Renesas R5F56719DGLE#20

Overview

R5F56719DGLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F56719DGLE#20 datasheet, R5F56719DGLE#20 pinout, R5F56719DGLE#20 application, or R5F56719DGLE#20 equivalent, key selection considerations include its 144-pin LFQFP package (PLQP0144KA-B), 120-MHz timing compliance, TSIP-based AES256/SHA256 encryption, IEC60730 safety features, and RTC with battery-backed operation.

Technical Context

The R5F56719DGLE#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It supports little-endian instruction/data layout and includes a 32×32→64-bit multiplier and 32/32→32-bit divider.

Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator. Peripheral clocks are independently configurable: ICLK up to 120 MHz (CPU, QSPIX), PCLKA up to 120 MHz (MTU, RSPI), PCLKB up to 60 MHz (most peripherals), and ADCLK up to 60 MHz (S12AD units).

Key Specifications

Pinout & Package

Package: PLQP0144KA-B, 144-pin LQFP, 20 × 20 mm, 0.50-mm pitch, exposed thermal pad (EP), RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719DGLE#20, R5F56718DFPE#30 offers reduced I/O and memory but lower package cost, while R5F566TEBDFP#30 trades security and connectivity for superior motor control timing resolution - making R5F56719DGLE#20 optimal for secure, connected, touch-enabled edge nodes.

Availability

R5F56719DGLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and building automation systems requiring stable component supply, long-term lifecycle assurance, and full production traceability.

Supply support for R5F56719DGLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding functional safety (IEC60730), secure firmware execution (TSIP), and rich connectivity - positioning R5F56719DGLE#20 as a scalable solution for next-generation smart infrastructure endpoints.

FAQ

What is the maximum operating frequency and core architecture of the R5F56719DGLE#20?

The R5F56719DGLE#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It features double-precision IEEE-754 floating-point support, 16 general-purpose registers, and a 32×32→64-bit hardware multiplier. This architecture delivers 707 CoreMark performance and enables deterministic real-time execution in applications such as motor control and sensor fusion - all within the R5F56719DGLE#20's validated thermal envelope.

Does the R5F56719DGLE#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56719DGLE#20 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, SHA256, RSA, ECC, and a true random number generator (TRNG). Its dual-bank flash architecture allows background programming while executing from the active bank - enabling authenticated, encrypted over-the-air updates without system downtime. These capabilities are fully implemented and verified in the R5F56719DGLE#20 silicon revision per Renesas R01DS0373EJ0120.

What package type and pin count does the R5F56719DGLE#20 use?

The R5F56719DGLE#20 uses the PLQP0144KA-B package: a 144-pin Low-Profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm pitch and an exposed thermal pad. It provides 113 general-purpose I/O pins with 5-V tolerance, programmable pull-up/down, open-drain capability, and configurable drive strength - matching the pinout defined in Table 1.2 of the R5F56719DGLE#20 datasheet R01DS0373EJ0120 Rev.1.20.

Can the R5F56719DGLE#20 operate with battery backup for RTC and registers?

Yes, the R5F56719DGLE#20 supports battery backup via the VBATT pin, maintaining operation of the sub-clock oscillator, real-time clock (RTC), and 4 KB of backup registers during main power loss. The RTC retains calendar accuracy and supports time-capture on external events. This functionality is electrically validated across the –40°C to +85°C temperature range specified for the R5F56719DGLE#20 D-version grade.

Which communication interfaces are integrated into the R5F56719DGLE#20?

The R5F56719DGLE#20 integrates USB 2.0 Full-Speed host/function/OTG (with 2 KB buffer), two CAN 2.0B channels (32 mailboxes each), three I²C interfaces (including RIICHS at 3.4 Mbps), 13 SCI channels (asynchronous, SPI/I²C emulation), two RSCI with Manchester encoding, QSPIX for serial flash, SD host interface (25 MB/s), and RSPI/RSPIA for SPI peripherals. All interfaces are silicon-verified and documented in the R5F56719DGLE#20 peripheral summary tables.