Renesas R5F56719HDLE#20
- Part No.:
- R5F56719HDLE#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 145-TFLGA
- Datasheet:
-
R5F56719HDLE#20.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 145TFLGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5F56719HDLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.
For engineers reviewing the R5F56719HDLE#20 datasheet, R5F56719HDLE#20 pinout, R5F56719HDLE#20 application, or R5F56719HDLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65 mm pitch) package, IEC60730-compliant safety features (TSIP, MPU, self-diagnostic A/D), RTC with battery backup, and hardware-accelerated cryptographic functions (AES128/192/256, ECC, TRNG).
Technical Context
The R5F56719HDLE#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It supports little-endian or big-endian data arrangement and executes instructions at one per cycle at 120 MHz.
Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), LOCO/HOCO (240 kHz / 16–20 MHz), and IWDT-dedicated 120 kHz oscillator. Peripheral clocks are independently configurable: PCLKA up to 120 MHz (for MTU, RSPI, RIICHS), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz (S12AD units).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark score - enables deterministic real-time execution in motor control and protocol stacks. |
| Memory | 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait at 120 MHz) - supports field firmware updates without service interruption. |
| FPU | Double-precision IEEE-754 coprocessor with 16×64-bit registers - accelerates sensor fusion, digital power control, and floating-point math in embedded applications. |
| Security | Trusted Secure IP (TSIP): AES128/192/256, ECC, SHA256, TRNG, key protection - meets IEC60730 Class B and secure boot requirements. |
| Peripherals | 2× CAN (32 mailboxes/channel), 1× USB 2.0 FS host/function/OTG, 1× SDHI (25 MB/s), 1× QSPIX (quad-SPI fetch), 2× 12-bit S12AD (8+12 ch), CTSU (64-key matrix) - consolidates connectivity, storage, and HMI in single-chip designs. |
| Power & Temp | 2.7–3.6 V supply, four low-power modes (deep software standby with 4 KB backup RAM), –40°C to +105°C (G-version) - suitable for unregulated industrial environments. |
Pinout & Package
Package: PTLG0145JC-A - 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), 9 mm × 9 mm, 0.65 mm pitch, 0.75 mm height, RoHS-compliant, lead-free matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Core & analog power supply | Must be decoupled locally; AVCC0/AVCC1 supply ADC/RTC domains and require separate 100 nF + 10 µF filtering. |
| VBATT | Backup power input | Connects to coin cell to retain RTC time, backup registers, and sub-clock oscillator during main power loss. |
| XTAL/EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal; required for high-accuracy timing and USB clock derivation. |
| RES# | Active-low reset input | Pulled high externally; assertion forces hardware reset regardless of internal state or LVD condition. |
| USB_DP/USB_DM | USB 2.0 full-speed differential pair | Direct connection to USB connector; no external termination or pull-ups needed - integrated transceiver and PHY. |
| SD0_CMD, SD0_CLK, SD0_DAT[0:3] | SD host interface signals | Support 1-/4-bit SD/SDIO bus; require 10 kΩ pull-ups and controlled impedance routing for 25 MB/s high-speed mode. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: execute from Bank A while programming Bank B, then switch startup bank via bootloader - zero downtime OTA upgrades. |
| IEC60730-compliant safety suite | Includes oscillation-stop detection, CRC accelerator, IWDT windowing, A/D self-test, and register write protection - reduces certification effort for Class B appliance control. |
| Capacitive touch sensing unit (CTSU) | Supports mutual-capacitance matrix (17 pins → 64 keys) with built-in noise suppression - eliminates external touch controller in HMI panels and white goods interfaces. |
| Event Link Controller (ELC) | Hardware interconnect for 99 internal events (e.g., timer overflow → A/D trigger → DMA transfer) - offloads CPU, reduces latency, and improves determinism in real-time loops. |
| QSPIX interface | Direct XIP (execute-in-place) capability from quad-SPI NOR flash - expands effective code space beyond on-chip flash while maintaining 120 MHz CPU performance. |
Applications
| Industrial HMI Panel | Smart Electricity Meter |
|---|---|
|
Use Scenario: Touch-enabled front-panel display with real-time energy monitoring, tariff switching, and tamper detection. IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering (via external LCD controller), CTSU-based button/slider input, SDHI for firmware logging, and RTC for billing timestamping. Use Value: Integrated TSIP secures firmware updates and metering data; dual-bank flash enables remote patch deployment; 120 MHz CPU sustains 60 Hz UI refresh with background crypto and communication tasks. |
Use Scenario: Revenue-grade meter with PLC/G3-PLC communication, anti-tampering sensors, and local display. IC Role / Device Role / Timing Role: System controller managing metrology ADC interface (via S12AD), CAN/RS485 for concentrator comms, REMCa for IR command reception, and RTC with VBATT backup for accurate billing intervals. Use Value: IEC60730 safety features satisfy EN62053-21; temperature sensor compensates metrology drift; 105°C rating ensures reliability inside sealed meter enclosures. |
| Home Energy Gateway | Motor Drive Controller |
|
Use Scenario: Multi-protocol gateway aggregating Zigbee, BLE, and PLC data for cloud upload via Ethernet/Wi-Fi (external PHY). IC Role / Device Role / Timing Role: Protocol bridge MCU running multiple RTOS tasks: USB CDC for configuration, SDHI for event logs, QSPIX for secure boot image, and CAN for legacy HVAC integration. Use Value: Hardware crypto (AES/ECC) secures OTA payloads; USB OTG allows field technician reprogramming; 145-pin I/O supports flexible peripheral expansion without FPGA. |
