R5F566TEBDFP#10 provide for HMI applications?
The R5F566TEBDFP#10 integrates both a Graphic-LCD Controller (GLCDC) supporting RGB/TTL panels up to WXGA resolution and a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated bit-blitting, rotation, and vector graphics. These peripherals offload GUI rendering from the CPU, reducing latency and power consumption in touch-enabled industrial HMIs.
How many CAN channels does the R5F566TEBDFP#10 include, and what standard do they meet?
The R5F566TEBDFP#10 includes three independent CAN modules, each compliant with ISO11898-1 (CAN 2.0A/B) and supporting both standard and extended frames. Each channel provides 32 mailboxes for flexible message filtering and prioritization - ideal for automotive body control, industrial fieldbus bridging, and distributed sensor networks.
What is the package type and pin count of the R5F566TEBDFP#10?
The R5F566TEBDFP#10 is housed in a PLQP0176KB-C package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 × 24 mm with 0.5-mm pitch. It provides 136 general-purpose I/O pins, 19 of which are 5-V tolerant, and supports full-speed external bus expansion up to 80 MHz - making it suitable for dense, high-I/O industrial designs.
R5F566TEBDFP#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX66T
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 73
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 22x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F566TEBDFP#10 FAQ
1.How can I place an order for R5F566TEBDFP#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F566TEBDFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F566TEBDFP#10 reliable?
The price and inventory of R5F566TEBDFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F566TEBDFP#10 is usually 5 days.
3.What payment methods are accepted for R5F566TEBDFP#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F566TEBDFP#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F566TEBDFP#10?
R5F566TEBDFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F566TEBDFP#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F566TEBDFP#10?
For technical support, including R5F566TEBDFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F566TEBDFP#10 requirements.
6.How does Aetrix verify that R5F566TEBDFP#10 is sourced from the original manufacturer or authorized distributors?
All R5F566TEBDFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F566TEBDFP#10 meets industry standards.
7.What is the process for return or replacement of R5F566TEBDFP#10?
All R5F566TEBDFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F566TEBDFP#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F566TEBDFP#10 part is unused and in its original packaging.
Return procedure for R5F566TEBDFP#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F566TEBDFP#10 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
