Renesas R5F56719HGNE#30

Overview

R5F56719HGNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing-designed for industrial HMI, smart metering, and secure IoT edge nodes requiring real-time control and cryptographic acceleration.

For engineers reviewing the R5F56719HGNE#30 datasheet, R5F56719HGNE#30 pinout, R5F56719HGNE#30 application, or R5F56719HGNE#30 equivalent, key selection criteria include its 120-MHz deterministic real-time performance, TSIP-based AES256/SHA256/TRNG security engine, 12-bit dual A/D converter with self-diagnostic capability, and 114 GPIOs with 5-V tolerance-critical for robust field-deployed embedded systems.

Technical Context

The R5F56719HGNE#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, enabling precise timing across multiple domains (ICLK up to 120 MHz, PCLKA/B up to 120/60 MHz).

Peripheral subsystems are tightly coupled via the Event Link Controller (ELC) for zero-CPU-intervention triggering-e.g., MTU3a PWM outputs can directly initiate S12AD conversions, while CTSUa touch events trigger interrupt or DMA transfers. The dual-bank flash supports background programming and safe firmware updates without halting execution.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin LQFP, 20 × 20 mm body, 0.50-mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56719HGNE#30, the R5F56709HGF#30 reduces memory and I/O for cost-sensitive CAN nodes, while the R7FA6M2AF3CFP#AA0 shifts to Arm architecture with software-defined security-making R5F56719HGNE#30 uniquely balanced for legacy RX-based designs needing integrated touch, crypto, and SD storage.

Availability

R5F56719HGNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, secure IoT gateways, and motor control edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56719HGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group-including R5F56719HGNE#30-is designed for high-reliability industrial edge devices demanding real-time determinism, functional safety compliance (IEC60730), and hardware-accelerated security without sacrificing peripheral richness.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56719HGNE#30?

The R5F56719HGNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F56719HGNE#30 sustains this throughput across real-world workloads involving floating-point math, interrupt handling, and peripheral I/O-verified in Renesas' official R01DS0373EJ0120 datasheet.

Does the R5F56719HGNE#30 support secure boot and cryptographic operations in hardware?

Yes, the R5F56719HGNE#30 integrates the Trusted Secure IP (TSIP) module, providing hardware-accelerated AES128/192/256, SHA256, TRNG, ECC, and MD5. It supports secure key storage with prevention of illicit copying and enables certified secure boot via ROM-based bootloader validation. These capabilities are documented in the R5F56719HGNE#30 datasheet section "Encryption function" and meet IEC60730 Class B requirements without external security ICs.

What package type and pin count does the R5F56719HGNE#30 use?

The R5F56719HGNE#30 uses the PLQP0144KA-B package: a 144-pin LQFP with 20 × 20 mm body size and 0.50-mm pitch. It provides 114 general-purpose I/O pins, of which 20 are 5-V tolerant, along with dedicated power, clock, reset, and debug signals. This industrial-grade package is specified in Table 1.2 of the R5F56719HGNE#30 datasheet (R01DS0373EJ0120 Rev.1.20) and supports reflow soldering per JEDEC J-STD-020.

Can the R5F56719HGNE#30 execute firmware updates without interrupting real-time operation?

Yes, the R5F56719HGNE#30 supports seamless firmware updates via its dual-bank flash architecture and background operation (BGO) capability. Code can be programmed into one bank while the CPU executes from the other, and startup bank selection is switchable via register. This enables atomic firmware activation with zero downtime-essential for R5F56719HGNE#30 deployments in unattended industrial equipment, as confirmed in the "On-chip code flash memory" section of the official datasheet.

Which communication interfaces with hardware acceleration are integrated into the R5F56719HGNE#30?

The R5F56719HGNE#30 integrates CAN (2 channels, ISO11898-1 compliant), USB 2.0 Full-Speed host/function/OTG with on-chip PHY, SD host interface (25 MB/s), QSPIX for serial flash fetching, and RIICHS (3.4 Mbps I²C). All are implemented with dedicated DMA channels (DMACAb, EXDMACa, DTCb) and ELC event linking-enabling concurrent high-bandwidth transfers without CPU intervention. These interfaces are fully detailed in the R5F56719HGNE#30 datasheet's "Communication function" section.