Use Scenario: Compact inverter for BLDC/PMSM motors in HVAC compressors or pumps, requiring precise PWM, current sensing, and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller generating complementary PWM (MTU3a), sampling shunt voltages (S12AD), reading chip temperature, and executing FOC algorithm with FPU acceleration. Use Value: POE3a prevents shoot-through in gate drivers; 120 MHz CPU + FPU achieves <1 µs current loop update; CMTW timers enable precise dead-time compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56709HDFP#30 | Same RX671 Group, 100-pin LFQFP, 1.5 MB flash, 256 KB SRAM, no SDHI or QSPIX | Lacks SD host and quad-SPI - unsuitable for firmware-over-SD or XIP flash designs | Select when board space constraints favor QFP and SD/QSPIX are not required. |
| R5F566TEHDFP#30 | RX66T Group, 100-pin LFQFP, 120 MHz, 1 MB flash, 192 KB SRAM, optimized for motor control (3× MTU3, 3× CMTW), no TSIP or CTSU | No hardware crypto or touch sensing; enhanced PWM timing but reduced peripheral breadth | Select for cost-sensitive motor drives where security and HMI are handled externally. |
Compared with R5F56719HDLE#20, the R5F56709HDFP#30 offers identical safety and timing features in smaller footprint but omits critical interfaces for storage and expansion; the R5F566TEHDFP#30 trades broad connectivity and security for deeper motor-control specialization - making R5F56719HDLE#20 optimal for integrated, secure, multi-interface industrial edge nodes.
Availability
R5F56719HDLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and motor drive controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56719HDLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RX671 Group targets high-integrity industrial applications demanding real-time performance, functional safety (IEC60730), and hardware security - delivering scalable 32-bit MCUs with integrated crypto, touch, and connectivity for next-generation edge intelligence.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719HDLE#20?
The R5F56719HDLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose registers, and efficient pipeline - enabling deterministic real-time response in applications like motor control and protocol processing. The R5F56719HDLE#20 maintains this speed across its 384 KB SRAM and 2 MB flash with zero-wait access below 60 MHz and one-wait access at full 120 MHz.
Does the R5F56719HDLE#20 support hardware cryptographic acceleration?
Yes, the R5F56719HDLE#20 integrates Trusted Secure IP (TSIP) with dedicated hardware engines for AES128/192/256, TDES, ARC4, RSA, ECC, SHA1/224/256, MD5, GHASH, and a true-random number generator (TRNG). These accelerate secure boot, encrypted firmware updates, and TLS stack operations - reducing CPU load and meeting IEC60730 Class B requirements. Key protection mechanisms prevent illicit copying, and all crypto operations are isolated from general memory space.
What package type and pin count does the R5F56719HDLE#20 use?
The R5F56719HDLE#20 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) with 9 mm × 9 mm body size, 0.65 mm pitch, and 0.75 mm height. It provides 111 general-purpose I/O pins (20 of which are 5-V tolerant), plus dedicated power, clock, reset, and interface signals. This package supports high-density PCB layouts while enabling full peripheral access - including USB, CAN, SDHI, and QSPIX - without signal multiplexing compromises.
Can the R5F56719HDLE#20 operate in low-power modes with RTC and backup RAM retention?
Yes, the R5F56719HDLE#20 supports four low-power modes, including deep software standby where the CPU and most peripherals halt while retaining RTC time, backup registers, and 4 KB of standby RAM powered by VBATT. In this mode, current consumption drops to microamp levels, and wake-up can occur via IRQ pins, RTC alarm, or external reset. The sub-clock oscillator (32.768 kHz) remains active, ensuring ±1 ppm timekeeping accuracy during backup operation.
What safety certifications and diagnostic features does the R5F56719HDLE#20 support?
The R5F56719HDLE#20 includes features aligned with IEC60730 Class B compliance: oscillation-stop detection, hardware CRC accelerator, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter test, memory protection unit (MPU), and register write protection. These allow runtime verification of clock integrity, memory correctness, and peripheral functionality - reducing software validation burden and supporting safety-critical industrial control applications without external monitors.
R5F56719HDLE#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 145-TFLGA
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719HDLE#20 FAQ
1.How can I place an order for R5F56719HDLE#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719HDLE#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719HDLE#20 reliable?
The price and inventory of R5F56719HDLE#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719HDLE#20 is usually 5 days.
3.What payment methods are accepted for R5F56719HDLE#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719HDLE#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56719HDLE#20?
R5F56719HDLE#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56719HDLE#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56719HDLE#20?
For technical support, including R5F56719HDLE#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719HDLE#20 requirements.
6.How does Aetrix verify that R5F56719HDLE#20 is sourced from the original manufacturer or authorized distributors?
All R5F56719HDLE#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719HDLE#20 meets industry standards.
7.What is the process for return or replacement of R5F56719HDLE#20?
All R5F56719HDLE#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719HDLE#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719HDLE#20 part is unused and in its original packaging.
Return procedure for R5F56719HDLE#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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