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Renesas R5F56719HDLE#20

Part No.:
R5F56719HDLE#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
145-TFLGA
Datasheet:
AetrixR5F56719HDLE#20.pdf
Description:
IC MCU 32BIT 1MB FLASH 145TFLGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,823

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Product details

Overview

R5F56719HDLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F56719HDLE#20 datasheet, R5F56719HDLE#20 pinout, R5F56719HDLE#20 application, or R5F56719HDLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65 mm pitch) package, IEC60730-compliant safety features (TSIP, MPU, self-diagnostic A/D), RTC with battery backup, and hardware-accelerated cryptographic functions (AES128/192/256, ECC, TRNG).

Technical Context

The R5F56719HDLE#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It supports little-endian or big-endian data arrangement and executes instructions at one per cycle at 120 MHz.

Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), LOCO/HOCO (240 kHz / 16–20 MHz), and IWDT-dedicated 120 kHz oscillator. Peripheral clocks are independently configurable: PCLKA up to 120 MHz (for MTU, RSPI, RIICHS), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz (S12AD units).

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max, 707 CoreMark score - enables deterministic real-time execution in motor control and protocol stacks.
Memory2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait at 120 MHz) - supports field firmware updates without service interruption.
FPUDouble-precision IEEE-754 coprocessor with 16×64-bit registers - accelerates sensor fusion, digital power control, and floating-point math in embedded applications.
SecurityTrusted Secure IP (TSIP): AES128/192/256, ECC, SHA256, TRNG, key protection - meets IEC60730 Class B and secure boot requirements.
Peripherals2× CAN (32 mailboxes/channel), 1× USB 2.0 FS host/function/OTG, 1× SDHI (25 MB/s), 1× QSPIX (quad-SPI fetch), 2× 12-bit S12AD (8+12 ch), CTSU (64-key matrix) - consolidates connectivity, storage, and HMI in single-chip designs.
Power & Temp2.7–3.6 V supply, four low-power modes (deep software standby with 4 KB backup RAM), –40°C to +105°C (G-version) - suitable for unregulated industrial environments.

Pinout & Package

Package: PTLG0145JC-A - 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), 9 mm × 9 mm, 0.65 mm pitch, 0.75 mm height, RoHS-compliant, lead-free matte tin finish.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1Core & analog power supplyMust be decoupled locally; AVCC0/AVCC1 supply ADC/RTC domains and require separate 100 nF + 10 µF filtering.
VBATTBackup power inputConnects to coin cell to retain RTC time, backup registers, and sub-clock oscillator during main power loss.
XTAL/EXTALMain crystal oscillator terminalsSupports 8–24 MHz external crystal; required for high-accuracy timing and USB clock derivation.
RES#Active-low reset inputPulled high externally; assertion forces hardware reset regardless of internal state or LVD condition.
USB_DP/USB_DMUSB 2.0 full-speed differential pairDirect connection to USB connector; no external termination or pull-ups needed - integrated transceiver and PHY.
SD0_CMD, SD0_CLK, SD0_DAT[0:3]SD host interface signalsSupport 1-/4-bit SD/SDIO bus; require 10 kΩ pull-ups and controlled impedance routing for 25 MB/s high-speed mode.

Key Features

Feature Design Value
Dual-bank flash architectureEnables seamless firmware updates: execute from Bank A while programming Bank B, then switch startup bank via bootloader - zero downtime OTA upgrades.
IEC60730-compliant safety suiteIncludes oscillation-stop detection, CRC accelerator, IWDT windowing, A/D self-test, and register write protection - reduces certification effort for Class B appliance control.
Capacitive touch sensing unit (CTSU)Supports mutual-capacitance matrix (17 pins → 64 keys) with built-in noise suppression - eliminates external touch controller in HMI panels and white goods interfaces.
Event Link Controller (ELC)Hardware interconnect for 99 internal events (e.g., timer overflow → A/D trigger → DMA transfer) - offloads CPU, reduces latency, and improves determinism in real-time loops.
QSPIX interfaceDirect XIP (execute-in-place) capability from quad-SPI NOR flash - expands effective code space beyond on-chip flash while maintaining 120 MHz CPU performance.

Applications

Industrial HMI Panel Smart Electricity Meter

Use Scenario: Touch-enabled front-panel display with real-time energy monitoring, tariff switching, and tamper detection.

IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering (via external LCD controller), CTSU-based button/slider input, SDHI for firmware logging, and RTC for billing timestamping.

Use Value: Integrated TSIP secures firmware updates and metering data; dual-bank flash enables remote patch deployment; 120 MHz CPU sustains 60 Hz UI refresh with background crypto and communication tasks.

Use Scenario: Revenue-grade meter with PLC/G3-PLC communication, anti-tampering sensors, and local display.

IC Role / Device Role / Timing Role: System controller managing metrology ADC interface (via S12AD), CAN/RS485 for concentrator comms, REMCa for IR command reception, and RTC with VBATT backup for accurate billing intervals.

Use Value: IEC60730 safety features satisfy EN62053-21; temperature sensor compensates metrology drift; 105°C rating ensures reliability inside sealed meter enclosures.

Home Energy Gateway Motor Drive Controller

Use Scenario: Multi-protocol gateway aggregating Zigbee, BLE, and PLC data for cloud upload via Ethernet/Wi-Fi (external PHY).

