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Renesas R5F56719HDLK#20
- Part No.:
- R5F56719HDLK#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 145-TFLGA
- Datasheet:
-
R5F56719HDLK#20.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 145TFLGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,727
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Product details
Overview
R5F56719HDLK#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and connected appliance control systems.
For engineers reviewing the R5F56719HDLK#20 datasheet, R5F56719HDLK#20 pinout, R5F56719HDLK#20 application, or R5F56719HDLK#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, CRC, IWDTa, self-diagnostic A/D), real-time clock with battery backup, and 12-bit dual-unit A/D converter supporting analog input disconnection detection.
Technical Context
The R5F56719HDLK#20 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDTa oscillator - enabling independent watchdog operation during deep software standby.
Peripheral architecture includes DMACAb (8-channel), EXDMACa (2-channel), DTCb (1-channel), and ELC for event-driven inter-module coordination. The MCU supports full-speed USB 2.0 (host/function/OTG), two CAN 2.0B channels (32 mailboxes each), and QSPIX for serial flash execution - all synchronized to configurable PCLKA/PCLKB domains up to 120 MHz and 60 MHz respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max - delivers 707 CoreMark; supports little/big-endian data and double-precision FPU per IEEE-754. |
| Memory | 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait @120 MHz), 4 KB standby RAM. |
| Package & Pins | PTLG0145JC-A: 145-pin TFLGA, 9 × 9 mm, 0.65-mm pitch; 111 general-purpose I/O pins with 5-V tolerance and open-drain capability. |
| Analog Peripherals | Dual 12-bit S12AD units (8 + 12 channels); conversion time 0.48 µs/channel; self-diagnostic and analog disconnection detection enabled. |
| Security & Safety | Trusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, TRNG, SHA256; MPU (8 regions), IEC60730 compliance functions (CRCA, oscillation-stop detection). |
| Communication | USB 2.0 FS (host/function/OTG), 2× CAN, 13× SCI (SCIk/SCIh/SCIm), 3× RSPId, 1× RSPIA, 1× QSPIX, 3× RIIC/RIICHS (up to 3.4 Mbps), SDHI (25 MB/s). |
| Timers & RTC | MTU3a (9 channels), TPUa (6 channels), CMT/CMTW, TMRb; RTC with battery backup, time capture on 3 pins, leap-year/30-sec adjustment. |
Pinout & Package
PTLG0145JC-A: 145-pin Thin Fine-Pitch Land Grid Array, 9 × 9 mm body, 0.65-mm pitch, 0.8-mm height, RoHS-compliant, lead-free matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core/analog domain supplies (2.7–3.6 V); separate AVCC domains enable noise-isolated ADC operation. |
| VBATT | Backup power input | Supplies RTC, backup registers, and sub-clock oscillator when main VCC drops - enables calendar continuity. |
| XTAL / EXTAL | Main crystal oscillator terminals | Support 8–24 MHz external crystal; paired with internal PLL for stable 120-MHz system clock generation. |
| RTCIN / RTCOUT | Sub-clock oscillator terminals | Connect 32.768-kHz crystal for battery-backed RTC; low-power timing source independent of main clock. |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY; supports host/function/OTG without pull-up resistors. |
| TXD0 / RXD0 | SCI0 asynchronous serial interface | Configurable as UART, LIN, or smart-card interface; supports baud-rate generation via TMR and event linking. |
| CTX0–CTX16 | Capacitive touch sensing inputs | Support self-capacitance (17 keys) or mutual-capacitance matrix (64 keys); integrated CTSU reduces external component count. |
| SDCLK / SDCMD / SDDAT0–3 | SD host interface signals | 1- or 4-bit SD bus interface compliant with SD Physical Layer Spec v3.01; supports high-speed mode (25 MB/s). |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed - no system interruption required. |
| IEC60730-compliant safety suite | Includes hardware CRC accelerator (CRCA), independent watchdog (IWDTa), oscillator stoppage detection, and A/D self-test - certified for Class B appliance control. |
| QSPIX serial flash interface | Fetches code directly from external quad-SPI flash (8/16/24/32-bit addressing); supports extended/dual/quad protocols - replaces parallel NOR for compact boot storage. |
| Event Link Controller (ELC) | Routes 99 internal peripheral events (e.g., timer match, A/D completion) to trigger actions (e.g., DMA start, pin toggle) without CPU intervention - reduces latency and ISR overhead. |
| Capacitive touch sensing unit (CTSUa) | Single-chip solution for touch HMI: supports mutual-capacitance matrix up to 17×4 (64 keys) with built-in noise rejection - eliminates external touch controller IC. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Touch-enabled local operator interface for PLC-controlled machinery with real-time status display and parameter adjustment. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving LCD via GPIO/SSIE, managing capacitive touch input, and logging data to SD card via SDHI. Use Value: Integrated CTSU and SDHI eliminate external touch controller and SD PHY, reducing BOM cost and PCB area by >15% versus discrete solutions. | Use Scenario: Revenue-grade electricity meter requiring tamper detection, secure firmware updates, and communication over CAN/LIN to gateway. IC Role / Device Role / Timing Role: System controller handling metrology interface (via SPI), secure key storage (TSIP), CAN messaging, and RTC-backed time-stamped event logging. Use Value: Dual-bank flash enables field firmware upgrades without service interruption; TSIP AES256 and MPU prevent unauthorized firmware modification or data extraction. |
| Home Appliance Control | Building Automation Node |
Use Scenario: Central control unit for HVAC system integrating temperature sensor, fan motor PWM, and remote IR command reception. IC Role / Device Role / Timing Role: Real-time coordinator using MTU3a for 3-phase inverter PWM, REMCa for NEC/RC-5 IR decoding, and internal temp sensor for thermal management. Use Value: On-die temperature sensor calibrated to ±1°C eliminates external thermistor and signal conditioning - simplifies thermal monitoring design. | Use Scenario: Distributed sensor node in楼宇管理系统 collecting occupancy, ambient light, and CO₂ data, then reporting via CAN bus. IC Role / Device Role / Timing Role: Low-power edge processor running in deep software standby between sensor reads; wakes on RTC alarm or CAN message to process and forward data. Use Value: Four low-power modes plus VBATT-backed RTC allow >10-year battery life in wireless nodes; CAN interface ensures interoperability with legacy BMS infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56718HDLK#20 | Same RX671 Group, identical package (PTLG0145JC-A), but with 1.5 MB code flash and 256 KB SRAM instead of 2 MB/384 KB. | Suitable for cost-sensitive designs where firmware footprint <1.5 MB and RAM usage <256 KB; lacks margin for future feature expansion. | Select when BOM cost reduction is prioritized over headroom for OTA updates or complex GUI stacks. |
| R5F566TEADFP#30 | RX66T Group part in 100-pin LQFP; 160 MHz CPU, 1 MB flash, 256 KB RAM, focused on motor control (3-channel MTU3, 3-phase PWM), no SDHI or QSPIX. | Optimized for inverter drives and servo control; lacks SD host, USB, and capacitive touch - unsuitable for HMI or data logging roles. | Choose only for motor-centric applications requiring higher PWM resolution and faster computation; not a functional substitute for R5F56719HDLK#20. |
Compared with R5F56719HDLK#20, the R5F56718HDLK#20 offers reduced memory resources at lower cost but sacrifices firmware update flexibility and GUI capability, while the R5F566TEADFP#30 trades HMI/peripheral richness for motor-control specialization - neither provides drop-in replacement capability due to differing peripheral sets and package footprints.
Availability
R5F56719HDLK#20 is available at Aetrix Electronics and suitable for industrial HMI, smart energy metering, and building automation systems requiring stable component supply, long-term lifecycle support, and automotive-grade reliability under –40°C to +105°C operation.
Supply support for R5F56719HDLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets since its 2010 formation from NEC Electronics and Renesas Technology.
The RX671 Group - including R5F56719HDLK#20 - was designed specifically for high-integrity industrial and appliance applications demanding real-time performance, functional safety (IEC60730), secure firmware execution, and rich human-machine interface capabilities.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56719HDLK#20?
The R5F56719HDLK#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - making it suitable for real-time control and signal processing tasks in industrial applications.
Does the R5F56719HDLK#20 support secure firmware updates and cryptographic operations?
Yes, the R5F56719HDLK#20 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, RSA, ECC, SHA256, and a true-random number generator. Its dual-bank flash enables background firmware updates without halting execution, while MPU and register write protection prevent unauthorized code modification - fulfilling IEC60730 Class B requirements for secure appliance control.
What package type and pin count does the R5F56719HDLK#20 use?
The R5F56719HDLK#20 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array with 9 × 9 mm body size and 0.65-mm pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, supporting flexible interfacing with legacy peripherals and sensors in industrial environments.
Can the R5F56719HDLK#20 interface directly with SD cards and serial flash memory?
Yes, the R5F56719HDLK#20 includes a dedicated SD host interface (SDHI) supporting 1- and 4-bit buses at up to 25 MB/s (high-speed mode), compliant with SD Physical Layer Spec v3.01. It also features QSPIX - a quad-SPI memory interface enabling direct code execution from external serial flash, eliminating need for external XIP memory controllers.
How does the R5F56719HDLK#20 handle low-power operation and battery backup?
The R5F56719HDLK#20 supports four low-power modes including deep software standby, where only RTC, backup registers, and sub-clock oscillator remain active. When main VCC drops, the VBATT pin sustains these functions using an external coin cell - preserving real-time clock accuracy and critical state across power interruptions in smart meters and portable industrial tools.
R5F56719HDLK#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 145-TFLGA
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 113
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56719HDLK#20 FAQ
1.How can I place an order for R5F56719HDLK#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56719HDLK#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56719HDLK#20 reliable?
The price and inventory of R5F56719HDLK#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56719HDLK#20 is usually 5 days.
3.What payment methods are accepted for R5F56719HDLK#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56719HDLK#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56719HDLK#20?
R5F56719HDLK#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56719HDLK#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56719HDLK#20?
For technical support, including R5F56719HDLK#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56719HDLK#20 requirements.
6.How does Aetrix verify that R5F56719HDLK#20 is sourced from the original manufacturer or authorized distributors?
All R5F56719HDLK#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56719HDLK#20 meets industry standards.
7.What is the process for return or replacement of R5F56719HDLK#20?
All R5F56719HDLK#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56719HDLK#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56719HDLK#20 part is unused and in its original packaging.
Return procedure for R5F56719HDLK#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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