Renesas R5F56719DGNE#30

Overview

R5F56719DGNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and connected appliance control systems.

For engineers reviewing the R5F56719DGNE#30 datasheet, R5F56719DGNE#30 pinout, R5F56719DGNE#30 application, or R5F56719DGNE#30 equivalent, key selection criteria include its 120-MHz real-time performance, IEC60730-compliant safety features (TSIP, MPU, self-diagnostic ADC), 114 GPIOs with 5-V tolerance, and support for battery-backed RTC and deep software standby modes.

Technical Context

The R5F56719DGNE#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and hardware-accelerated 32×32→64-bit multiply/divide. Its memory subsystem includes dual-bank flash enabling background programming while executing from alternate bank, and 384 KB zero-wait-state SRAM synchronized to 120-MHz ICLK.

Peripheral integration centers on deterministic real-time control: MTU3a (9-channel 16/32-bit timer with complementary PWM and dead-time insertion), dual 12-bit S12AD units (8+12 channels, 0.48 µs conversion), and TSIP encryption engine supporting AES128/192/256, RSA, ECC, and TRNG - all coordinated via Event Link Controller (ELC) for CPU-offload event chaining.

Key Specifications

Pinout & Package

PLQP0144KA-B is a 144-pin Low-Profile Quad Flat Package (LFQFP) measuring 20 × 20 mm with 0.50-mm lead pitch, designed for reflow soldering and industrial PCB reliability. Pin assignments are defined in Renesas Document R01DS0373EJ0120 Section 5.2 (Pin Functions) and Table 5.1 (Pin Numbering).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719DGNE#30, the R5F56718DDFE#30 trades flash capacity and peripheral count for smaller size and lower cost, while the R5F566TEBDFP#30 shifts focus to motor-control-specific timing and PWM accuracy at the expense of security and storage interfaces - making R5F56719DGNE#30 optimal for secure, feature-rich industrial edge nodes.

Availability

R5F56719DGNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and home appliance control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719DGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including R5F56719DGNE#30 - is engineered for industrial automation and connected appliances requiring real-time determinism, functional safety (IEC60730), and secure firmware execution in extended temperature environments.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719DGNE#30?

The R5F56719DGNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient pipeline, zero-wait-state 384 KB SRAM, and dual-bank flash architecture - enabling deterministic real-time response in industrial control loops without cache-related stalls. The R5F56719DGNE#30 maintains this score across its full operating voltage (2.7–3.6 V) and temperature range (–40°C to +85°C).

Does the R5F56719DGNE#30 support secure boot and cryptographic operations?

Yes, the R5F56719DGNE#30 integrates Renesas' Trusted Secure IP (TSIP) engine, providing hardware-accelerated AES128/192/256, RSA, ECC, SHA256, MD5, and true random number generation. It supports secure boot via encrypted firmware validation and meets IEC60730 Class B requirements with built-in self-test (e.g., CRCA, ADC diagnostics). These capabilities are fully implemented in the R5F56719DGNE#30 silicon and documented in R01DS0373EJ0120 Section 24.

What package type and pin count does the R5F56719DGNE#30 use?

The R5F56719DGNE#30 uses the PLQP0144KA-B package: a 144-pin Low-Profile Quad Flat Package (LFQFP) measuring 20 × 20 mm with 0.50-mm lead pitch. It provides 113 general-purpose I/O pins, including 20 with 5-V tolerance, and supports industrial reflow profiles. This package is explicitly assigned to the R5F56719DGNE#30 in Renesas' ordering information and datasheet Table 1.2.

Can the R5F56719DGNE#30 execute code directly from external serial flash memory?

Yes, the R5F56719DGNE#30 includes a dedicated Quad-SPI memory interface (QSPIX) that supports direct execution (XIP) from external serial flash memory using extended SPI, dual-SPI, and quad-SPI protocols. Address width is configurable (8/16/24/32 bits), and the interface operates synchronously with ICLK up to 120 MHz - enabling fast boot and overlay code loading without external memory controllers. This capability is confirmed in R01DS0373EJ0120 Section 1.1.9.

What low-power modes are available on the R5F56719DGNE#30, and how does battery backup work?

The R5F56719DGNE#30 offers four low-power modes: Sleep, All-Module Clock Stop, Software Standby, and Deep Software Standby - with current consumption as low as 0.35 µA in Deep Software Standby. Battery backup is enabled via the VBATT pin, which powers the sub-clock oscillator, RTC, and 4 KB standby RAM when main VCC drops below threshold. This preserves timekeeping and critical state across power cycles, as specified in R01DS0373EJ0120 Section 1.1.5 and Section 12.3. The R5F56719DGNE#30 implements this function in hardware without external circuitry.