IC Role / Device Role / Timing Role: Protocol bridge MCU running multiple RTOS tasks: USB CDC for configuration, SDHI for event logs, QSPIX for secure boot image, and CAN for legacy HVAC integration.

Use Value: Hardware crypto (AES/ECC) secures OTA payloads; USB OTG allows field technician reprogramming; 145-pin I/O supports flexible peripheral expansion without FPGA.

Use Scenario: Compact inverter for BLDC/PMSM motors in HVAC compressors or pumps, requiring precise PWM, current sensing, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time motion controller generating complementary PWM (MTU3a), sampling shunt voltages (S12AD), reading chip temperature, and executing FOC algorithm with FPU acceleration.

Use Value: POE3a prevents shoot-through in gate drivers; 120 MHz CPU + FPU achieves <1 µs current loop update; CMTW timers enable precise dead-time compensation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56709HDFP#30Same RX671 Group, 100-pin LFQFP, 1.5 MB flash, 256 KB SRAM, no SDHI or QSPIXLacks SD host and quad-SPI - unsuitable for firmware-over-SD or XIP flash designsSelect when board space constraints favor QFP and SD/QSPIX are not required.
R5F566TEHDFP#30RX66T Group, 100-pin LFQFP, 120 MHz, 1 MB flash, 192 KB SRAM, optimized for motor control (3× MTU3, 3× CMTW), no TSIP or CTSUNo hardware crypto or touch sensing; enhanced PWM timing but reduced peripheral breadthSelect for cost-sensitive motor drives where security and HMI are handled externally.

Compared with R5F56719HDLE#20, the R5F56709HDFP#30 offers identical safety and timing features in smaller footprint but omits critical interfaces for storage and expansion; the R5F566TEHDFP#30 trades broad connectivity and security for deeper motor-control specialization - making R5F56719HDLE#20 optimal for integrated, secure, multi-interface industrial edge nodes.

Availability

R5F56719HDLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and motor drive controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719HDLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding real-time performance, functional safety (IEC60730), and hardware security - delivering scalable 32-bit MCUs with integrated crypto, touch, and connectivity for next-generation edge intelligence.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HDLE#20?

The R5F56719HDLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose registers, and efficient pipeline - enabling deterministic real-time response in applications like motor control and protocol processing. The R5F56719HDLE#20 maintains this speed across its 384 KB SRAM and 2 MB flash with zero-wait access below 60 MHz and one-wait access at full 120 MHz.

Does the R5F56719HDLE#20 support hardware cryptographic acceleration?

Yes, the R5F56719HDLE#20 integrates Trusted Secure IP (TSIP) with dedicated hardware engines for AES128/192/256, TDES, ARC4, RSA, ECC, SHA1/224/256, MD5, GHASH, and a true-random number generator (TRNG). These accelerate secure boot, encrypted firmware updates, and TLS stack operations - reducing CPU load and meeting IEC60730 Class B requirements. Key protection mechanisms prevent illicit copying, and all crypto operations are isolated from general memory space.

What package type and pin count does the R5F56719HDLE#20 use?

The R5F56719HDLE#20 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) with 9 mm × 9 mm body size, 0.65 mm pitch, and 0.75 mm height. It provides 111 general-purpose I/O pins (20 of which are 5-V tolerant), plus dedicated power, clock, reset, and interface signals. This package supports high-density PCB layouts while enabling full peripheral access - including USB, CAN, SDHI, and QSPIX - without signal multiplexing compromises.

Can the R5F56719HDLE#20 operate in low-power modes with RTC and backup RAM retention?

Yes, the R5F56719HDLE#20 supports four low-power modes, including deep software standby where the CPU and most peripherals halt while retaining RTC time, backup registers, and 4 KB of standby RAM powered by VBATT. In this mode, current consumption drops to microamp levels, and wake-up can occur via IRQ pins, RTC alarm, or external reset. The sub-clock oscillator (32.768 kHz) remains active, ensuring ±1 ppm timekeeping accuracy during backup operation.

What safety certifications and diagnostic features does the R5F56719HDLE#20 support?

The R5F56719HDLE#20 includes features aligned with IEC60730 Class B compliance: oscillation-stop detection, hardware CRC accelerator, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter test, memory protection unit (MPU), and register write protection. These allow runtime verification of clock integrity, memory correctness, and peripheral functionality - reducing software validation burden and supporting safety-critical industrial control applications without external monitors.

R5F56719HDLE#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
145-TFLGA
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56719HDLE#20 FAQ

1.How can I place an order for R5F56719HDLE#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56719HDLE#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56719HDLE#20 reliable?

The price and inventory of R5F56719HDLE#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719HDLE#20 is usually 5 days.

3.What payment methods are accepted for R5F56719HDLE#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719HDLE#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56719HDLE#20?

R5F56719HDLE#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56719HDLE#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56719HDLE#20?

For technical support, including R5F56719HDLE#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719HDLE#20 requirements.

6.How does Aetrix verify that R5F56719HDLE#20 is sourced from the original manufacturer or authorized distributors?

All R5F56719HDLE#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719HDLE#20 meets industry standards.

7.What is the process for return or replacement of R5F56719HDLE#20?

All R5F56719HDLE#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719HDLE#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56719HDLE#20 part is unused and in its original packaging.

Return procedure for R5F56719HDLE#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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