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Renesas R5F56719DGFB#30
- Part No.:
- R5F56719DGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56719DGFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:180
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Product details
Overview
R5F56719DGFB#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit. It supports USB 2.0 FS host/function/OTG, dual CAN 2.0B channels (32 mailboxes each), SD host interface (25 MB/s), QSPIX for serial flash fetching, and IEC60730-compliant safety features including TSIP encryption (AES128/192/256, ECC, TRNG) - deployed in industrial HMI, smart metering, and connected appliance control.
For engineers reviewing the R5F56719DGFB#30 datasheet, R5F56719DGFB#30 pinout, R5F56719DGFB#30 application, or R5F56719DGFB#30 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, 12-bit dual A/D converter (8+12 channels), RTC with battery backup, four low-power modes, and hardware-accelerated cryptographic engine supporting secure boot and firmware updates.
Technical Context
The R5F56719DGFB#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision FPU coprocessor (16×64-bit data registers). Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, enabling independent domain clocking: ICLK up to 120 MHz, PCLKA/PCLKB up to 120/60 MHz, and ADCLK up to 60 MHz per A/D unit.
Peripheral integration includes DMACAb (8-channel), EXDMACa (2-channel), DTCb (1-channel), ELC (99-event interlinking), and MTU3a (9-channel timer with complementary PWM and dead-time control). Memory subsystem comprises 2-MB code flash (1-wait at 120 MHz), 8-KB data flash (100k erase cycles), 384-KB SRAM (no wait states), and 4-KB standby RAM backed by VBATT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark, double-precision IEEE-754 FPU |
| Memory | 2-MB code flash (dual-bank, BGO support), 8-KB data flash (100k cycles), 384-KB SRAM (no wait), 4-KB standby RAM |
| Peripherals | Dual CAN 2.0B (32 mailboxes/channel), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX, 13× SCI, 3× RSPId, RIIC/RIICHS (3.4 Mbps) |
| A/D Converter | Two 12-bit units: S12ADFa unit 0 (8 ch), unit 1 (12 ch); 0.48 µs conversion time; self-diagnostic & disconnection detection |
| Security & Safety | Trusted Secure IP (TSIP): AES128/192/256, ECC, RSA, TRNG, SHA256, CRC, MPU, IEC60730 compliance functions |
| Package & Temp | TFLGA-145 (9 × 9 mm, 0.65-mm pitch), –40°C to +105°C (G-version), 111 GPIO (20× 5-V tolerant) |
Pinout & Package
Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core/analog power domains (2.7–3.6 V); AVCC0/AVCC1 independently monitored by LVDA |
| VBATT | Backup power input | Supplies RTC, backup registers, and sub-clock oscillator during main power loss |
| RES# | Active-low reset input | Hardware reset assertion; internal POR/LVD also generate reset without external signal |
| CLKIN, CLKOUT | Main crystal oscillator interface | Supports 8–24 MHz external crystal; CLKOUT configurable as output of selected clock source |
| USB_VBUS, USB_DP, USB_DM | USB 2.0 full-speed physical layer | Integrated transceiver; VBUS sensing enables host/device role auto-detection per OTG spec |
| SD0_CMD, SD0_CLK, SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting SD memory/SDIO cards; CRC7/CRC16 error checking, DMA-capable buffers |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank code flash | Enables seamless firmware updates: one bank executes while the other is reprogrammed via BGO |
| Capacitive touch unit (CTSUa) | Supports 17-key self-capacitance or 64-key mutual-capacitance matrix without external components |
| Event Link Controller (ELC) | 99 internal event sources linked without CPU intervention - e.g., TPU trigger → A/D start → DMA transfer |
| MTU3a complementary PWM | Hardware dead-time insertion and non-overlapping 3-phase inverter control with automatic duty-cycle alignment |
| Trusted Secure IP (TSIP) | On-the-fly AES decryption for XIP from encrypted serial flash; key protection prevents extraction even during debug access |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
|
Use Scenario: Touch-enabled front panel with real-time energy display, tariff switching, and tamper detection. IC Role / Device Role / Timing Role: Main application MCU managing CTSU touch input, RTC calendar/timekeeping, SDHI for log storage, and CAN for utility communication. Use Value: Integrated TSIP enables secure firmware updates over CAN; dual A/D units simultaneously monitor voltage/current sensors and temperature. |
Use Scenario: DIN-rail mounted meter with pulse counting, harmonic analysis, and remote firmware upgrade capability. IC Role / Device Role / Timing Role: System controller executing IEC61000-4-30 Class A measurement algorithms, managing SDHI data logging, and handling USB/SD card field service access. Use Value: 120-MHz RXv3 core delivers deterministic FFT execution; hardware CRC and MPU ensure data integrity and runtime memory protection. |
| Home Appliance Control | Building Automation Node |
|
