Renesas R5F56719DGBP#20

Overview

R5F56719DGBP#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering applications requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719DGBP#20 datasheet, R5F56719DGBP#20 pinout, R5F56719DGBP#20 application, or R5F56719DGBP#20 equivalent, key selection criteria include its 144-pin LFQFP package (PLQP0144KA-B), -40°C to +85°C temperature grade (D-version), 12-bit dual A/D converter with self-diagnostic capability, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant safety features for Class B appliance control.

Technical Context

The R5F56719DGBP#20 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and double-precision FPU supporting 21 dedicated instructions. Its memory subsystem includes 2 MB code flash with zero-wait access ≤60 MHz and one-wait access at 120 MHz, plus 8 KB data flash rated for 100,000 erase/write cycles.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU/QSPIX), PCLKA (up to 120 MHz for MTU/RSPI/RIICHS), PCLKB (up to 60 MHz for most peripherals including TPU/CMT), and PCLKC/PCLKD (up to 60 MHz for S12AD units). The ELC enables hardware-triggered inter-module coordination without CPU intervention.

Key Specifications

Pinout & Package

PLQP0144KA-B is a 144-pin Low-profile Quad Flat Package with 0.50-mm pitch, 20 × 20 mm body size, and exposed thermal pad. Pin functions conform to RX671 Group standard mapping for 144-pin variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719DGBP#20, the R5F56718DGBP#20 offers identical peripheral integration and pin compatibility at lower memory capacity, while the R5F566TEADFP#30 trades security, storage interfaces, and HMI features for higher motor-control precision - making R5F56719DGBP#20 optimal for secure, feature-rich embedded applications demanding full connectivity and upgradeability.

Availability

R5F56719DGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and building automation nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719DGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for industrial and consumer applications requiring high performance, functional safety, and advanced human-machine interaction - emphasizing secure firmware execution, capacitive touch, and rich connectivity.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DGBP#20?

The R5F56719DGBP#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F56719DGBP#20 maintains deterministic real-time response even under heavy computational load, making it suitable for industrial control tasks requiring tight timing constraints.

Does the R5F56719DGBP#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56719DGBP#20 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true-random number generator. It enables secure boot, encrypted firmware updates, and runtime key protection. The R5F56719DGBP#20 uses hardware-accelerated crypto engines to offload processing from the CPU, ensuring minimal latency during secure communications or OTA updates without compromising real-time responsiveness.

What package type and pin count does the R5F56719DGBP#20 use?

The R5F56719DGBP#20 is housed in a PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 0.50-mm pitch and 20 × 20 mm body size. This package supports industrial temperature range (-40°C to +85°C), includes an exposed thermal pad for enhanced heat dissipation, and is compatible with standard reflow soldering processes. The R5F56719DGBP#20 pinout aligns with the RX671 Group's 144-pin variant specification, enabling drop-in replacement within the same family.

Can the R5F56719DGBP#20 execute code directly from external serial flash memory?

Yes, the R5F56719DGBP#20 includes a Quad-SPI memory interface (QSPIX) that supports direct code fetch from external serial flash using extended SPI, dual-SPI, and quad-SPI protocols. Address width is selectable (8/16/24/32 bits), and the interface operates synchronously with ICLK up to 120 MHz. This capability allows the R5F56719DGBP#20 to boot and run applications from external memory, expanding effective code space beyond its 2 MB on-chip flash.

Which communication interfaces are supported by the R5F56719DGBP#20 for industrial networking?

The R5F56719DGBP#20 supports CAN 2.0B (2 channels, 32 mailboxes each), USB 2.0 Full-Speed host/function/OTG, multiple SCI/RSPI/RIIC interfaces, and SD host interface - all suitable for industrial networking. Its CAN module complies with ISO11898-1, and RIICHS delivers up to 3.4 Mbps for high-speed sensor buses. These interfaces allow the R5F56719DGBP#20 to serve as a central node in distributed control systems, bridging fieldbus, wireless gateways, and local HMI without external protocol translators.