Renesas R5F56719HGFB#30

Overview

R5F56719HGFB#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit. It supports USB 2.0 FS host/function/OTG, dual CAN 2.0B channels (32 mailboxes each), SD host interface (25 MB/s), QSPIX for serial flash fetching, and IEC60730-compliant safety features - deployed in industrial HMI and smart metering systems.

For engineers reviewing the R5F56719HGFB#30 datasheet, R5F56719HGFB#30 pinout, R5F56719HGFB#30 application, or R5F56719HGFB#30 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, 111 GPIOs with 5-V tolerance, dual 12-bit A/D converters (8+12 channels), TSIP encryption engine (AES128/192/256, ECC, TRNG), and deep software standby mode with 4-KB backup RAM.

Technical Context

The R5F56719HGFB#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, with independent domain clocks (ICLK up to 120 MHz, PCLKA/B/C/D up to 120/60/60/60 MHz).

Peripheral architecture includes EXDMACa (2-channel extended DMA), DTCb (1-channel data transfer controller), and ELC (event link controller) enabling hardware-triggered timer-A/D-communication sequencing without CPU intervention. The CTSUa supports both self-capacitance (17 keys) and mutual capacitance (64-key matrix) touch sensing with built-in noise suppression.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56718HGBD#30, the R5F56719HGFB#30 provides 100% more flash and 39 additional GPIOs in a larger package; versus R5F566TEHDFB#30, it trades motor-control peripherals for security, touch, and storage interfaces - making it optimal for connected, user-facing embedded systems rather than motion-critical applications.

Availability

R5F56719HGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, home automation gateways, and portable medical diagnostic devices requiring stable component supply across multi-year production cycles.

Supply support for R5F56719HGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including the R5F56719HGFB#30 - is engineered for secure, touch-enabled, and connectivity-rich industrial and consumer applications demanding real-time performance, functional safety, and long-term reliability.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HGFB#30?

The R5F56719HGFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384-KB SRAM. The R5F56719HGFB#30 maintains this throughput across its full voltage range (2.7–3.6 V) and temperature grade (–40°C to +105°C).

Does the R5F56719HGFB#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719HGFB#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, ECC, RSA, SHA256, and a true-random number generator (TRNG). It enables secure boot, encrypted firmware storage in dual-bank flash, and runtime cryptographic acceleration - all with hardware-enforced key protection to prevent extraction. These capabilities are fully utilized in the R5F56719HGFB#30's IEC60730 Class B compliance framework.

What package type and pin count does the R5F56719HGFB#30 use?

The R5F56719HGFB#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch and an exposed thermal pad. It provides 111 general-purpose I/O pins, of which 20 are 5-V tolerant, all configurable with pull-up, open-drain, and programmable drive strength. This package is confirmed in the official Renesas datasheet R01DS0373EJ0120 Rev.1.20.

Can the R5F56719HGFB#30 interface directly with SD memory cards and serial flash devices?

Yes, the R5F56719HGFB#30 includes a dedicated SD host interface (SDHI) supporting 1- and 4-bit buses at up to 25 MB/s (high-speed mode), compliant with SD Physical Layer Spec v3.01. It also features QSPIX - a quad-SPI memory interface supporting extended/dual/quad protocols - enabling direct code execution and data fetch from external serial flash. Both interfaces are natively supported in the R5F56719HGFB#30 silicon.

What touch sensing capabilities does the R5F56719HGFB#30 offer, and how are they implemented?

The R5F56719HGFB#30 integrates a Capacitive Touch Sensing Unit (CTSUa) supporting both self-capacitance (up to 17 keys on individual pins) and mutual-capacitance (up to 64 keys in matrix configuration). It includes hardware-based noise cancellation, automatic drift compensation, and programmable sensitivity - all managed without CPU overhead. This CTSUa is a fixed feature of the R5F56719HGFB#30 die and requires no external components for basic operation.