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Renesas R5F56719DDNE#30

Part No.:
R5F56719DDNE#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-WFQFN Exposed Pad
Datasheet:
AetrixR5F56719DDNE#30.pdf
Description:
IC MCU 32BIT 1MB FLASH 48WFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:414

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Product details

Overview

R5F56719DDNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F56719DDNE#30 datasheet, R5F56719DDNE#30 pinout, R5F56719DDNE#30 application, or R5F56719DDNE#30 equivalent, this page delivers verified specifications, package mapping to PLQP0144KA-B (144-pin LQFP), functional pin assignments, IEC60730-compliant safety features, and two validated alternative MCUs for migration or sourcing flexibility.

Technical Context

The R5F56719DDNE#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision FPU supporting 21 floating-point instructions. It integrates a memory protection unit (MPU) with eight configurable regions and supports little- or big-endian data arrangement.

Its clock system combines external crystal (8–24 MHz), sub-clock (32.768 kHz), and internal oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocks: ICLK up to 120 MHz, PCLKA/PCLKB up to 120/60 MHz, and ADCLK up to 60 MHz - critical for deterministic timing across ADC, MTU3a, and USB modules.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max - enables 707 CoreMark performance and deterministic real-time task scheduling.
Flash Memory 2 MB code flash with dual-bank structure - allows seamless firmware updates without halting execution.
SRAM 384 KB on-chip SRAM (no wait states at 120 MHz) - supports large real-time buffers and RTOS heap allocation.
ADC Two 12-bit S12AD units (8 + 12 channels); 0.48 µs conversion time - meets fast-sampling requirements for motor control and sensor fusion.
Security Trusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, TRNG, and SHA256 - enables secure boot and encrypted OTA updates.
Package PLQP0144KA-B: 144-pin LQFP, 20 × 20 mm, 0.50-mm pitch - compatible with standard PCB assembly and thermal management for industrial ambient.
Operating Temp –40°C to +85°C (D-version) - qualified for extended industrial temperature environments without derating.

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50-mm lead pitch, exposed thermal pad, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Power supply inputs Separate analog/digital domains ensure noise isolation for 12-bit ADC and RTC accuracy.
VBATT Backup power input Enables RTC and backup registers to retain state during main power loss - critical for energy meter timestamping.
XTAL/EXTAL Main clock oscillator terminals Supports 8–24 MHz crystal for precise system timing; paired with PLL for stable 120 MHz ICLK generation.
RES# Active-low reset input Hardware reset initiation with debounced assertion; works with internal POR and LVD for robust startup sequencing.
USB_DP/USB_DM USB 2.0 Full-Speed differential pair Integrated transceiver eliminates external PHY - reduces BOM cost and board space for field service interfaces.
TXD0/RXD0 SCI channel 0 serial I/O Asynchronous UART interface for debug console or legacy device communication with programmable baud rate.
CTSU00–CTSU16 Capacitive touch sensing inputs 17 dedicated CTSU pins support self-capacitance up to 17 keys - enables robust front-panel HMI without external controllers.

Key Features

Feature Design Value
Dual-bank flash architecture Enables background programming while executing from alternate bank - essential for fail-safe firmware updates in certified industrial devices.
IEC60730 Class B compliance support Includes oscillation-stop detection, CRC-A, IWDTa with window function, and A/D self-diagnostic - reduces certification effort for home appliance and HVAC controllers.
QSPIX interface Supports quad-SPI, dual-SPI, and extended SPI protocols - accelerates boot time and enables direct XIP from external serial flash.
Event Link Controller (ELC) 99 internal event signals routed without CPU intervention - enables hardware-triggered ADC sampling, PWM updates, and GPIO toggling for deterministic latency.
MTU3a 3-phase PWM with dead-time control Complementary PWM outputs with automatic dead-time insertion and non-overlapping waveform generation - simplifies inverter gate driver design for motor drives.

Applications

Industrial HMI Panel Smart Energy Meter

Use Scenario: Touch-enabled display interface with real-time energy consumption visualization and tariff switching.

IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering, capacitive touch decoding, SD card logging, and secure communication via CAN/USB.

Use Value: Integrated CTSU, 384 KB SRAM, and TSIP eliminate external touch controller and crypto co-processor - reducing bill-of-materials and PCB area.

Use Scenario: DIN-rail mounted electricity meter with tamper detection, RTC-backed billing, and remote firmware update over PLC or RF gateway.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC interface, RTC with battery backup, secure bootloader, and SDHI-based log storage.

Use Value: Dual-bank flash and IEC60730 features enable certified over-the-air updates without service interruption - meeting IEC62056 and DLMS/COSEM requirements.

Programmable Logic Controller (PLC) I/O Module Home Automation Gateway

Use Scenario: Compact DIN-rail I/O module with analog/digital inputs, CAN bus connectivity, and local logic execution.

IC Role / Device Role / Timing Role: Real-time controller running ladder logic, sampling 12-bit ADCs at 2 kHz, and synchronizing CAN message transmission.

Use Value: 120 MHz RXv3 core with ELC-triggered ADC-to-CAN pipeline achieves sub-100 µs loop latency - meeting IEC61131-3 cycle time targets.

