Renesas R5F56719DGLJ#20
- Part No.:
- R5F56719DGLJ#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-TFLGA
- Datasheet:
-
R5F56719DGLJ#20.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100TFLGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,863
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Product details
Overview
R5F56719DGLJ#20 from Renesas Electronics is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and connected appliance control systems.
For engineers reviewing the R5F56719DGLJ#20 datasheet, R5F56719DGLJ#20 pinout, R5F56719DGLJ#20 application, or R5F56719DGLJ#20 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature range, TSIP-based AES256/SHA256 encryption, 12-bit dual A/D converter with self-diagnostic capability, and IEC60730-compliant safety features for Class B certification.
Technical Context
The R5F56719DGLJ#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It supports little-endian or big-endian data arrangement and executes instructions at one per cycle at 120 MHz.
Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated 120-kHz oscillator, with independent domain clocks: ICLK (up to 120 MHz), PCLKA (up to 120 MHz for MTU/RSPI/SCIm), PCLKB (up to 60 MHz for most peripherals), and ADCLK (up to 60 MHz for S12AD units).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark, double-precision IEEE-754 FPU |
| Memory | 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no wait states) |
| Package & Temp | PTLG0145JC-A (145-pin TFLGA, 9 × 9 mm, 0.65-mm pitch), G-grade: –40°C to +105°C |
| Peripherals | 2× CAN (ISO11898-1, 32 mailboxes/channel), 1× USB 2.0 FS host/function/OTG, 1× SDHI (25 MB/s), 1× QSPIX, 13× SCI, 3× RSPId, 1× RIICHS (3.4 Mbps) |
| Security & Safety | Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, CRC-A, and IEC60730 compliance functions |
| Analog & Timing | Dual 12-bit S12AD (8+12 channels), on-chip temperature sensor (±1°C), RTC with battery backup, 25 timers including MTU3a and TPUa |
Pinout & Package
PTLG0145JC-A is a 145-pin thin fine-pitch land grid array (TFLGA) package measuring 9 × 9 mm with 0.65-mm pitch, qualified for industrial G-grade operation (–40°C to +105°C). Pinout conforms to Renesas RX671 Group standard layout for this variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core/analog power domains (2.7–3.6 V); separate AVCC pins enable noise-isolated analog subsystem operation |
| VBATT | Backup power input | Supplies RTC, backup registers, and sub-clock oscillator during main power loss |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation |
| RTCIN / RTCOUT | Sub-clock oscillator terminals | Connects 32.768 kHz crystal for battery-backed real-time clock operation |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver enables host/function/OTG without external PHY or pull-up resistors |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | Direct 1-/4-bit SD/SDIO bus interface compliant with Physical Layer Spec v3.01 |
| QSPIX_IO0–3 / QSPIX_CLK / QSPIX_CS | Quad-SPI memory interface | Enables XIP and firmware fetch from serial NOR flash using quad-SPI protocol |
| CTSU_S0–S16 | Capacitive touch sensing inputs | Supports up to 17 self-capacitance keys or 64 mutual-capacitance keys in matrix configuration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates via background programming while executing from alternate bank |
| IEC60730 Class B support | Includes oscillation-stop detection, CRC-A, IWDTa windowing, A/D self-test, and register write protection |
| Event Link Controller (ELC) | 99 internal event signals routed without CPU intervention - e.g., TPU trigger → A/D start → DMA transfer |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES256/SHA256/TRNG prevents key extraction and ensures secure boot integrity |
| Flexible clock domain partitioning | Independent ICLK, PCLKA/B/C/D allow optimized peripheral timing - e.g., 120 MHz for QSPIX, 60 MHz for ADC sampling |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Touch-enabled local operator interface for PLC-controlled machinery with real-time status display and parameter adjustment. IC Role / Device Role / Timing Role: Main application controller handling capacitive touch decoding, USB/SDHI-based firmware update, and CAN bus communication with field devices. Use Value: Integrated CTSU eliminates external touch controller; dual-bank flash enables safe over-the-air updates without system downtime. | Use Scenario: DIN-rail mounted electricity meter with tamper detection, time-of-use billing, and remote data upload via CAN or USB. IC Role / Device Role / Timing Role: System-on-chip managing metrology interface, RTC with battery backup, secure data logging, and IEC60730-compliant safety monitoring. Use Value: On-chip TSIP secures encrypted energy data; temperature sensor and A/D self-diagnostic meet Class B functional safety requirements. |
| Home Appliance Control Unit | Building Automation Node |
Use Scenario: Central control MCU in HVAC or washing machine with motor control, user interface, and connectivity. IC Role / Device Role / Timing Role: Real-time executor of PWM-driven inverter control (via MTU3a complementary PWM), audio feedback (SSIE), and remote IR command reception (REMC). Use Value: Hardware dead-time insertion and phase-counting mode simplify 3-phase motor drive; integrated REMCa avoids external IR decoder IC. | Use Scenario: Edge node in KNX or BACnet network managing lighting, blinds, and environmental sensors. IC Role / Device Role / Timing Role: Protocol gateway bridging CAN/RS485 field buses to Ethernet/Wi-Fi via external MAC, with secure OTA update capability. Use Value: Dual CAN channels support redundant field bus links; QSPIX enables fast boot from encrypted serial flash for secure firmware validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56718DGLJ#20 | Same RX671 Group, identical package and pinout, but 1.5 MB flash and 256 KB SRAM | Suitable where reduced code size and RAM footprint are acceptable for cost-sensitive designs | Select when firmware image fits within 1.5 MB and application requires ≤256 KB RAM |
| R5F566TEADFP#30 | RX66T Group, 160 MHz, 1 MB flash, 192 KB RAM, optimized for motor control with 32-bit MTU3b and encoder interfaces | Better suited for servo/inverter applications requiring higher PWM resolution and encoder input support | Choose for high-performance motor control; not drop-in compatible due to different peripheral set and pin assignment |
Compared with R5F56719DGLJ#20, the R5F56718DGLJ#20 offers identical packaging and peripheral compatibility at lower memory capacity, while the R5F566TEADFP#30 targets motor-centric use cases with distinct timer architecture and no SDHI/QSPIX - making the R5F56719DGLJ#20 optimal for HMI, metering, and secure connectivity applications requiring balanced mixed-signal integration.
