Renesas R5F56719DDFP#30

Overview

R5F56719DDFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and motor control systems requiring real-time performance and functional safety.

For engineers reviewing the R5F56719DDFP#30 datasheet, R5F56719DDFP#30 pinout, R5F56719DDFP#30 application, or R5F56719DDFP#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant self-test features (CRC, IWDTa, A/D self-diagnostic), TSIP-based AES256/SHA256 encryption, and RTC with battery-backed time capture - all verified in Rev.1.20 of R01DS0373EJ0120.

Technical Context

The R5F56719DDFP#30 implements the RXv3 CPU core with 113 instructions, including 21 double-precision floating-point operations and register bank save for deterministic interrupt latency. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals including S12AD units.

Peripheral integration follows a hierarchical event-driven architecture: the Event Link Controller (ELC) enables 99 internal signal interlinks without CPU intervention, while EXDMACa (2-channel), DMACAb (8-channel), and DTCb (1-channel) provide parallelized data movement across memory, flash, and peripherals - critical for deterministic USB/SDHI/SCI throughput in real-time embedded applications.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad. Pinout validated per Renesas R01DS0373EJ0120 Rev.1.20, Table 1.2 and Figure 1.1 (Pin Assignment).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719DDFP#30, the R5F56709DDFP#30 reduces memory and peripheral count for lower-cost deployments, while the R5F566TEADFP#30 trades security and HMI features for higher PWM resolution and CPU speed - making R5F56719DDFP#30 the balanced choice for connected, safety-certifiable, touch-enabled industrial controllers.

Availability

R5F56719DDFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and BLDC motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for IEC60730-certified designs.

Supply support for R5F56719DDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets - with over 40 years of embedded systems expertise.

The RX671 Group, including R5F56719DDFP#30, was designed for industrial automation and smart infrastructure applications demanding real-time determinism, functional safety, and hardware security - extending the RX family's legacy of high-performance, low-power 32-bit MCUs.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DDFP#30?

The R5F56719DDFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic execution in real-time control loops and protocol stacks.

Does the R5F56719DDFP#30 support IEC60730 Class B compliance out of the box?

Yes, the R5F56719DDFP#30 includes hardware features required for IEC60730 Class B: oscillation-stoppage detection, CRC-A accelerator, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter test voltages, and register write protection. These are documented in R01DS0373EJ0120 Rev.1.20 and require no external components to implement certified safety checks.

What package type and pin count does the R5F56719DDFP#30 use?

The R5F56719DDFP#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins, including 20 with 5-V tolerance, and integrates dedicated pins for USB, SDHI, CAN, and QSPIX - confirmed in the pin assignment table of R01DS0373EJ0120 Rev.1.20.

Can the R5F56719DDFP#30 execute code directly from external serial flash via QSPIX?

No, the R5F56719DDFP#30's QSPIX interface supports fetching *instructions* from external serial flash memory - enabling XIP (execute-in-place) operation. This capability is explicitly stated in the datasheet: "QSPIX supports fetching from serial flash memory" and is used for booting or expanding code space without loading into internal RAM first.

What security functions does the Trusted Secure IP (TSIP) block in the R5F56719DDFP#30 provide?

The TSIP block in the R5F56719DDFP#30 provides hardware-accelerated AES128/192/256, TDES, SHA1/224/256, MD5, GHASH, RSA/ECC key generation, and a true-random number generator (TRNG). It also prevents illicit key copying by isolating key storage from software access - enabling secure boot, encrypted firmware updates, and authenticated communication in edge devices.