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Renesas R5F5671CDDNE#30

Part No.:
R5F5671CDDNE#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-WFQFN Exposed Pad
Datasheet:
AetrixR5F5671CDDNE#30.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 48WFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:416

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Product details

Overview

R5F5671CDDNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and secure IoT edge nodes.

For engineers reviewing the R5F5671CDDNE#30 datasheet, R5F5671CDDNE#30 pinout, R5F5671CDDNE#30 application, or R5F5671CDDNE#30 equivalent, this MCU delivers IEC60730-compliant safety features, TSIP-based AES256/SHA256 encryption, real-time clock with battery backup, and 114 GPIOs with 5-V tolerance - critical for deterministic control, secure firmware updates, and low-power always-on sensing.

Technical Context

The R5F5671CDDNE#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-clock domains: ICLK up to 120 MHz for CPU/QSPIX, and PCLKA/B/C/D up to 120/60/60/60 MHz respectively for peripherals including MTU3a timers, S12AD converters, and RIICHS.

Its peripheral architecture supports concurrent high-bandwidth data movement via DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel), while ELC enables hardware-triggered event chaining - eliminating CPU intervention for timer-triggered ADC sampling, PWM synchronization, or RTC alarm-driven wake-up from deep software standby mode.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max - enables 707 CoreMark performance and deterministic real-time execution.
Memory 2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k write cycles), 384 KB SRAM (no-wait @120 MHz).
FPU Double-precision IEEE-754 coprocessor - supports precise motor control math, sensor fusion, and floating-point DSP without software emulation.
Connectivity 2× CAN FD-capable channels (32 mailboxes each), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX (fetch from serial flash), 3× RIIC/RIICHS (up to 3.4 Mbps).
Analog & Timing Two 12-bit S12AD units (8+12 ch), RTC with battery backup and time capture, independent watchdog (IWDTa) with window function.
Security & Safety Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, ECC, and IEC60730 self-test functions (CRC, oscillator detection, ADC diagnostics).
Package & Temp PLQP0144KA-B (144-pin LFQFP, 20 × 20 mm, 0.5 mm pitch), –40°C to +85°C (D-version).

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50-mm pitch, exposed thermal pad, RoHS compliant.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Power supply inputs Core/analog domain supplies (2.7–3.6 V); separate AVCC pins enable noise-isolated analog operation.
VBATT Backup power input Supplies RTC, backup registers, and sub-clock oscillator during main power loss - enables tamper-resilient timekeeping.
XTAL/EXTAL Main crystal oscillator terminals Supports 8–24 MHz external crystal; paired with PLL for stable 120 MHz system clock generation.
RES# Active-low reset input Hardware reset assertion; combined with internal POR/LVD for robust power-rail monitoring and recovery.
USB_DP/USB_DM USB 2.0 full-speed differential pair Integrated transceiver eliminates external PHY - supports host/function/OTG with on-chip 2 KB buffer.
SD0_CMD, SD0_CLK, SD0_DAT0–3 SD host interface signals Direct connection to SD/SDIO cards (1-/4-bit bus); supports high-speed mode (25 MB/s) per SD Physical Layer v3.01.
QSPIX_IO0–3, QSPIX_CLK, QSPIX_CS Quad-SPI memory interface Enables XIP (execute-in-place) from external serial flash - reduces boot latency and external memory footprint.
CTSU_TX0–16, CTSU_SOU Capacitive touch sensing electrodes Self- and mutual-capacitance modes support up to 64 keys - no external RC network required.

Key Features

Feature Design Value
Dual-bank flash with BGO Enables seamless firmware updates: new image programmed in background while executing from active bank - zero downtime OTA deployment.
TSIP cryptographic engine Hardware-accelerated AES256/SHA256/ECC - secures boot authentication, encrypted storage, and TLS handshake offload without CPU overhead.
ELC-driven event chaining Links 99 internal events (e.g., TPU compare match → ADC start → DMAC transfer) - eliminates ISR latency and CPU polling in time-critical control loops.
IEC60730 Class B compliance support Includes oscillator stoppage detection, CRC calculation unit (CRCA), IWDTa windowing, ADC self-diagnostic, and register write protection - reduces functional safety certification effort.
Deep software standby with 4 KB SRAM retention Maintains context and RTC operation on VBATT only - achieves µA-level sleep current for battery-powered edge devices with instant wake-up.

Applications

Industrial HMI Panel Smart Electricity Meter

Use Scenario: Touch-enabled front-panel display with real-time energy monitoring, tariff switching, and tamper detection.

IC Role / Device Role / Timing Role: Main application controller handling capacitive touch decoding, SDHI-based log storage, RTC-backed billing timestamps, and CAN-based utility communication.

Use Value: Integrated CTSU eliminates external touch IC; dual-bank flash enables field-upgradable UI firmware; TSIP protects firmware integrity against cloning.

Use Scenario: Revenue-grade meter with metrology SoC interface, secure firmware updates, and anti-tampering features (RTC backup, voltage monitoring).

IC Role / Device Role / Timing Role: Security and communication co-processor managing AES-encrypted data transmission over CAN/RS485, secure boot, and IEC60730 diagnostic routines.

Use Value: Hardware CRC and IWDTa meet Class B requirements; 12-bit S12AD supports auxiliary sensor monitoring; VBATT-backed RTC ensures accurate billing time stamps.

