Renesas R5F56719HGFP#30

Overview

R5F56719HGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719HGFP#30 datasheet, R5F56719HGFP#30 pinout, R5F56719HGFP#30 application, or R5F56719HGFP#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features including TSIP encryption and self-diagnostic A/D, and full-speed USB + CAN coexistence for gateway-class edge devices.

Technical Context

The R5F56719HGFP#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and hardware-accelerated DSP operations. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals including S12AD units.

It integrates three distinct DMA controllers - DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel) - enabling concurrent background transfers across flash, SRAM, and peripherals without CPU intervention. The ELC (Event Link Controller) provides 99 internal event signals for direct peripheral interconnection, eliminating software overhead for time-critical sequences like PWM-triggered A/D sampling.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin thin fine-pitch land grid array (TFLGA) package measuring 9 × 9 mm with 0.65-mm pitch, designed for high-density PCB layouts and thermal efficiency in enclosed industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719HGFP#30, the R5F56709HDFP#30 reduces package size and memory but sacrifices SD/QSPIX expandability, while the R5F566TEHDFP#30 trades TSIP and storage for higher PWM channel density - making R5F56719HGFP#30 optimal for secure, storage-rich edge gateways.

Availability

R5F56719HGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, building automation gateways, and medical diagnostic peripherals requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719HGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding real-time performance, functional safety, and secure connectivity - with R5F56719HGFP#30 delivering the full feature set in a compact 9 × 9 mm TFLGA package.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HGFP#30?

The R5F56719HGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's 113-instruction set, zero-wait-state access to 384 KB SRAM at 120 MHz, and hardware multiplier/divider. The R5F56719HGFP#30 sustains this throughput across mixed workloads including floating-point math, interrupt handling, and peripheral I/O.

Does the R5F56719HGFP#30 support secure boot and cryptographic acceleration?

Yes, the R5F56719HGFP#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES128/192/256, RSA, ECC, SHA256, and a true random number generator (TRNG). These features enable secure boot verification, encrypted firmware updates, and runtime key protection. The R5F56719HGFP#30 uses TSIP to enforce trusted memory (TM) execution and prevent unauthorized code reading from flash.

What package type and pin count does the R5F56719HGFP#30 use?

The R5F56719HGFP#30 uses the PTLG0145JC-A package: a 145-pin thin fine-pitch land grid array measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 GPIOs (20 of which are 5-V tolerant), dedicated USB/SD/QSPIX pins, and separate analog/digital power domains. This package balances high I/O density with thermal performance for industrial enclosure deployment.

Can the R5F56719HGFP#30 execute code directly from external serial flash?

Yes, the R5F56719HGFP#30 supports execute-in-place (XIP) from external serial flash via its QSPIX interface. The QSPIX module handles extended, dual-, and quad-SPI protocols with configurable address width (8–32 bits), enabling fast instruction fetch without copying to internal RAM. This capability is used in the R5F56719HGFP#30 for booting and dynamic firmware loading while preserving SRAM for application data.

What safety certifications and self-test features does the R5F56719HGFP#30 include for IEC60730 compliance?

The R5F56719HGFP#30 includes hardware-based IEC60730 Class B support: oscillation-stoppage detection, frequency measurement unit, CRC accelerator, independent watchdog timer (IWDTa) with window function, and A/D converter self-diagnostic mode that generates internal reference voltages (VREFL0/VREFH0, AVSS1/AVCC1). These features are documented in the R5F56719HGFP#30 datasheet (R01DS0373EJ0120) and enable certified functional safety implementation without external components.