Use Scenario: Zigbee/Z-Wave gateway aggregating sensor data, running local automation rules, and interfacing with cloud via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Central hub MCU managing multiple serial protocols (SCI, RIIC, RSPId), USB host for dongle support, and secure TLS stack via TSIP acceleration.

Use Value: Integrated USB 2.0 FS host, 3-channel RIIC (3.4 Mbps), and AES256 offload reduce external IC count and improve end-to-end encryption throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56709DDNE#30 Same RX671 Group, 1 MB flash, 256 KB SRAM, identical peripherals and pinout - reduced memory footprint. Suitable for cost-sensitive designs where 2 MB flash and 384 KB SRAM are not required. Select when firmware size remains under 1 MB and RAM usage stays below 256 KB - maintains full software compatibility and PCB reuse.
R5F566TEADFP#30 RX66T Group, 160 MHz, 1 MB flash, 192 KB SRAM, optimized for motor control with 3-channel MTU3b and 3-phase PWM timers. Better suited for servo/inverter applications requiring higher PWM resolution and faster computation, but lacks SDHI, QSPIX, and CTSU. Choose for high-performance motor control where USB/SD/CTSU are unnecessary - requires PCB redesign due to different pinout and package (100-pin LQFP).

Compared with R5F56719DDNE#30, the R5F56709DDNE#30 offers identical peripheral integration and pin compatibility at lower memory density, while the R5F566TEADFP#30 trades SDHI, QSPIX, and capacitive touch for enhanced motor control peripherals and higher clock speed - making it unsuitable for HMI or metering but optimal for real-time drive systems.

Availability

R5F56719DDNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart energy metering, programmable logic controller I/O modules, and home automation gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719DDNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets - with over 40 years of embedded systems expertise.

The RX671 Group, including R5F56719DDNE#30, was designed for industrial and consumer applications demanding high computational performance, functional safety support (IEC60730), and rich connectivity - targeting HMI, metering, and gateway use cases.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DDNE#30?

The R5F56719DDNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark performance. This benchmark reflects its RXv3 CPU core efficiency, double-precision FPU utilization, and memory subsystem bandwidth - confirming suitability for real-time embedded applications requiring deterministic processing and floating-point math, such as motor control algorithms and digital signal processing within the R5F56719DDNE#30's integrated architecture.

Does the R5F56719DDNE#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719DDNE#30 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, RSA, ECC, SHA256, and a true random number generator (TRNG). These features enable secure boot verification, encrypted OTA firmware updates, and TLS handshake acceleration - all implemented without software overhead, ensuring robust security for industrial and smart metering deployments using the R5F56719DDNE#30.

What package type and pin count does the R5F56719DDNE#30 use?

The R5F56719DDNE#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm pitch and an exposed thermal pad. This package supports 113 general-purpose I/O pins with 5-V tolerance on 20 pins, open-drain capability, and pull-up resistors - enabling direct interfacing with industrial sensors, displays, and legacy peripherals in the R5F56719DDNE#30 design.

Can the R5F56719DDNE#30 operate in low-power modes while maintaining RTC and backup register functionality?

Yes, the R5F56719DDNE#30 supports four low-power modes, including deep software standby, where the RTC, sub-clock oscillator, and 4 KB standby RAM remain active when powered from the VBATT pin. This allows continuous timekeeping and state retention during main power loss - a critical requirement for energy meters and alarm systems built around the R5F56719DDNE#30, with battery backup sustaining operation for months.

Which communication interfaces are integrated into the R5F56719DDNE#30 for industrial connectivity?

The R5F56719DDNE#30 integrates CAN (2 channels, 32 mailboxes), USB 2.0 Full-Speed host/function/OTG, SD host interface (1 channel, 25 MB/s), QSPIX (1 channel, quad-SPI capable), three RIIC/RIICHS interfaces (up to 3.4 Mbps), and up to 13 SCI channels. These interfaces collectively support industrial fieldbus connectivity, removable media logging, secure firmware loading, and multi-protocol sensor aggregation - all natively supported by the R5F56719DDNE#30 without external level shifters or PHYs.

R5F56719DDNE#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-WFQFN Exposed Pad
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, UART/USART
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56719DDNE#30 FAQ

1.How can I place an order for R5F56719DDNE#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56719DDNE#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56719DDNE#30 reliable?

The price and inventory of R5F56719DDNE#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DDNE#30 is usually 5 days.

3.What payment methods are accepted for R5F56719DDNE#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719DDNE#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56719DDNE#30?

R5F56719DDNE#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56719DDNE#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56719DDNE#30?

For technical support, including R5F56719DDNE#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DDNE#30 requirements.

6.How does Aetrix verify that R5F56719DDNE#30 is sourced from the original manufacturer or authorized distributors?

All R5F56719DDNE#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DDNE#30 meets industry standards.

7.What is the process for return or replacement of R5F56719DDNE#30?

All R5F56719DDNE#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DDNE#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56719DDNE#30 part is unused and in its original packaging.

Return procedure for R5F56719DDNE#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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