Renesas R5F5671CDGBP#20

Overview

R5F5671CDGBP#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and connected appliance control systems.

For engineers reviewing the R5F5671CDGBP#20 datasheet, R5F5671CDGBP#20 pinout, R5F5671CDGBP#20 application, or R5F5671CDGBP#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant safety features including self-diagnostic A/D and oscillation-stop detection.

Technical Context

The R5F5671CDGBP#20 implements the RXv3 CPU core with 16×32-bit general-purpose registers, double-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. It supports little-endian or big-endian data arrangement and executes 113 instructions including DSP and floating-point operations.

Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator, with independent domain clocks: ICLK (up to 120 MHz), PCLKA (120 MHz for MTU/RSPI), PCLKB (60 MHz for most peripherals), and ADCLK (60 MHz for both S12AD units). The device uses separate power domains for backup operation (VBATT-supported RTC and standby RAM).

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 mm × 9 mm, 0.65 mm pitch, 145-terminal land grid array with exposed thermal pad. Pinout validated per Renesas R01DS0373EJ0120 Rev.1.20, Table 1.2 and Section 4.1 (Pin Functions).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CDGBP#20, the R5F5671EHDFP#30 trades extended temperature and backup power capability for pin-compatible QFP layout, while the R5F566TEADFP#30 shifts focus from connectivity-rich control to high-precision motor timing - neither is pin- or firmware-compatible, but both serve adjacent industrial segments with distinct peripheral priorities.

Availability

R5F5671CDGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and building automation applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.

Supply support for R5F5671CDGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding security, connectivity, and real-time performance - designed specifically for smart meters, factory HMIs, and networked appliances requiring IEC60730 compliance and rich peripheral integration.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F5671CDGBP#20?

The R5F5671CDGBP#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 707 CoreMark performance and includes double-precision IEEE-754 floating-point support, 16 general-purpose 32-bit registers, and a collective register bank save function for low-latency interrupt handling - all confirmed in the R01DS0373EJ0120 datasheet Section 1.1.

Does the R5F5671CDGBP#20 support secure firmware updates and cryptographic acceleration?

Yes, the R5F5671CDGBP#20 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, SHA256, RSA, ECC, and a true random number generator (TRNG). It supports secure boot, encrypted firmware updates, and key protection - explicitly documented in Section 1.1 and Section 27 of the R01DS0373EJ0120 datasheet as part of its IEC60730 Class B qualification.

What package type and pin count does the R5F5671CDGBP#20 use?

The R5F5671CDGBP#20 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 mm × 9 mm with 0.65 mm pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and includes dedicated VBATT, RTCIN, USB_DP/DM, and QSPIX_IO[3:0] pins - verified in Table 1.2 and Figure 4.1 of the R01DS0373EJ0120 datasheet.

Can the R5F5671CDGBP#20 interface directly with SD memory cards and serial flash devices?

Yes, the R5F5671CDGBP#20 includes a full SD host interface (SDHI) supporting 1-/4-bit buses and high-speed mode (25 MB/s), compliant with SD Physical Layer Spec v3.01. It also features QSPIX - a dedicated quad-SPI interface enabling execute-in-place (XIP) from external serial flash memory - both confirmed in Sections 1.1 and 22–23 of the R01DS0373EJ0120 datasheet.

What low-power capabilities does the R5F5671CDGBP#20 offer for battery-backed applications?

The R5F5671CDGBP#20 supports four low-power modes including deep software standby, where 4 KB of standby RAM and the RTC remain active on VBATT supply at <1 µA. It also integrates a sub-clock oscillator for 32.768 kHz RTC operation and battery voltage monitoring - detailed in Sections 1.1, 7.3, and 12.2 of the R01DS0373EJ0120 datasheet for energy meter and portable HMI use cases.