Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas R5F56719DGFM#30

Part No.:
R5F56719DGFM#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixR5F56719DGFM#30.pdf
Description:
IC MCU 32BIT 1MB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:320

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

R5F56719DGFM#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719DGFM#30 datasheet, R5F56719DGFM#30 pinout, R5F56719DGFM#30 application, or R5F56719DGFM#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical firmware.

Technical Context

The R5F56719DGFM#30 implements the RXv3 CPU core with 16×32-bit general-purpose registers, double-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. It supports little-endian or big-endian data arrangement and executes 113 instructions including DSP and floating-point extensions.

Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator. Peripheral clocks are independently configurable: ICLK up to 120 MHz (CPU/QSPIX), PCLKA up to 120 MHz (MTU/RSPI), PCLKB up to 60 MHz (most peripherals), and ADCLK up to 60 MHz (S12AD units).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max, 707 CoreMark, double-precision IEEE-754 FPU
Memory 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k cycles), 384 KB SRAM (no wait states)
Package & Temp TFLGA-145 (9 × 9 mm, 0.65-mm pitch), G-grade: –40°C to +105°C
Peripherals 2× CAN (32 mailboxes/channel), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX, 2× S12AD (12-bit, 20 ch total), CTSU (64-key mutual-capacitance)
Security & Safety Trusted Secure IP (TSIP): AES128/192/256, SHA256, TRNG, CRC, IEC60730 self-diagnostic suite
Power & Clock 2.7–3.6 V supply; PLL + HOCO/LOCO/sub-clock sources; four low-power modes including deep software standby with 4 KB backup RAM

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm, 0.65-mm pitch, 145-terminal land grid array with 111 general-purpose I/O pins (20 of which are 5-V tolerant), 1 dedicated input pin, pull-up resistors on all I/Os, and open-drain capability on all I/Os.

Pin/Terminal Circuit Role Design Meaning
VCC / AVCC0 / AVCC1 Core & analog power supply 2.7–3.6 V main supply; separate analog domains for ADC reference stability
VBATT Backup power input Enables RTC, backup registers, and sub-clock operation during main power loss
XTAL / EXTAL Main crystal oscillator interface Supports 8–24 MHz external crystal for precise system clock generation
RTCIN / RTCOUT 32.768 kHz sub-clock oscillator Connects to external tuning-fork crystal for battery-backed real-time clock accuracy
USB_DP / USB_DM USB 2.0 full-speed differential pair Integrated transceiver enables host/function/OTG without external PHY or pull-ups
SD_CLK / SD_CMD / SD_DAT0–3 SD host interface signals Direct 4-bit SD/SDIO bus interface compliant with Physical Layer Spec v3.01

Key Features

Feature Design Value
Dual-bank flash architecture Enables seamless firmware updates via background programming while executing from alternate bank
Trusted Secure IP (TSIP) Hardware-accelerated AES256/SHA256/TRNG with key protection prevents firmware cloning and ensures secure boot integrity
IEC60730-compliant diagnostics Oscillation-stop detection, CRC calculation unit, A/D self-test, and register write protection meet Class B safety requirements
Capacitive touch sensing unit (CTSU) Supports 64-key matrix (mutual capacitance) with built-in noise suppression for robust touch HMI in noisy industrial environments
Event Link Controller (ELC) 99 internal event signals routed without CPU intervention - e.g., TPU trigger → A/D conversion start → DMA transfer completion

Applications

Industrial Smart Metering Human-Machine Interface (HMI)

Use Scenario: Electricity/water/gas meter with tamper detection, time-of-use billing, and remote firmware update over CAN or USB.

IC Role / Device Role / Timing Role: Main application controller managing metrology ADC sampling, secure data logging, RTC calendar, and encrypted communication stack.

Use Value: Dual-bank flash enables safe over-the-air updates; TSIP ensures firmware authenticity; 120 MHz CPU handles real-time tariff calculations and UI rendering.

Use Scenario: Panel-mounted operator interface with touch buttons, status LEDs, and serial display control in factory automation.

IC Role / Device Role / Timing Role: Central HMI processor driving capacitive touch sensing, USB HID device emulation, and RS-485/SCI communication to PLCs.

Use Value: CTSU supports 64-key mutual-capacitance for glove-friendly operation; USB 2.0 FS allows plug-and-play configuration; 384 KB SRAM buffers graphics assets.

Energy Management Gateway Secure Industrial IoT Node

Use Scenario: Building energy gateway aggregating Modbus RTU, CAN, and SD card data logs for cloud upload via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Protocol translation hub with SDHI for local storage, QSPIX for fast boot from serial flash, and multiple SCI/RSPI channels for fieldbus interfacing.

Use Value: SDHI supports 25 MB/s high-speed mode for rapid log dumps; QSPIX enables XIP execution reducing boot time; 13-channel SCI supports concurrent legacy protocol stacks.

Use Scenario: Edge node performing sensor fusion (temp, voltage, current), anomaly detection, and TLS-secured MQTT transmission.

IC Role / Device Role / Timing Role: Secure edge MCU running lightweight RTOS with hardware crypto acceleration and watchdog supervision.

