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Renesas R5F56719DDFB#30
- Part No.:
- R5F56719DDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56719DDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:180
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Product details
Overview
R5F56719DDFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and motor control systems requiring real-time performance and functional safety.
For engineers reviewing the R5F56719DDFB#30 datasheet, R5F56719DDFB#30 pinout, R5F56719DDFB#30 application, or R5F56719DDFB#30 equivalent, key selection considerations include its 144-pin LFQFP package (PLQP0144KA-B), IEC60730-compliant self-test features, TSIP-based AES256/SHA256 encryption, and 12-bit dual A/D converter with analog input disconnection detection.
Technical Context
The R5F56719DDFB#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, with independent domain clocks (ICLK up to 120 MHz, PCLKA/B up to 120/60 MHz) enabling precise peripheral timing.
It embeds three DMA controllers - DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel) - for concurrent high-throughput transfers across SRAM, flash, and peripherals like SDHI and QSPIX. The ELC (Event Link Controller) enables hardware-triggered timer, ADC, and PWM operations without CPU intervention, critical for deterministic real-time response.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max - delivers 707 CoreMark; supports double-precision FPU per IEEE-754 for precision math in motor control and sensor fusion. |
| Memory | 2 MB code flash (dual-bank, BGO capable), 8 KB data flash (100k write cycles), 384 KB SRAM (no-wait at 120 MHz), 4 KB standby RAM - enables secure firmware updates and deep-sleep data retention. |
| Peripherals | 2× CAN FD-capable channels (32 mailboxes each), 1× USB 2.0 FS host/function/OTG, 1× SDHI (25 MB/s), 1× QSPIX (quad-SPI fetch), 2× 12-bit S12AD (8+12 ch), CTSU (17-key self-cap) |
| Security & Safety | Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, and IEC60730 compliance features including CRC, IWDT, and A/D self-diagnostic. |
| Package & Temp | PLQP0144KA-B: 144-pin LFQFP, 20 × 20 mm, 0.50-mm pitch; industrial grade (–40°C to +85°C). |
| Power & Clock | Single 2.7–3.6 V supply; four low-power modes; backup domain powered via VBATT; main clock: 8–24 MHz crystal or internal PLL; sub-clock: 32.768 kHz crystal support. |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50 mm pitch, lead-free, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Core & analog power supply | Must be decoupled locally; AVCC0/AVCC1 power analog circuits including A/D and RTC; all require stable 2.7–3.6 V. |
| VBATT | Backup power input | Supplies RTC, backup registers, and sub-clock oscillator during main power loss - enables continuous timekeeping. |
| RES# | Active-low reset input | Drives internal POR/LVD reset; synchronous deassertion required for reliable startup; must be pulled high externally. |
| CLKIN / CLKOUT | Main clock oscillator terminals | Supports 8–24 MHz crystal or external clock; CLKOUT can buffer main clock for system synchronization. |
| EXCLK | External bus clock output | Provides BCLK signal for external memory interface - configurable up to 60 MHz for CS0–CS7 areas. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 FS physical interface | Integrated transceiver requires no external PHY; VBUS detection enables host/device role negotiation. |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | Support 1-/4-bit SD/SDIO buses per SD Spec 3.01; includes CRC7/CRC16 error checking and DMA-ready buffers. |
| QSPIX_IO0–3 / QSPIX_CLK / QSPIX_CS | Quad-SPI memory interface | Enables XIP (execute-in-place) from serial flash; supports extended/dual/quad protocols with 8–32-bit address width. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed - zero downtime in field upgrades. |
| IEC60730 Class B support | Includes oscillation-stop detection, CRC-A, IWDT with window function, A/D self-test, and register write protection - reduces certification effort for household appliances. |
| Capacitive touch sensing (CTSU) | Supports 17-key self-capacitance or 64-key mutual-capacitance matrix - eliminates mechanical buttons in HMI designs with noise-immune scanning. |
| Event Link Controller (ELC) | Hardware interconnects 99 internal events (e.g., TPU overflow → ADC trigger → DMA transfer) - removes CPU polling overhead and tightens timing jitter. |
| Trusted Secure IP (TSIP) | On-die cryptographic accelerator with AES256/SHA256/TRNG - secures firmware signing, OTA updates, and key storage without external security IC. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Touch-enabled display controller with real-time data logging, CAN bus communication to PLCs, and secure remote firmware updates over cellular modem. IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering, capacitive touch decoding, SDHI-based log storage, and TSIP-secured OTA update verification. Use Value: Dual-bank flash allows background update installation; CTSU provides robust touch response in noisy factory environments; CAN + USB enable dual-field service interfaces. | Use Scenario: DIN-rail mounted electricity meter with metrology IC interface, tamper detection, encrypted data upload, and RTC-backed billing cycle tracking. IC Role / Device Role / Timing Role: System controller managing metrology SPI reads, IEC60730 self-tests, AES-encrypted data packaging, and battery-backed RTC calendar functions. Use Value: Integrated TSIP accelerates SHA256 signature validation; backup domain preserves time/date during mains failure; A/D self-diagnostic meets utility anti-tampering requirements. |
| Brushless Motor Drive | Home Automation Gateway |
