Renesas R5F56719HDFB#30
- Part No.:
- R5F56719HDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56719HDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:180
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Product details
Overview
R5F56719HDFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.
For engineers reviewing the R5F56719HDFB#30 datasheet, R5F56719HDFB#30 pinout, R5F56719HDFB#30 application, or R5F56719HDFB#30 equivalent, this MCU delivers deterministic real-time performance (707 CoreMark), IEC60730-compliant safety features including self-diagnostic A/D and oscillation-stop detection, and hardware-accelerated cryptography via TSIP for secure boot and OTA updates.
Technical Context
The R5F56719HDFB#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU coprocessor (16 × 64-bit data registers), and collective register bank save for fast context switching. It supports little-endian or big-endian data arrangement and executes instructions at one per cycle at 120 MHz.
Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, with independent domain clocks: ICLK (up to 120 MHz for CPU/QSPIX), PCLKA (up to 120 MHz for MTU/RSPI), PCLKB (up to 60 MHz for most peripherals), and ADCLK (up to 60 MHz for S12AD units).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark, double-precision IEEE-754 FPU |
| Memory | 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait), 4 KB standby RAM |
| Peripherals | 2× CAN (ISO11898-1, 32 mailboxes/channel), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX (fetch from serial flash), 2× S12AD (8+12 ch, 0.48 µs/ch) |
| Security & Safety | Trusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, TRNG, SHA256; MPU (8 regions); IEC60730 compliance features (CRC, IWDT, A/D self-test) |
| Package & Temp | PLQP0144KA-B (144-pin LFQFP, 20 × 20 mm, 0.5 mm pitch), –40°C to +85°C (D-version) |
| I/O & Timing | 114 general-purpose pins (20× 5-V tolerant), RTC with battery backup, 25 timers including MTU3a (9-channel), TPUa (6-channel), CMTW (2× 32-bit) |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50-mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core/analog power rails (2.7–3.6 V); AVCC0/AVCC1 supply ADC and analog circuits independently |
| VBATT | Backup power input | Supplies RTC, sub-clock oscillator, and backup registers during main power loss |
| XTAL/EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation |
| RES# | Active-low reset input | Hardware reset assertion; internal POR/LVD also available |
| USB_DP/USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY; supports host/function/OTG modes |
| SD0_CMD, SD0_CLK, SD0_DAT0–3 | SD host interface signals | Direct 4-bit SD bus interface compliant with SD Physical Layer Spec v3.01 (no DDR) |
| QSPIX_IO0–3, QSPIX_CLK, QSPIX_CS# | Quad-SPI memory interface | Enables XIP (execute-in-place) from external serial flash using quad-SPI protocol |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: execute from Bank A while programming Bank B as background operation (BGO) |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES/RSA/ECC/SHA256 and true-random number generation for secure boot and encrypted OTA updates |
| IEC60730 Class B compliance support | Includes built-in CRC calculation unit, oscillation-stop detection, A/D self-diagnostic, and register write protection for functional safety certification |
| Capacitive touch sensing (CTSUa) | Supports 17-key self-capacitance or 64-key mutual-capacitance matrix without external components |
| Event Link Controller (ELC) | 99 internal event signals routed without CPU intervention - e.g., TPU trigger → A/D conversion start → DMA transfer completion |
Applications
| Industrial HMI Panels | Smart Energy Meters |
|---|---|
|
Use Scenario: Touch-enabled front-panel interface with real-time energy monitoring, tariff switching, and tamper detection. IC Role / Device Role / Timing Role: Main application controller managing CTSU touch input, SDHI for firmware logging, CAN for utility communication, and RTC for time-stamped events. Use Value: Dual-bank flash enables field-upgradable UI firmware without service interruption; TSIP secures meter configuration against unauthorized access. |
Use Scenario: DIN-rail mounted electricity meter with pulse counting, harmonic analysis, and remote firmware update over PLC or RF gateway. IC Role / Device Role / Timing Role: System-on-chip controller running metrology algorithms (via FPU), sampling analog inputs via S12AD, and communicating via CAN/RS485 (SCIh). Use Value: 120 MHz RXv3 core processes 3-phase voltage/current waveforms in real time; IEC60730 features satisfy EN61000-4-30 Class A requirements. |
| Home Automation Gateways | Medical Diagnostic Devices |
|
Use Scenario: Multi-protocol hub connecting Zigbee, BLE, and wired sensors to cloud via Ethernet/Wi-Fi (external PHY). IC Role / Device Role / Timing Role: Protocol translation engine using USB (for dongles), QSPIX (for local firmware storage), and multiple SCI/RIIC channels for sensor interfacing. Use Value: 13 SCI channels and 3 RIIC/RIICHS interfaces allow concurrent connection to >10 heterogeneous sensors; 384 KB SRAM buffers multi-sensor streams. |
