Renesas R5F5671CDDLE#20

Overview

R5F5671CDDLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 1 MB on-chip code flash, 384 KB SRAM, and integrated CAN, USB 2.0 FS, QSPIX, SDHI, and capacitive touch sensing - deployed in industrial HMI, smart metering, and secure IoT edge nodes.

For engineers reviewing the R5F5671CDDLE#20 datasheet, R5F5671CDDLE#20 pinout, R5F5671CDDLE#20 application, or R5F5671CDDLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, dual-bank flash for safe firmware updates, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical designs.

Technical Context

The R5F5671CDDLE#20 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little- or big-endian data arrangement. Its memory subsystem includes 1 MB code flash with ROM cache (8 KB), 8 KB data flash rated for 100,000 erase/write cycles, and 384 KB zero-wait-state SRAM.

Peripheral integration centers on deterministic real-time control: MTU3a (9-channel multifunction timer), dual 12-bit S12AD converters (8+12 channels), CTSUa capacitive touch unit (17 self-capacitance keys), and security-hardened interfaces - including TSIP with TRNG, RSA/ECC acceleration, and register write protection for IEC60730 Class B compliance.

Key Specifications

Pinout & Package

Package: PTLG0145JC-A - 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), 9 × 9 mm body, 0.65-mm ball pitch, 1.0-mm height, RoHS-compliant, lead-free matte tin finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CDDLE#20, the R5F5670EDDFP#30 trades SDHI/QSPIX and larger memory for smaller size and cost, while the R5F566TEBDFP#30 abandons security and touch features entirely to maximize PWM and ADC throughput for motion control - making R5F5671CDDLE#20 uniquely balanced for secure, connected, sensor-rich industrial endpoints.

Availability

R5F5671CDDLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure IoT gateway designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CDDLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RX671 Group - to which R5F5671CDDLE#20 belongs - was designed for secure, real-time industrial edge applications demanding functional safety, cryptographic integrity, and rich human-machine interface capability.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CDDLE#20?

The R5F5671CDDLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under those conditions. This performance stems from the RXv3 CPU core's efficient pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F5671CDDLE#20 sustains this speed across its full voltage range (2.7–3.6 V) and temperature range (–40°C to +85°C), making it suitable for deterministic real-time tasks in industrial environments.

Does the R5F5671CDDLE#20 support secure boot and cryptographic operations in hardware?

Yes, the R5F5671CDDLE#20 integrates Trusted Secure IP (TSIP) with dedicated hardware accelerators for AES128/192/256, SHA256, RSA, ECC, and a true random number generator (TRNG). It supports secure boot via flash signature verification and prevents illicit key copying. These capabilities are documented in the R01DS0373EJ0120 datasheet and enable R5F5671CDDLE#20 to meet IEC62443-3-3 SL2 and IEC60730 Class B requirements without external security chips.

What package type and pin count does the R5F5671CDDLE#20 use?

The R5F5671CDDLE#20 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) with 9 × 9 mm body size and 0.65-mm ball pitch. It provides 111 general-purpose I/O pins, of which 20 are 5-V tolerant. This package is distinct from other RX671 variants (e.g., 100-pin or 64-pin options) and is explicitly assigned to the R5F5671CDDLE#20 in Renesas' ordering information and packaging drawings.

Can the R5F5671CDDLE#20 execute firmware updates in the field without interrupting operation?

Yes, the R5F5671CDDLE#20 supports background programming (BGO) and dual-bank flash architecture. This allows one bank to run active firmware while the other is reprogrammed - enabling seamless over-the-air (OTA) or local firmware updates. The R5F5671CDDLE#20 also supports boot area swapping via software, ensuring fail-safe recovery if an update fails. These features are confirmed in Section 1.1 and Chapter 26 of the R01DS0373EJ0120 datasheet.

Which communication interfaces are included on the R5F5671CDDLE#20 for industrial connectivity?

The R5F5671CDDLE#20 integrates CAN (2 channels, ISO11898-1 compliant), USB 2.0 Full-Speed host/function/OTG, SD host interface (SDHI), Quad-SPI (QSPIX), multiple SCI/RSPI channels, and I²C (RIIC/RIICHS). These interfaces support direct connection to industrial sensors, modems, SD cards, serial flash, and fieldbuses - eliminating the need for bridge ICs in gateways and meters. All are fully supported in the R5F5671CDDLE#20's 145-pin TFLGA package per Table 1.2 of the datasheet.