Use Scenario: 3-phase inverter controller with Hall/encoder feedback, current sensing, thermal monitoring, and CAN-based commissioning. IC Role / Device Role / Timing Role: Real-time motion controller executing FOC algorithms using RXv3 FPU, generating complementary PWM via MTU3a with dead-time compensation. Use Value: 120 MHz CPU + hardware ELC triggers ensure <1 µs PWM-to-ADC latency; temperature sensor + A/D disconnection detection prevent thermal runaway. | Use Scenario: Multi-protocol hub connecting Zigbee, BLE, and wired sensors to cloud via Ethernet/Wi-Fi, with local decision logic and secure device onboarding. IC Role / Device Role / Timing Role: Protocol translation engine interfacing RSPI/SCI peripherals, running TLS stack via TSIP, and managing SDHI-stored configuration profiles. Use Value: QSPIX enables fast boot from encrypted serial flash; RIICHS (3.4 Mbps) handles high-bandwidth sensor clusters; 114 GPIOs support flexible expansion headers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56709DDFB#30 | Same RX671 Group, 1 MB flash (vs. 2 MB), 256 KB SRAM (vs. 384 KB), identical peripherals and package - pin-compatible. | Suitable for cost-sensitive designs with smaller firmware footprint and reduced RAM needs; retains full IEC60730 and TSIP feature set. | Select when application firmware fits within 1 MB and runtime heap usage stays below 256 KB - avoids over-spec'ing memory. |
| R5F566TEBDFB#30 | RX66T Group part: 160 MHz CPU, 1 MB flash, 256 KB SRAM, optimized for motor control (3× MTU3, 3× encoder inputs), lacks SDHI, QSPIX, and TSIP. | Targeted at high-speed servo drives where PWM timing precision and encoder resolution outweigh connectivity/security needs. | Choose only for pure motor-control focus; not suitable as drop-in replacement due to missing SDHI, USB, and crypto engines. |
Compared with R5F56719DDFB#30, the R5F56709DDFB#30 offers identical peripheral integration and safety features at lower memory cost, while the R5F566TEBDFB#30 trades connectivity and security for higher PWM resolution and encoder bandwidth - making the R5F56719DDFB#30 optimal for connected, certified, and feature-rich edge devices.
Availability
R5F56719DDFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from Renesas-authorized channels.
Supply support for R5F56719DDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX671 Group - including R5F56719DDFB#30 - was designed for industrial edge devices demanding functional safety (IEC60730), secure connectivity (USB/SD/QSPIX), and human interface capabilities (CTSU, audio, graphics acceleration support).
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719DDFB#30?
The R5F56719DDFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's dual-issue pipeline, 16 general-purpose 32-bit registers, and optimized instruction set - enabling deterministic real-time execution in motor control and industrial automation applications where R5F56719DDFB#30 is deployed.
Does the R5F56719DDFB#30 support secure firmware updates and cryptographic operations?
Yes, the R5F56719DDFB#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA1/224/256, MD5, TRNG, and key protection mechanisms. It enables authenticated, encrypted firmware updates via its dual-bank flash - allowing background programming while executing from the active bank - a capability confirmed in the R01DS0373EJ0120 datasheet for R5F56719DDFB#30.
What package type and pin count does the R5F56719DDFB#30 use?
The R5F56719DDFB#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size and 0.50 mm pitch. This package is RoHS-compliant and supports 114 general-purpose I/O pins with 5-V tolerance on 20 pins, open-drain outputs, and programmable pull-up resistors - as specified for the R5F56719DDFB#30 in Renesas documentation.
Can the R5F56719DDFB#30 interface directly with SD cards and serial flash memory?
Yes, the R5F56719DDFB#30 includes a dedicated SD host interface (SDHI) supporting 1-/4-bit SD/SDIO buses at up to 25 MB/s, and a Quad-SPI memory interface (QSPIX) that supports extended, dual, and quad-SPI protocols for XIP from serial flash. Both interfaces are silicon-verified features of the R5F56719DDFB#30, enabling local storage and fast boot from external non-volatile memory.
What functional safety features does the R5F56719DDFB#30 provide for IEC60730 compliance?
The R5F56719DDFB#30 includes multiple IEC60730 Class B support features: oscillation-stoppage detection, CRC-A calculation unit, independent watchdog timer (IWDTa) with window function, self-diagnostic A/D converter test, and register write protection. These are documented in the R01DS0373EJ0120 datasheet as integral to the R5F56719DDFB#30's safety architecture - reducing external component count for household appliance certification.
R5F56719DDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 113
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719DDFB#30 FAQ
1.How can I place an order for R5F56719DDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719DDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719DDFB#30 reliable?
The price and inventory of R5F56719DDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56719DDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719DDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56719DDFB#30?
R5F56719DDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56719DDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56719DDFB#30?
For technical support, including R5F56719DDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DDFB#30 requirements.
6.How does Aetrix verify that R5F56719DDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56719DDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56719DDFB#30?
All R5F56719DDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719DDFB#30 part is unused and in its original packaging.
Return procedure for R5F56719DDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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