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Renesas R5F56719DDBP#20

Part No.:
R5F56719DDBP#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-TFBGA
Datasheet:
AetrixR5F56719DDBP#20.pdf
Description:
IC MCU 32BIT 1MB FLASH 64TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:445

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Product details

Overview

R5F56719DDBP#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719DDBP#20 datasheet, R5F56719DDBP#20 pinout, R5F56719DDBP#20 application, or R5F56719DDBP#20 equivalent, key selection criteria include its 144-pin LFQFP package, -40°C to +85°C temperature grade, TSIP-based AES256/SHA256 encryption, and hardware-accelerated QSPIX boot-from-serial-flash capability.

Technical Context

The R5F56719DDBP#20 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and QSPIX, and PCLKA/PCLKB up to 120 MHz/60 MHz respectively for peripherals including MTU3a timers and S12AD converters.

Its peripheral architecture includes EXDMACa (2-channel extended DMA), DTCb (1-channel data transfer controller), and ELC (event link controller) enabling zero-CPU-intervention signal chaining between RTC alarms, TPU capture events, and A/D conversion triggers - critical for deterministic real-time response in safety-compliant IEC60730 applications.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max frequency, 707 CoreMark score - enables high-throughput deterministic control loops without external co-processors.
Memory 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait at 120 MHz) - supports field firmware updates and real-time data logging.
Analog Peripherals Two 12-bit A/D units (8+12 channels), on-die temperature sensor (±1°C), CTSU capacitive touch (17 self-capacitance keys) - eliminates need for external ADCs or touch controllers in HMI designs.
Communication Interfaces CAN 2.0B (2 channels, 32 mailboxes), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX (quad-SPI boot), RIICHS (3.4 Mbps) - enables multi-protocol connectivity in edge gateways.
Security & Safety Trusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, TRNG, SHA256, and IEC60730 self-test functions - meets SIL2/Class B requirements for industrial firmware integrity.
Power & Timing 2.7–3.6 V supply, four low-power modes, RTC with battery backup, sub-clock oscillator (32.768 kHz), and IWDTa with windowed refresh - ensures reliable timekeeping and fail-safe reset in unattended deployments.

Pinout & Package

Package: PLQP0144KA-B, 144-pin LFQFP, 20 × 20 mm, 0.50-mm pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Core & analog power supply Separate 2.7–3.6 V domains enable noise isolation for ADC and RTC; AVCC1 powers S12AD unit 1 and CTSU.
VBATT Backup power input Supplies RTC, sub-clock oscillator, and backup registers during main power loss - enables uninterrupted timekeeping in smart meters.
XTAL/EXTAL Main crystal oscillator terminals Supports 8–24 MHz external crystals; paired with on-chip PLL to generate 120 MHz ICLK - provides stable timing for USB and CAN bus synchronization.
RES# Active-low reset input Asynchronous hardware reset; combined with internal POR and LVD circuits to ensure robust startup under brown-out conditions.
USB_DP/USB_DM USB 2.0 full-speed differential pair Integrated transceiver eliminates external PHY; supports host, device, and OTG roles - reduces BOM count in portable diagnostic tools.
SD0_CMD, SD0_CLK, SD0_DAT[0:3] SD host interface signals Direct 4-bit SDIO/SD memory interface compliant with SD Physical Layer Spec v3.01 - enables local firmware storage and data buffering without external NAND.

Key Features

Feature Design Value
Dual-bank flash with BGO Enables seamless firmware updates: new code writes to inactive bank while active bank executes - zero downtime in remote industrial nodes.
TSIP cryptographic engine Hardware-accelerated AES256, SHA256, and ECC key generation - reduces secure boot time by >90% vs. software-only implementations.
ELC event linking Chains RTC alarm → MTU3a PWM start → A/D trigger → DMACAb transfer without CPU intervention - achieves <1 µs latency in closed-loop motor control.
QSPIX serial flash interface Supports quad-SPI, dual-SPI, and extended SPI protocols with 32-bit addressing - allows direct XIP execution from cost-effective 128-Mbit serial NOR flash.
Capacitive touch CTSU Self-capacitance mode supports 17 independent keys with built-in noise rejection - eliminates external touch IC in appliance control panels.

Applications

Industrial HMI Panels Smart Energy Meters

Use Scenario: Touch-enabled front-panel interface for PLCs and motor drives with real-time status display and parameter configuration.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving LCD via RGB interface, scanning CTSU keys, and managing CAN/USB communication stacks.

Use Value: Integrated 2 MB flash stores GUI assets and firmware; TSIP secures OTA updates; 120 MHz CPU handles multitasking without performance throttling.

Use Scenario: Revenue-grade electricity meter with metrology SoC interface, tamper detection, and secure data logging to SD card.

IC Role / Device Role / Timing Role: System controller handling time-stamped energy accumulation, RTC-backed billing cycles, SDHI data archival, and encrypted communication with utility head-end.

Use Value: VBATT-backed RTC maintains accurate billing timestamps during mains failure; dual-bank flash enables certified firmware patches without meter replacement.

Building Automation Gateways Medical Diagnostic Devices

Use Scenario: Protocol translation hub connecting BACnet MS/TP field devices to cloud via Ethernet/Wi-Fi (via external MAC/PHY).

IC Role / Device Role / Timing Role: Central protocol stack executor with CAN, RS-485 (SCI), and USB interfaces; manages time-synchronized sensor polling via ELC-linked timers.

Use Value: 114 GPIOs support multiple isolated UARTs; QSPIX boots from compact serial flash; RIICHS interfaces with high-speed environmental sensors.