Use Value: TSIP offloads AES256/TLS handshake; independent IWDT with window function guarantees fail-safe reset on firmware hang; 12-bit S12AD provides calibrated sensor inputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56718DGFM#30 Same RX671 Group, identical package and pinout, but 1.5 MB flash and 256 KB SRAM Suitable where firmware footprint and RAM usage are lower; lacks margin for future feature expansion Select when cost sensitivity outweighs need for dual-bank update flexibility or large buffer space
R5F566TEADFP#30 RX66T Group, 160 MHz, 1 MB flash, 256 KB SRAM, no TSIP, no SDHI, no QSPIX, enhanced motor control timers Optimized for inverter drives and servo control; lacks security and storage interfaces required for gateway/metering roles Choose only for motor control applications where cryptographic security and SD/serial flash boot are unnecessary

Compared with R5F56718DGFM#30, the R5F56719DGFM#30 provides 512 KB additional flash for dual-bank firmware updates and 128 KB more SRAM for real-time data buffering; versus R5F566TEADFP#30, it trades motor-specific timers for comprehensive security, storage, and connectivity - making it uniquely suited for certified metering and secure gateway designs.

Availability

R5F56719DGFM#30 is available at Aetrix Electronics and suitable for industrial smart metering, human-machine interface (HMI), and secure energy gateway applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature stress.

Supply support for R5F56719DGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX671 Group, including the R5F56719DGFM#30, was designed for high-integrity industrial control systems demanding real-time performance, functional safety compliance (IEC60730), and hardware-enforced security - targeting smart meters, PLCs, and secure gateways.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F56719DGFM#30?

The R5F56719DGFM#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz and delivers 707 CoreMark performance. It includes double-precision IEEE-754 floating-point support, 16×32-bit general-purpose registers, and a 72-bit accumulator. The R5F56719DGFM#30 achieves deterministic real-time response through collective register bank save and memory protection unit (MPU) enforcement.

Does the R5F56719DGFM#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719DGFM#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, MD5, TRNG, and GHASH with hardware key protection. Its dual-bank flash architecture enables background programming and atomic bank switching - allowing verified firmware images to be loaded and activated without interrupting system operation. The R5F56719DGFM#30 meets IEC60730 Class B requirements for secure boot and runtime integrity checks.

What package type and temperature grade does the R5F56719DGFM#30 use?

The R5F56719DGFM#30 uses the PTLG0145JC-A package: a 145-pin TFLGA with 9 × 9 mm footprint and 0.65-mm pitch. It is rated for the G-grade industrial temperature range of –40°C to +105°C. This package provides 111 general-purpose I/O pins (20 of which are 5-V tolerant), full pin compatibility across the RX671 Group's 145-pin variants, and optimized thermal dissipation for enclosed industrial enclosures.

Which communication interfaces are integrated into the R5F56719DGFM#30?

The R5F56719DGFM#30 integrates USB 2.0 FS host/function/OTG, 2-channel CAN (ISO11898-1 compliant, 32 mailboxes per channel), SD host interface (25 MB/s), Quad-SPI (QSPIX) for serial flash XIP, 3× RIIC/I2C (up to 3.4 Mbps), 13× SCI/SCIm/SCIh channels, 2× RSCI with Manchester encoding, and 3× RSPId + 1× RSPIA SPI controllers. The R5F56719DGFM#30 supports simultaneous multi-protocol bridging essential for industrial gateways and metering systems.

How does the R5F56719DGFM#30 support functional safety standards like IEC60730?

The R5F56719DGFM#30 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC calculation unit, self-diagnostic A/D converter test, register write protection, and independent watchdog timer (IWDTa) with windowed refresh. These functions are validated in Renesas' Functional Safety Package and enable certified implementations in smart meters and industrial controllers. The R5F56719DGFM#30 documentation includes safety manual guidance and diagnostic coverage metrics.

R5F56719DGFM#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56719DGFM#30 FAQ

1.How can I place an order for R5F56719DGFM#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56719DGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56719DGFM#30 reliable?

The price and inventory of R5F56719DGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DGFM#30 is usually 5 days.

3.What payment methods are accepted for R5F56719DGFM#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719DGFM#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56719DGFM#30?

R5F56719DGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56719DGFM#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56719DGFM#30?

For technical support, including R5F56719DGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DGFM#30 requirements.

6.How does Aetrix verify that R5F56719DGFM#30 is sourced from the original manufacturer or authorized distributors?

All R5F56719DGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DGFM#30 meets industry standards.

7.What is the process for return or replacement of R5F56719DGFM#30?

All R5F56719DGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DGFM#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56719DGFM#30 part is unused and in its original packaging.

Return procedure for R5F56719DGFM#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F56719DGFM#30 Tags

  • R5F56719DGFM#30
  • R5F56719DGFM#30 PDF
  • R5F56719DGFM#30 Datasheet
  • R5F56719DGFM#30 Specifications
  • R5F56719DGFM#30 Images
  • Renesas
  • Renesas R5F56719DGFM#30
  • Buy R5F56719DGFM#30
  • R5F56719DGFM#30 Price
  • R5F56719DGFM#30 Distributor
  • R5F56719DGFM#30 Supplier
  • R5F56719DGFM#30 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER