Renesas R5F56719HGBP#20

Overview

R5F56719HGBP#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719HGBP#20 datasheet, R5F56719HGBP#20 pinout, R5F56719HGBP#20 application, or R5F56719HGBP#20 equivalent, this page delivers verified specifications, package mapping to PLQP0144KA-B (144-pin LFQFP), confirmed peripheral integration (CAN ×2, USB ×2, SDHI ×1), and validated alternative options for migration or second-sourcing.

Technical Context

The R5F56719HGBP#20 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and double-precision FPU supporting 21 dedicated instructions. It integrates a memory protection unit (MPU) with eight configurable regions and supports little-endian or big-endian data arrangement.

Its clock system combines external crystal (8–24 MHz), sub-clock (32.768 kHz), and internal oscillators (LOCO at 240 kHz, HOCO at 16/18/20 MHz), with independent PLLs enabling ICLK up to 120 MHz and PCLKA/PCLKB up to 120 MHz/60 MHz respectively - critical for synchronized high-speed peripherals like QSPIX and MTU3a.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B, 144-pin Low-profile Quad Flat Package (LFQFP), 20 × 20 mm body, 0.50-mm lead pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719HGBP#20, R5F56709HGBP#20 offers identical architecture and pin compatibility at lower cost for memory-constrained deployments, while R5F566TEADFP#30 trades security and connectivity for enhanced real-time PWM and analog performance - guiding selection based on firmware scalability versus motion control precision.

Availability

R5F56719HGBP#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart electricity meters, building automation gateways, and motor control edge nodes requiring stable component supply across multi-year production cycles.

Supply support for R5F56719HGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding real-time performance, functional safety (IEC60730), and secure connectivity - with R5F56719HGBP#20 positioned as the flagship variant offering maximum flash, SRAM, and peripheral integration.

FAQ

What is the maximum operating frequency and core type of the R5F56719HGBP#20?

The R5F56719HGBP#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It achieves 707 CoreMark performance and includes double-precision IEEE-754 floating-point support with 21 dedicated instructions. The core features 16 general-purpose 32-bit registers, a 72-bit accumulator, and support for both little-endian and big-endian data arrangements - all confirmed in the R01DS0373EJ0120 Rev.1.20 datasheet.

Does the R5F56719HGBP#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56719HGBP#20 integrates Trusted Secure IP (TSIP) with hardware acceleration for AES128/192/256, RSA, ECC, SHA1/224/256, MD5, GHASH, and a true-random number generator (TRNG). It includes key protection mechanisms to prevent illicit copying and supports secure boot - fulfilling IEC60730 Class B requirements and enabling authenticated, encrypted firmware updates directly on the R5F56719HGBP#20.

Which package does the R5F56719HGBP#20 use, and what are its key mechanical dimensions?

The R5F56719HGBP#20 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package (LFQFP) with 20 × 20 mm body size, 0.50-mm lead pitch, and an exposed thermal pad. This RoHS-compliant package supports standard reflow soldering profiles and provides 113 GPIOs with 5-V tolerance on 20 pins - matching the pinout defined in Table 1.2 of the R01DS0373EJ0120 datasheet.

What communication interfaces are integrated into the R5F56719HGBP#20?

The R5F56719HGBP#20 integrates CAN ×2 (ISO11898-1 compliant, 32 mailboxes per channel), USB 2.0 Full-Speed ×2 (host/function/OTG), SD host interface ×1 (25 MB/s, SD Physical Layer v3.01), QSPIX ×1 (supports extended/dual/quad-SPI), and 13 serial channels (SCIk/SCIm/SCIh). It also includes RIIC ×3, RIICHS ×1, RSPId ×3, RSPIA ×1, and RSCI ×2 - all verified in the peripheral overview of R01DS0373EJ0120 Rev.1.20.

How does the R5F56719HGBP#20 support low-power operation in battery-backed applications?

The R5F56719HGBP#20 supports four low-power modes including deep software standby, where 4 KB of standby RAM and the RTC remain active on VBATT supply. It features a dedicated 32.768 kHz sub-clock oscillator, backup register retention, and tamper detection - enabling >10-year battery life in smart meters. Voltage monitoring circuits (LVDA) with programmable thresholds (2.80–2.99 V) provide reliable brown-out detection during main supply transitions on the R5F56719HGBP#20.