Secure IoT Gateway Motor Control Edge Node

Use Scenario: Protocol-agnostic gateway aggregating BLE/Zigbee sensors, encrypting data, and forwarding via cellular or Ethernet to cloud.

IC Role / Device Role / Timing Role: Central security anchor running TLS stack, managing secure key storage in TSIP, and orchestrating USB/SDHI-based local firmware provisioning.

Use Value: TRNG + AES256 enables FIPS-compliant key generation; QSPIX allows fast boot from encrypted serial flash; RIICHS supports high-speed sensor hub interfacing.

Use Scenario: Compact BLDC drive with position feedback, current sensing, and field-oriented control (FOC) executed on-device.

IC Role / Device Role / Timing Role: Real-time motion controller using MTU3a complementary PWM with dead-time insertion, TPU-triggered ADC sampling, and FPU-accelerated Clarke/Park transforms.

Use Value: 120 MHz RXv3 + double-precision FPU achieves <1 µs FOC loop; POE3a prevents shoot-through during fault conditions; 384 KB SRAM buffers multi-axis trajectory data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F5670EDDFP#30 Same RX671 Group, 100-pin TFLGA, 1.5 MB flash, 256 KB SRAM, no SDHI or QSPIX. Lacks SD host and quad-SPI interfaces - suitable for cost-sensitive CAN/USB-only nodes without local storage or external code fetch. Select when footprint, BOM count, and flash/SRAM requirements are reduced - not drop-in compatible due to package and peripheral differences.
R5F566TEBDFP#30 RX66T Group, 100-pin TFLGA, 120 MHz, 1 MB flash, 192 KB SRAM, optimized for motor control (3× MTU3, 3× 12-bit ADC units). Higher ADC channel count and dedicated motor timer resources, but no TSIP, SDHI, or CTSU - targets inverters, not secure gateways or HMIs. Choose for pure motor control where cryptographic acceleration and touch interface are unnecessary - requires PCB redesign.

Compared with R5F5671CDDNE#30, the R5F5670EDDFP#30 reduces peripheral count and memory to lower cost and size, while the R5F566TEBDFP#30 trades security and connectivity for enhanced real-time motor control - neither offers pin-to-pin or functional equivalence without hardware and firmware adaptation.

Availability

R5F5671CDDNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure IoT gateway designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CDDNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group is designed for secure, connected industrial edge devices - integrating high-performance MCUs with hardware cryptography, functional safety features, and rich connectivity to replace discrete security + control subsystems.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CDDNE#30?

The R5F5671CDDNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose 32-bit registers, and efficient pipeline design - enabling deterministic real-time response in industrial control applications where R5F5671CDDNE#30 is deployed.

Does the R5F5671CDDNE#30 support secure boot and cryptographic operations?

Yes, the R5F5671CDDNE#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, ECC, RSA, and a true-random number generator (TRNG). It enables secure boot verification, encrypted firmware storage, and TLS offload - all without CPU intervention. These capabilities are validated in the R5F5671CDDNE#30 datasheet and are essential for meeting IEC60730 Class B and IoT device security requirements.

What package type and pin count does the R5F5671CDDNE#30 use?

The R5F5671CDDNE#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size and 0.50-mm pitch. It provides 114 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors - matching the mechanical and thermal requirements of space-constrained industrial control boards where R5F5671CDDNE#30 is integrated.

Can the R5F5671CDDNE#30 execute code directly from external serial flash memory?

Yes, the R5F5671CDDNE#30 includes a Quad-SPI memory interface (QSPIX) that supports execute-in-place (XIP) from external SPI-compatible flash. It handles extended SPI, dual-SPI, and quad-SPI protocols with selectable address widths (8–32 bits), enabling fast, low-pin-count code expansion - a key capability confirmed in the R5F5671CDDNE#30 datasheet for reducing system BOM cost and footprint.

What safety certifications and self-test features does the R5F5671CDDNE#30 support?

The R5F5671CDDNE#30 includes built-in features for IEC60730 Class B compliance: oscillation-stoppage detection, hardware CRC calculation (CRCA), independent watchdog timer (IWDTa) with windowing, ADC self-diagnostic, and register write protection. These are documented in the R5F5671CDDNE#30 datasheet and reduce validation effort for safety-critical applications such as smart meters and industrial HMIs where R5F5671CDDNE#30 serves as the primary controller.

R5F5671CDDNE#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-WFQFN Exposed Pad
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, UART/USART
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5671CDDNE#30 FAQ

1.How can I place an order for R5F5671CDDNE#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5671CDDNE#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5671CDDNE#30 reliable?

The price and inventory of R5F5671CDDNE#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671CDDNE#30 is usually 5 days.

3.What payment methods are accepted for R5F5671CDDNE#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671CDDNE#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F5671CDDNE#30?

R5F5671CDDNE#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5671CDDNE#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5671CDDNE#30?

For technical support, including R5F5671CDDNE#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671CDDNE#30 requirements.

6.How does Aetrix verify that R5F5671CDDNE#30 is sourced from the original manufacturer or authorized distributors?

All R5F5671CDDNE#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671CDDNE#30 meets industry standards.

7.What is the process for return or replacement of R5F5671CDDNE#30?

All R5F5671CDDNE#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671CDDNE#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5671CDDNE#30 part is unused and in its original packaging.

Return procedure for R5F5671CDDNE#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F5671CDDNE#30 Tags

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