Renesas R5F56719HDNE#30

Overview

R5F56719HDNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing unit - deployed in industrial HMI, smart metering, and connected appliance control systems.

For engineers reviewing the R5F56719HDNE#30 datasheet, R5F56719HDNE#30 pinout, R5F56719HDNE#30 application, or R5F56719HDNE#30 equivalent, key selection criteria include its 120-MHz real-time performance (707 CoreMark), IEC60730-compliant safety features (TSIP, MPU, self-diagnostic A/D), 114 GPIOs with 5-V tolerance, and support for battery-backed RTC and deep software standby modes.

Technical Context

The R5F56719HDNE#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It integrates a memory protection unit (MPU) with eight configurable regions (min. 16-byte granularity) and supports little- or big-endian data arrangement.

Clock architecture includes main crystal oscillator (8–24 MHz), sub-clock (32.768 kHz), internal HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated 120-kHz oscillator. Peripheral clocks are independently configurable: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU/RSPI/RIICHS), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz per A/D unit.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 mm × 20 mm body, 0.50 mm pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56709HDNE#30, the R5F56719HDNE#30 provides 100% more flash for complex GUI or secure firmware storage; versus R5F566TEADFP#30, it trades raw motor-control timing precision for broader HMI, connectivity, and security capabilities - making it superior for integrated appliance or building controller designs requiring both control and user-facing functionality.

Availability

R5F56719HDNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and building automation systems requiring stable component supply, long-term lifecycle assurance, and full documentation traceability.

Supply support for R5F56719HDNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including the R5F56719HDNE#30 - is engineered for high-integrity industrial applications demanding real-time responsiveness, functional safety (IEC60730), cryptographic security, and rich human-machine interface capability.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HDNE#30?

The R5F56719HDNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM at full speed - enabling deterministic real-time execution in demanding industrial control loops.

Does the R5F56719HDNE#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719HDNE#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, RSA, ECC, SHA256, and a true random number generator (TRNG). Keys are protected against illicit copying, and TSIP enables authenticated boot, encrypted firmware storage, and secure OTA update verification - fulfilling requirements for IEC62443-3-3 and UL 60730 Class B certification.

What package type and pin count does the R5F56719HDNE#30 use?

The R5F56719HDNE#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 mm × 20 mm body size, 0.50 mm pitch, and exposed thermal pad. It provides 114 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors - optimized for industrial PCB layouts requiring robust signal integrity and thermal management.

How does the R5F56719HDNE#30 support capacitive touch interfaces?

The R5F56719HDNE#30 integrates a dedicated Capacitive Touch Sensing Unit (CTSUa) supporting up to 17 self-capacitance keys or 64 mutual-capacitance keys using matrix scanning. It includes hardware noise cancellation, automatic calibration, and direct integration with the ELC for touch-event-triggered actions - eliminating external touch controllers and reducing BOM cost and board space in HMI applications.

What low-power modes and battery backup features does the R5F56719HDNE#30 offer?

The R5F56719HDNE#30 supports four low-power modes - Sleep, All-module Clock Stop, Software Standby, and Deep Software Standby - with typical current as low as 0.5 µA in deep standby. Battery backup via VBATT pin sustains RTC operation, sub-clock oscillator, and 4 KB standby RAM during main power loss - ensuring time-critical logging and alarm functions remain active without interruption.