Renesas R5F56719HDFP#30

Overview

R5F56719HDFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719HDFP#30 datasheet, R5F56719HDFP#30 pinout, R5F56719HDFP#30 application, or R5F56719HDFP#30 equivalent, key selection criteria include its 144-pin LFQFP package, -40°C to +85°C temperature grade, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical firmware execution.

Technical Context

The R5F56719HDFP#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its memory subsystem integrates dual-bank flash enabling background programming while executing from alternate bank, and 384 KB zero-wait-state SRAM synchronized to 120 MHz ICLK.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU/QSPIX), PCLKA (up to 120 MHz for MTU/RSPI), PCLKB (up to 60 MHz for most timers/SCI), and PCLKC/PCLKD (up to 60 MHz for dual 12-bit A/D units). The ELC enables hardware-triggered inter-module coordination without CPU intervention.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56709HDFP#30, the R5F56719HDFP#30 offers doubled flash and SRAM for complex protocol stacks and secure boot images; versus R7FS7288H3CFB#AA0, it provides proven industrial qualification in a mature 144-pin footprint without Ethernet overhead or layout changes.

Availability

R5F56719HDFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, programmable logic controllers, and home energy gateways requiring stable component supply across multi-year production cycles.

Supply support for R5F56719HDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including R5F56719HDFP#30 - was designed for industrial automation and smart infrastructure applications demanding real-time responsiveness, functional safety certification, and robust security against firmware tampering.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HDFP#30?

The R5F56719HDFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F56719HDFP#30 maintains this throughput across its full temperature range (-40°C to +85°C) with appropriate decoupling and thermal design.

Does the R5F56719HDFP#30 support secure firmware updates and cryptographic acceleration?

Yes, the R5F56719HDFP#30 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, SHA256, RSA, ECC, and a true random number generator. It supports secure boot validation and encrypted OTA updates via its dual-bank flash architecture - allowing one bank to run while the other is updated. The R5F56719HDFP#30 also includes register write protection and memory protection unit (MPU) enforcement to prevent unauthorized code execution.

What package type and pin count does the R5F56719HDFP#30 use?

The R5F56719HDFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.50 mm pitch, and exposed thermal pad. It is rated for industrial temperature range (-40°C to +85°C) and complies with JEDEC standards for reflow soldering. This package matches other RX671 variants like R5F56709HDFP#30, enabling drop-in memory-scaling upgrades.

Which communication interfaces are integrated into the R5F56719HDFP#30?

The R5F56719HDFP#30 integrates CAN (2 channels, ISO11898-1), USB 2.0 Full-Speed host/function/OTG, SD host interface (SDHI), Quad-SPI (QSPIX), multiple SCI/RSPI channels, I²C (RIIC/RIICHS), and RSCI with Manchester encoding. These interfaces enable connectivity to industrial fieldbuses, removable media, external flash, and legacy serial peripherals - all managed via the Event Link Controller to minimize CPU overhead. The R5F56719HDFP#30 does not include Ethernet or Bluetooth.

How does the R5F56719HDFP#30 support functional safety standards like IEC60730?

The R5F56719HDFP#30 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC-accelerated memory tests, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter, and register write protection. Its MPU enforces memory access boundaries, and the TSIP engine safeguards cryptographic keys. These capabilities are documented in Renesas' Functional Safety Manual R01UM0597EJ0100 and validated for use in household appliances and industrial controls - without requiring external safety monitors.