Use Scenario: Portable ultrasound or ECG device requiring low-power operation, analog signal conditioning, and HIPAA-compliant data encryption. IC Role / Device Role / Timing Role: Real-time signal processor with 12-bit S12AD (self-diagnostic), temperature sensor for calibration, and TSIP for AES-256 encryption of patient data. Use Value: Standby RAM retains critical state during deep software standby; 4 KB backup RAM preserves last measurement on battery power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56709HDFB#30 | Same RX671 Group, 1 MB flash (vs. 2 MB), identical peripherals and package | Suitable where firmware size < 1 MB and cost sensitivity outweighs future-proofing headroom | Select when BOM cost reduction is prioritized and no planned feature expansion requires >1 MB code space |
| R5F566TEADFP#30 | RX66T Group, 160 MHz, focused on motor control (3× MTU3, 3× encoder interfaces), no SDHI/QSPIX/USB | Optimized for inverter drives and servo systems - lacks HMI/security peripherals of R5F56719HDFB#30 | Choose only for high-performance motor control; not a functional substitute for HMI or secure connectivity use cases |
Compared with R5F56719HDFB#30, the R5F56709HDFB#30 offers identical architecture and pinout but reduced flash capacity, enabling direct layout reuse with firmware size constraints; the R5F566TEADFP#30 targets motor control with higher CPU speed but omits SDHI, USB, and TSIP - making it unsuitable for secure, connected HMI applications.
Availability
R5F56719HDFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, home automation gateways, and medical diagnostic devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56719HDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX671 Group - including R5F56719HDFB#30 - is designed for secure, real-time industrial and consumer applications demanding high computational throughput, rich connectivity (CAN/USB/SD/QSPI), and functional safety compliance.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719HDFB#30?
The R5F56719HDFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose registers, and optimized pipeline - enabling deterministic real-time response in industrial control loops and HMI rendering tasks. The R5F56719HDFB#30 sustains this speed across its 384 KB SRAM and dual-bank flash interface.
Does the R5F56719HDFB#30 support secure firmware updates and cryptographic operations?
Yes, the R5F56719HDFB#30 integrates Trusted Secure IP (TSIP) with hardware acceleration for AES128/192/256, RSA, ECC, SHA256, and a true-random number generator (TRNG). These capabilities enable secure boot verification, encrypted OTA firmware updates, and protected key storage - all required for IEC60730 Class B and IEC62443 compliance. The R5F56719HDFB#30 uses TSIP to prevent illicit copying of keys and enforce firmware integrity checks before execution.
What package type and pin count does the R5F56719HDFB#30 use?
The R5F56719HDFB#30 is packaged in PLQP0144KA-B: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.50-mm pitch, and exposed thermal pad. It provides 114 general-purpose I/O pins (20 of which are 5-V tolerant), supporting flexible peripheral routing for CAN, USB, SDHI, and QSPIX interfaces. The R5F56719HDFB#30 shares this footprint with other RX671 Group members for scalable design reuse.
How does the R5F56719HDFB#30 handle analog-to-digital conversion and self-diagnosis?
The R5F56719HDFB#30 integrates two 12-bit A/D converters (S12ADFa): Unit 0 (8 channels) and Unit 1 (12 channels), each supporting 8/10/12-bit resolution and conversion times as fast as 0.42 µs. Both units include self-diagnostic functions that internally generate reference voltages (e.g., VREFL0, VREFH0 × 1/2) to verify analog path integrity - a mandatory feature for IEC60730 Class B certification. The R5F56719HDFB#30 also detects analog input disconnection and supports digital comparison for windowed threshold monitoring.
Can the R5F56719HDFB#30 operate in low-power modes with RTC and backup RAM retention?
Yes, the R5F56719HDFB#30 supports four low-power modes, including deep software standby where only the sub-clock oscillator, RTC, and 4 KB standby RAM remain active - powered by VBATT during main supply loss. In this mode, the R5F56719HDFB#30 maintains calendar time, alarm triggers, and critical state data while consuming minimal current. Battery-backed operation ensures uninterrupted timekeeping and tamper-evident logging in smart meters and security systems using the R5F56719HDFB#30.
R5F56719HDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 113
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719HDFB#30 FAQ
1.How can I place an order for R5F56719HDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719HDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719HDFB#30 reliable?
The price and inventory of R5F56719HDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719HDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56719HDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719HDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56719HDFB#30?
R5F56719HDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56719HDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56719HDFB#30?
For technical support, including R5F56719HDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719HDFB#30 requirements.
6.How does Aetrix verify that R5F56719HDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56719HDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719HDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56719HDFB#30?
All R5F56719HDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719HDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719HDFB#30 part is unused and in its original packaging.
Return procedure for R5F56719HDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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