Renesas R5F56719DGFP#30

Overview

R5F56719DGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 1 MB on-chip code flash, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, and capacitive touch sensing unit - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware execution.

For engineers reviewing the R5F56719DGFP#30 datasheet, R5F56719DGFP#30 pinout, R5F56719DGFP#30 application, or R5F56719DGFP#30 equivalent, key selection criteria include its 144-pin LFQFP package, dual-bank flash for safe firmware updates, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-diagnostic features for functional safety-critical designs.

Technical Context

The R5F56719DGFP#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator - enabling independent timing domains for ICLK (up to 120 MHz), PCLKA/B/C/D (up to 120/60/60/60 MHz), and FCLK (up to 60 MHz).

Peripheral subsystems are partitioned across clock domains: MTU3a, RSPI, and RIICHS run on PCLKA; S12AD units use PCLKC/PCLKD; and external bus interfaces synchronize to BCLK (60 MHz). The ELC enables hardware-triggered inter-module coordination without CPU intervention, supporting deterministic latency for motor control and sensor fusion.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin LFQFP, 20 × 20 mm, 0.50-mm pitch, lead-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56719DGFP#30, the R5F56709DFB#30 trades I/O count and interface breadth for compactness, while the R5F566TEBDFP#30 sacrifices cryptographic and host interfaces to maximize real-time motor control precision - making R5F56719DGFP#30 the balanced choice for secure, connected industrial edge nodes.

Availability

R5F56719DGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, secure gateways, and motor control edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719DGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets industrial automation and smart infrastructure applications, combining real-time performance, functional safety features, and secure connectivity in a single-chip solution.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DGFP#30?

The R5F56719DGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under those conditions. This performance stems from its RXv3 CPU core with optimized instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The CoreMark benchmark confirms deterministic execution capability essential for real-time industrial control tasks handled by the R5F56719DGFP#30.

Does the R5F56719DGFP#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719DGFP#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true random number generator. Its dual-bank flash architecture enables background programming and atomic bank switching - allowing verified firmware images to be loaded and activated without interrupting application execution. These capabilities make the R5F56719DGFP#30 suitable for IEC60730 Class B-certified designs requiring secure over-the-air or local updates.

What package type and pin count does the R5F56719DGFP#30 use?

The R5F56719DGFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size and 0.50-mm pitch. It provides 113 general-purpose I/O pins, 20 of which are 5-V tolerant, along with dedicated pins for USB, CAN, SDHI, QSPIX, and capacitive touch sensing - matching the full peripheral set described in the RX671 Group datasheet for this pin count.

Can the R5F56719DGFP#30 operate in low-power modes with RTC and backup registers active?

Yes, the R5F56719DGFP#30 supports deep software standby mode where only the sub-clock oscillator, RTC, and 4 KB standby RAM remain powered - sustained by VBATT backup supply. In this state, current consumption drops to microamp levels while preserving timekeeping and critical context. The RTC retains calendar functions, alarm interrupts, and time-capture capability on external events, all confirmed in the R5F56719DGFP#30's low-power specification table.

Which communication interfaces are included in the R5F56719DGFP#30 for industrial connectivity?

The R5F56719DGFP#30 includes two CAN 2.0B channels (32 mailboxes each), one USB 2.0 Full-Speed host/function/OTG module, one SD host interface (25 MB/s), one QSPIX interface for serial flash, three RSPI channels, two RSCI channels with Manchester encoding, and three I²C interfaces (including one RIICHS at 3.4 Mbps). These interfaces collectively support industrial protocols like CANopen, SDIO peripherals, secure firmware loading, and high-bandwidth sensor data offload - all native to the R5F56719DGFP#30 silicon.