Renesas R5F56719HGFM#30

Overview

R5F56719HGFM#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719HGFM#30 datasheet, R5F56719HGFM#30 pinout, R5F56719HGFM#30 application, or R5F56719HGFM#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, CRC, IWDTa, self-diagnostic A/D), and 120-MHz deterministic timing for motor control and encrypted communication stacks.

Technical Context

The R5F56719HGFM#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals including S12AD units.

It integrates three distinct DMA controllers - DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel) - enabling concurrent background transfers across flash, SRAM, and peripherals without CPU intervention. The ELC (Event Link Controller) provides hardware-level interconnection of 99 internal event signals, allowing timer-triggered A/D conversion, PWM waveform generation, and RTC time-capture without software overhead.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin thin fine-pitch land grid array (TFLGA) package measuring 9 × 9 mm with 0.65-mm ball pitch, designed for high-density PCB layouts and thermal efficiency in industrial enclosures. It supports 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and includes dedicated power/ground balls for noise suppression in mixed-signal operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56719HGFM#30, R5F56718HGFM#30 offers identical functionality at lower memory cost but sacrifices dual-bank update flexibility, while R5F566TEADFP#30 trades security and connectivity for higher PWM precision and motor-specific timers - making it unsuitable for HMI or metering but superior for embedded motion control.

Availability

R5F56719HGFM#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, motor control gate drivers, and building automation controllers requiring stable component supply across multi-year production cycles.

Supply support for R5F56719HGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for industrial, automotive, and IoT applications.

The RX671 Group - to which R5F56719HGFM#30 belongs - was designed for secure, real-time embedded systems demanding high computational throughput, cryptographic acceleration, and rich connectivity in harsh environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F56719HGFM#30?

The R5F56719HGFM#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 707 CoreMark performance and includes double-precision IEEE-754 floating-point support. The core features 16 general-purpose 32-bit registers, two 72-bit accumulators, and a collective register bank save function for low-latency interrupt handling - all confirmed in the R01DS0373EJ0120 Rev.1.20 datasheet.

Does the R5F56719HGFM#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56719HGFM#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, RSA, ECC, SHA256, MD5, TRNG, and key protection mechanisms. Its dual-bank flash architecture enables background programming and atomic bank switching - satisfying IEC60730 Class B requirements for secure firmware updates. These capabilities are documented in Section 1.1 and Chapter 37 of the R01DS0373EJ0120 datasheet.

What package type and pin count does the R5F56719HGFM#30 use?

The R5F56719HGFM#30 uses the PTLG0145JC-A package: a 145-pin thin fine-pitch land grid array (TFLGA) with 9 × 9 mm body size and 0.65-mm ball pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant. This package variant is explicitly listed in Table 1.2 of the R01DS0373EJ0120 datasheet under "RX671 Group Comparison of Functions for Different Packages."

Which communication interfaces are integrated into the R5F56719HGFM#30?

The R5F56719HGFM#30 integrates CAN (2 channels, ISO11898-1 compliant), USB 2.0 Full-Speed host/function/OTG, SD host interface (SDHI), Quad-SPI (QSPIX), 13-channel SCI (SCIk/SCIh/SCIm), 2-channel RSCI with Manchester encoding, 3-channel RIIC/RIICHS (up to 3.4 Mbps), and 3-channel RSPId plus RSPIA. All are detailed in Sections 1.1 and 7.1 of the R01DS0373EJ0120 datasheet.

Is the R5F56719HGFM#30 suitable for applications requiring functional safety certification?

Yes, the R5F56719HGFM#30 includes hardware features required for IEC60730 Class B compliance: oscillation-stop detection, CRC accelerator, independent watchdog timer (IWDTa) with window function, self-diagnostic A/D converter, and register write protection. These are explicitly listed under "Useful functions for IEC60730 compliance" in the datasheet's Features section and elaborated in Chapter 38.