Use Scenario: Washing machine main board requiring motor control, water level sensing, and BLE gateway interface. IC Role / Device Role / Timing Role: Real-time motor controller using MTU3a complementary PWM, ADC for pressure/temperature feedback, and USB/SDHI for diagnostics. Use Value: QSPIX fetches encrypted motor control firmware from external flash; CTSU replaces mechanical buttons with waterproof touch interface. |
Use Scenario: HVAC controller interfacing with BACnet MS/TP, KNX, and wireless sensors via RS-485 and sub-GHz RF. IC Role / Device Role / Timing Role: Protocol gateway MCU running multiple serial stacks (SCIh for LIN, RSCI for HBS, CAN for BACnet), managing RTC-scheduled ventilation cycles. Use Value: Dual CAN channels isolate fieldbus traffic; 4-KB standby RAM preserves schedule state during brownouts with VBATT backup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56709DFB#30 | Same RX671 Group, 100-pin LFQFP, 1-MB flash, 256-KB SRAM, no SDHI or QSPIX | Lacks SD host and quad-SPI interfaces; suitable for cost-sensitive CAN/USB nodes without local storage | Select when footprint and BOM cost constrain require smaller package and reduced peripheral count |
| R5F566TEADFP#30 | RX66T Group, 144-pin LQFP, 120 MHz, 1-MB flash, 256-KB SRAM, no TSIP or CTSU | Optimized for motor control (3× MTU3, 3× encoder inputs); lacks crypto engine and touch sensing | Prefer for servo/inverter designs needing higher PWM resolution and encoder interface density |
Compared with R5F56719DGFB#30, the R5F56709DFB#30 reduces footprint and memory but removes critical connectivity for local data storage, while the R5F566TEADFP#30 trades security and HMI features for enhanced real-time motor control peripherals - making R5F56719DGFB#30 optimal for secure, touch-enabled edge devices requiring local logging and field-upgradable firmware.
Availability
R5F56719DGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and building automation systems requiring stable component supply across extended product lifecycles.
Supply support for R5F56719DGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT applications.
The RX671 Group targets high-integrity industrial edge devices - integrating security (TSIP), human interface (CTSU), and connectivity (USB/SDHI/CAN) into a single 120-MHz MCU optimized for IEC60730-certifiable designs.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719DGFB#30?
The R5F56719DGFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction set, dual-precision FPU, and zero-wait-state access to 384-KB SRAM - enabling deterministic real-time execution in demanding industrial control loops.
Does the R5F56719DGFB#30 support secure firmware updates and cryptographic operations?
Yes, the R5F56719DGFB#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, ECC, RSA, SHA256, and a true-random number generator. It enables secure boot, encrypted XIP from serial flash via QSPIX, and authenticated firmware updates - all enforced by hardware key protection that prevents extraction during debug or runtime.
What package type and pin count does the R5F56719DGFB#30 use?
The R5F56719DGFB#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 GPIO pins, including 20 with 5-V tolerance, and integrates an exposed thermal pad for enhanced power dissipation in compact industrial enclosures.
Can the R5F56719DGFB#30 interface directly with SD cards and serial flash memory?
Yes, the R5F56719DGFB#30 includes a full-featured SD host interface (SDHI) supporting 1-/4-bit SD/SDIO cards at up to 25 MB/s, and a Quad-SPI memory interface (QSPIX) capable of fetching executable code directly from SPI-compatible serial flash. Both interfaces support DMA and hardware CRC for robust, high-throughput storage access.
How does the R5F56719DGFB#30 support capacitive touch sensing without external components?
The R5F56719DGFB#30 integrates a dedicated Capacitive Touch Sensing Unit (CTSUa) supporting up to 17 self-capacitance keys or 64 mutual-capacitance keys in matrix configuration. It uses internal current sources and high-resolution timing measurement - eliminating need for external RC networks or dedicated touch controllers in HMI designs.
R5F56719DGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 113
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719DGFB#30 FAQ
1.How can I place an order for R5F56719DGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719DGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719DGFB#30 reliable?
The price and inventory of R5F56719DGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56719DGFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719DGFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56719DGFB#30?
R5F56719DGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56719DGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56719DGFB#30?
For technical support, including R5F56719DGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DGFB#30 requirements.
6.How does Aetrix verify that R5F56719DGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56719DGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56719DGFB#30?
All R5F56719DGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719DGFB#30 part is unused and in its original packaging.
Return procedure for R5F56719DGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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