Availability
R5F56719DGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and building automation applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.
Supply support for R5F56719DGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX671 Group - including the R5F56719DGLJ#20 - is engineered for secure, real-time industrial control with integrated connectivity (CAN/USB/SDHI), functional safety (IEC60730), and human interface capabilities (CTSU, SSIE), targeting smart infrastructure and edge intelligence applications.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719DGLJ#20?
The R5F56719DGLJ#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose registers, and efficient pipeline design - enabling deterministic real-time response in demanding industrial applications. The R5F56719DGLJ#20 maintains this speed across its full voltage range (2.7–3.6 V) and temperature range (–40°C to +105°C).
Does the R5F56719DGLJ#20 support secure boot and cryptographic operations?
Yes, the R5F56719DGLJ#20 integrates Trusted Secure IP (TSIP) hardware acceleration for AES128/192/256, SHA256, MD5, GHASH, RSA, ECC, and TRNG. It supports secure boot verification, encrypted firmware storage, and key protection against physical extraction. These features are documented in the R01DS0373EJ0120 datasheet and enable compliance with IEC60730 Class B and industrial cybersecurity standards - critical for protecting the R5F56719DGLJ#20-based systems in field-deployed equipment.
What package type and pin count does the R5F56719DGLJ#20 use?
The R5F56719DGLJ#20 uses the PTLG0145JC-A package: a 145-pin thin fine-pitch land grid array (TFLGA) measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins (including 20 with 5-V tolerance), dedicated USB/SDHI/QSPIX interfaces, and power/backup domains aligned to Renesas' RX671 Group pinout standard. This package is rated for industrial G-grade operation (–40°C to +105°C).
Can the R5F56719DGLJ#20 execute code directly from external serial flash memory?
Yes, the R5F56719DGLJ#20 supports execute-in-place (XIP) from external serial flash via its QSPIX interface. The QSPIX module implements quad-SPI, dual-SPI, and extended SPI protocols with configurable address width (8–32 bits), enabling fast, low-pin-count firmware execution without loading into internal RAM. This capability reduces external memory footprint and accelerates boot time - a key advantage confirmed in Section 1.1 and Table 1.1 of the R01DS0373EJ0120 datasheet for the R5F56719DGLJ#20.
What safety certifications and diagnostic features does the R5F56719DGLJ#20 provide for IEC60730 compliance?
The R5F56719DGLJ#20 includes multiple hardware-level features for IEC60730 Class B compliance: oscillation-stoppage detection, CRC-A accelerator, independent watchdog timer (IWDTa) with windowing, A/D converter self-diagnostic function, and register write protection. These are explicitly listed in the "Useful functions for IEC60730 compliance" section of the R01DS0373EJ0120 datasheet. Together, they enable runtime verification of clock integrity, memory consistency, analog subsystem health, and critical register state - essential for validating the R5F56719DGLJ#20 in safety-critical industrial control applications.
R5F56719DGLJ#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-TFLGA
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719DGLJ#20 FAQ
1.How can I place an order for R5F56719DGLJ#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719DGLJ#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719DGLJ#20 reliable?
The price and inventory of R5F56719DGLJ#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719DGLJ#20 is usually 5 days.
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5.How can I obtain technical support or documentation for R5F56719DGLJ#20?
For technical support, including R5F56719DGLJ#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719DGLJ#20 requirements.
6.How does Aetrix verify that R5F56719DGLJ#20 is sourced from the original manufacturer or authorized distributors?
All R5F56719DGLJ#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719DGLJ#20 meets industry standards.
7.What is the process for return or replacement of R5F56719DGLJ#20?
All R5F56719DGLJ#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719DGLJ#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719DGLJ#20 part is unused and in its original packaging.
Return procedure for R5F56719DGLJ#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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