Renesas R5F5671CDDFB#30

Overview

R5F5671CDDFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and secure IoT edge nodes.

For engineers reviewing the R5F5671CDDFB#30 datasheet, R5F5671CDDFB#30 pinout, R5F5671CDDFB#30 application, or R5F5671CDDFB#30 equivalent, key selection criteria include its 144-pin LFQFP package, -40°C to +85°C temperature grade, TSIP-based AES256/SHA256 encryption, 12-bit dual A/D converter (20-channel total), and real-time clock with battery-backed operation.

Technical Context

The R5F5671CDDFB#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and hardware-accelerated 32×32→64-bit multiply and 32÷32 division. Its memory subsystem includes 2 MB code flash (1-wait at 120 MHz), 8 KB data flash (100k erase cycles), and 384 KB zero-wait SRAM - all accessible via a 4-Gbyte linear address space with MPU-enforced protection across eight configurable regions.

Peripheral timing is decoupled: ICLK runs at 120 MHz for CPU and QSPIX; PCLKA at up to 120 MHz for MTU/RSPI/RIICHS; PCLKB at up to 60 MHz for most peripherals including S12AD unit 0 (ADCLK); and PCLKC/PCLKD at up to 60 MHz for S12AD units 0 and 1 respectively. The ELC enables direct hardware interconnection of 99 internal event signals - eliminating CPU intervention for timer-triggered ADC conversions or PWM waveform synchronization.

Key Specifications

Pinout & Package

PLQP0144KA-B is a 144-pin Low-profile Quad Flat Package (LFQFP) with 20 × 20 mm body, 0.50-mm lead pitch, and exposed thermal pad. Pin functions are defined per Renesas R01DS0373EJ0120 Rev.1.20, Table 1.2 (page 12) and Section 5 (Pin Functions), supporting 113 general-purpose I/O pins with 5-V tolerance on 20 pins, open-drain capability, and programmable pull-up resistors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CDDFB#30, the R5F5670EDDFB#30 reduces memory and peripheral count for cost-sensitive designs, while the R5F566TEADFP#30 trades security and HMI features for deterministic motor control - making R5F5671CDDFB#30 the only option combining full IEC60730 compliance, capacitive touch, and SD/QSPIX in a 144-pin industrial-grade package.

Availability

R5F5671CDDFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure IoT edge gateway applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CDDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding functional safety (IEC60730), secure firmware execution (TSIP), and rich human-machine interface capabilities - with R5F5671CDDFB#30 representing its highest-integration 144-pin variant.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CDDFB#30?

The R5F5671CDDFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 32×32→64-bit hardware multiplier, and efficient pipeline design - enabling deterministic real-time response in industrial control loops and HMI rendering tasks executed by the R5F5671CDDFB#30.

Does the R5F5671CDDFB#30 support secure boot and cryptographic acceleration?

Yes, the R5F5671CDDFB#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES128/192/256, RSA, ECC, SHA256, and TRNG - enabling secure boot, firmware authentication, and encrypted data storage. Unlike software-only implementations, TSIP isolates key material and performs operations in protected logic, meeting requirements for IEC60730 Class C and PSA Level 1 certification - a core capability of the R5F5671CDDFB#30.

What package type and pin count does the R5F5671CDDFB#30 use?

The R5F5671CDDFB#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.50-mm lead pitch, and exposed thermal pad. It provides 113 general-purpose I/O pins, 20 of which are 5-V tolerant - matching the mechanical and thermal requirements of industrial PCB layouts where the R5F5671CDDFB#30 is deployed.

Can the R5F5671CDDFB#30 execute code directly from external serial flash memory?

Yes, the R5F5671CDDFB#30 supports Execute-in-Place (XIP) from external serial flash via its QSPIX interface, which implements extended SPI, dual-SPI, and quad-SPI protocols. With address widths up to 32 bits and hardware prefetch, the R5F5671CDDFB#30 boots and runs applications directly from external NOR flash - reducing on-chip memory pressure and enabling flexible firmware partitioning.

What is the role of the Event Link Controller (ELC) in the R5F5671CDDFB#30?

The Event Link Controller (ELC) in the R5F5671CDDFB#30 enables direct hardware-level interconnection of 99 internal peripheral events - such as TPU output compare match triggering an ADC conversion start - without CPU intervention. This reduces interrupt latency, lowers CPU load, and improves determinism in time-critical applications like motor control or synchronized sensor sampling, forming a foundational feature of the R5F5671CDDFB#30's real-time architecture.