Use Scenario: Portable ultrasound or patient monitor with touchscreen UI, analog front-end interface, and HIPAA-compliant data export.

IC Role / Device Role / Timing Role: Secure application host running medical OS, performing AES-encrypted SDHI data export, and sampling temperature-corrected ADC data via S12AD unit 1.

Use Value: On-die temperature sensor calibrates ADC readings; TSIP meets IEC62443-3-3 Annex A security requirements; CTSU enables glove-compatible touch control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56718DDFP#30 Same RX671 Group, 100-pin TFLGA, 1.5 MB flash, 256 KB SRAM, no SDHI or QSPIX Lacks SD host and quad-SPI interfaces; suitable for CAN/USB-only edge nodes with space-constrained layouts Select when SD/QSPIX boot is unnecessary and PCB area must be minimized using 7×7 mm TFLGA.
R5F566TEADFP#30 RX66T Group, 100-pin TFLGA, 120 MHz, 1 MB flash, 192 KB SRAM, no TSIP or CTSU Optimized for motor control (32-bit MTU3 timers, encoder interfaces); lacks crypto and touch but adds higher PWM resolution Prefer for servo drives requiring 3-phase complementary PWM with dead-time compensation, where security and HMI are secondary.

Compared with R5F56719DDBP#20, the R5F56718DDFP#30 reduces footprint and cost by removing SDHI/QSPIX but sacrifices local firmware storage and serial flash boot; the R5F566TEADFP#30 trades TSIP and CTSU for enhanced motor-control peripherals, making it unsuitable for secure HMI applications but superior for real-time motion control.

Availability

R5F56719DDBP#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, building automation gateways, and medical diagnostic devices requiring stable component supply across long production lifecycles.

Supply support for R5F56719DDBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-reliability industrial applications demanding real-time performance, functional safety, and secure firmware execution - with R5F56719DDBP#20 optimized for systems integrating human-machine interaction, connectivity, and local data processing.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DDBP#20?

The R5F56719DDBP#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's dual-issue pipeline, collective register bank save, and zero-wait-state access to 384 KB SRAM - enabling deterministic execution of complex control algorithms in real-time industrial applications. The R5F56719DDBP#20 delivers this throughput while maintaining low power consumption across four configurable low-power modes.

Does the R5F56719DDBP#20 support secure boot and firmware updates?

Yes, the R5F56719DDBP#20 supports secure boot and firmware updates via its Trusted Secure IP (TSIP) module, which provides hardware-accelerated AES128/192/256, SHA256, RSA, and ECC operations alongside a true random number generator. The dual-bank flash architecture allows background programming (BGO) of the inactive bank while the active bank runs - enabling atomic, fail-safe firmware updates without system interruption. This capability is integral to the R5F56719DDBP#20's compliance with IEC60730 Class B safety requirements.

What package type and pin count does the R5F56719DDBP#20 use?

The R5F56719DDBP#20 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.50-mm pin pitch, and RoHS-compliant lead-free finish. This LFQFP variant provides 113 general-purpose I/O pins with 5-V tolerance on 20 pins, open-drain capability on all I/Os, and dedicated signals for USB, CAN, SDHI, and QSPIX - making it suitable for industrial PCBs requiring mechanical robustness and thermal reliability. The R5F56719DDBP#20's pinout is fully documented in Renesas' R01DS0373EJ0120 datasheet Section 5.

Can the R5F56719DDBP#20 interface directly with SD cards and serial NOR flash?

Yes, the R5F56719DDBP#20 integrates both an SD host interface (SDHI) supporting 1-/4-bit SD/SDIO buses at up to 25 MB/s and a Quad-SPI memory interface (QSPIX) compatible with extended SPI, dual-SPI, and quad-SPI protocols. The SDHI complies with SD Physical Layer Specification v3.01 and supports CRC7/CRC16 error checking, while QSPIX enables direct execution (XIP) from serial NOR flash using 32-bit addressing. These interfaces eliminate external controllers, reducing BOM cost and board area in the R5F56719DDBP#20-based designs.

What analog and human-interface peripherals are integrated into the R5F56719DDBP#20?

The R5F56719DDBP#20 integrates two 12-bit A/D converter units (S12ADFa) with 8+12 channels, an on-die temperature sensor (±1°C accuracy), and a capacitive touch sensing unit (CTSUa) supporting up to 17 self-capacitance keys. The A/D converters feature sample-and-hold, digital comparison, and self-diagnostic functions; the temperature sensor feeds into S12AD unit 1 for calibration; and CTSU includes built-in noise rejection for reliable touch detection in noisy industrial environments - all without requiring external components in the R5F56719DDBP#20 implementation.

R5F56719DDBP#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-TFBGA
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56719DDBP#20 FAQ

1.How can I place an order for R5F56719DDBP#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56719DDBP#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56719DDBP#20 reliable?

The price and inventory of R5F56719DDBP#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DDBP#20 is usually 5 days.

3.What payment methods are accepted for R5F56719DDBP#20?

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4.How is shipping managed for R5F56719DDBP#20?

R5F56719DDBP#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56719DDBP#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56719DDBP#20?

For technical support, including R5F56719DDBP#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DDBP#20 requirements.

6.How does Aetrix verify that R5F56719DDBP#20 is sourced from the original manufacturer or authorized distributors?

All R5F56719DDBP#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DDBP#20 meets industry standards.

7.What is the process for return or replacement of R5F56719DDBP#20?

All R5F56719DDBP#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DDBP#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56719DDBP#20 part is unused and in its original packaging.

Return procedure for R5F56719DDBP#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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