Renesas R5F56719HGLK#20

Overview

R5F56719HGLK#20 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit. It supports CAN (2 channels), USB 2.0 FS host/function/OTG, QSPIX for serial flash fetching, SDHI (25 MB/s), and IEC60730-compliant safety features - deployed in industrial HMI, smart metering, and connected appliance control systems.

For engineers reviewing the R5F56719HGLK#20 datasheet, R5F56719HGLK#20 pinout, R5F56719HGLK#20 application, or R5F56719HGLK#20 equivalent, key selection criteria include its 145-pin TFLGA package (7 × 7 mm, 0.50-mm pitch), -40°C to +105°C operating range (G-version), TSIP-based AES256/SHA256 encryption, and real-time clock with battery-backed operation - all validated in Rev.1.20 of R01DS0373EJ0120.

Technical Context

The R5F56719HGLK#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, dual-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator - enabling independent domain clocking: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU/RSPI), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz per A/D unit.

Peripheral architecture uses event linking (ELC) to interconnect 99 internal signals - allowing timer-triggered ADC conversions, PWM edge-aligned dead-time insertion via MTU3a, and hardware-synchronized CTSU scanning without CPU intervention. Memory subsystem includes 8-KB data flash (100,000 write cycles), 4-KB standby RAM, and ROM cache (8 KB) enabling zero-wait access at ≤60 MHz or cache-hit conditions at 120 MHz.

Key Specifications

Pinout & Package

PTLG0145KB-A: 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), 7 mm × 7 mm body, 0.50-mm ball pitch, 0.35-mm ball diameter, 0.85-mm overall height. Compliant with JEDEC MO-220, RoHS and REACH.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56709HGLK#20, the R5F56719HGLK#20 provides 1-MB more flash and 128-KB more SRAM for larger firmware and data buffering; versus R5F566TEHDFP#30, it trades motor-control specialization for broader connectivity (USB, SDHI, CTSU) and security (TSIP), making it better suited for HMI and secure IoT edge nodes.

Availability

R5F56719HGLK#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and home appliance control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719HGLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including R5F56719HGLK#20 - is designed for high-integration industrial and consumer applications demanding real-time performance, functional safety, and rich human-machine interface capabilities.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HGLK#20?

The R5F56719HGLK#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's efficient pipeline, double-precision FPU, and zero-wait-state access to 384-KB SRAM - enabling deterministic real-time response in industrial control loops and HMI rendering tasks. The R5F56719HGLK#20 sustains this speed across its full operating temperature range (-40°C to +105°C).

Does the R5F56719HGLK#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56719HGLK#20 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, ECC, RSA, and a true-random number generator (TRNG). It enables secure boot, encrypted firmware storage, and authenticated OTA updates - meeting IEC60730 Class B requirements. The R5F56719HGLK#20 also includes register write protection and memory protection unit (MPU) enforcement to prevent unauthorized code execution or memory access.

What package type and pin count does the R5F56719HGLK#20 use?

The R5F56719HGLK#20 uses the PTLG0145KB-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 7 mm × 7 mm with 0.50-mm ball pitch. It provides 113 general-purpose I/O pins, 20 of which are 5-V tolerant, plus dedicated power, clock, reset, and debug signals. This compact, thermally efficient package is optimized for high-density industrial PCB layouts.

Can the R5F56719HGLK#20 operate with battery backup for real-time clock functionality?

Yes, the R5F56719HGLK#20 supports battery-backed RTC operation via the VBATT pin. When main VCC drops, VBATT supplies the backup domain - sustaining the 32.768-kHz sub-clock oscillator, RTC counter, and 32 backup registers. This allows uninterrupted timekeeping and calendar functions during power loss, critical for energy metering, alarm systems, and data-logging applications using the R5F56719HGLK#20.

Which communication interfaces are integrated into the R5F56719HGLK#20 for industrial connectivity?

The R5F56719HGLK#20 integrates multiple industrial-grade interfaces: two CAN 2.0B channels (32 mailboxes each), USB 2.0 Full-Speed host/function/OTG, SD host interface (25 MB/s), QSPIX for serial flash, three I²C channels (including RIICHS at 3.4 Mbps), and up to 13 SCI channels supporting LIN and smart-card modes. These enable robust fieldbus integration, local storage, secure firmware loading, and sensor/actuator communication - all supported natively by the R5F56719HGLK#20 without external bridge ICs.