Renesas R5F56719HGLE#20

Overview

R5F56719HGLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F56719HGLE#20 datasheet, R5F56719HGLE#20 pinout, R5F56719HGLE#20 application, or R5F56719HGLE#20 equivalent, this page delivers verified specifications, package mapping to PLQP0144KA-B (144-pin LQFP), validated peripheral timing relationships, and two confirmed alternative MCUs with documented functional trade-offs for IEC60730-compliant embedded designs.

Technical Context

The R5F56719HGLE#20 implements the RXv3 CPU core with 113 instructions including DSP and IEEE-754 double-precision floating-point operations, supporting 707 CoreMark at 120 MHz. Its memory subsystem includes dual-bank 2 MB flash enabling background programming while executing from alternate bank, and 384 KB zero-wait-state SRAM synchronized to ICLK at full 120 MHz.

Peripherals are clocked across four independent domains: ICLK (up to 120 MHz for CPU/QSPIX), PCLKA (up to 120 MHz for MTU/RSPI/RIICHS), PCLKB (up to 60 MHz for most timers/A/D), and PCLKC/PCLKD (up to 60 MHz for S12AD units). The ELC enables hardware-triggered inter-module coordination without CPU intervention - critical for deterministic real-time response in motor control and power conversion.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50-mm lead pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719HGLE#20, the R5F56709HGLE#20 offers identical timing, packaging, and peripheral compatibility at reduced memory density, while the R5F566TEHDFP#30 trades general-purpose connectivity for specialized motor control acceleration - making the R5F56719HGLE#20 optimal for mixed-signal, multi-interface industrial edge nodes.

Availability

R5F56719HGLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and motor drive control units requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719HGLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX671 Group - including R5F56719HGLE#20 - was designed for high-integrity industrial applications demanding real-time performance, security, and rich connectivity in extended temperature environments.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HGLE#20?

The R5F56719HGLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic real-time execution in demanding industrial control loops.

Does the R5F56719HGLE#20 support secure firmware updates, and how is it implemented?

Yes, the R5F56719HGLE#20 supports secure firmware updates via its Trusted Secure IP (TSIP) module, which provides hardware-accelerated AES-256 encryption, SHA256 hashing, and true random number generation. Firmware images are decrypted and authenticated in-system before being written to the dual-bank flash - ensuring integrity and confidentiality during over-the-air or local updates.

What package type and pin count does the R5F56719HGLE#20 use?

The R5F56719HGLE#20 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm pitch and an exposed thermal pad. This package supports 113 general-purpose I/O pins, including 20 with 5-V tolerance, and is rated for operation from –40°C to +105°C (G-grade).

Can the R5F56719HGLE#20 directly interface with SD cards and serial flash memory?

Yes, the R5F56719HGLE#20 integrates a full SD host interface (SDHI) supporting 1- and 4-bit SD/SDIO buses at up to 25 MB/s, and a Quad-SPI memory interface (QSPIX) capable of executing code directly from external serial flash. Both interfaces are production-ready with built-in CRC error checking and DMA support - eliminating need for external bridge ICs.

How does the R5F56719HGLE#20 meet IEC60730 Class B safety requirements?

The R5F56719HGLE#20 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stoppage detection, CRC calculation unit, self-diagnostic A/D converter test, register write protection, and independent watchdog timer (IWDTa) with windowed refresh. These are documented in Renesas' Functional Safety Manual R01UM0577EJ0100 and validated for use in certified appliances and industrial controllers.