Renesas R5F5671CDGFB#30

Overview

R5F5671CDGFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671CDGFB#30 datasheet, R5F5671CDGFB#30 pinout, R5F5671CDGFB#30 application, or R5F5671CDGFB#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, CRC, IWDT, self-diagnostic A/D), and full-speed USB + SDHI + CAN coexistence for edge-node connectivity.

Technical Context

The R5F5671CDGFB#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and double-precision FPU supporting 21 dedicated instructions. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator - enabling independent timing domains for ICLK (up to 120 MHz), PCLKA/B/C/D (up to 120/60/60/60 MHz), and FCLK/BCLK (up to 60 MHz).

Peripheral subsystems are tightly coupled via Event Link Controller (ELC) with 99 internal event signals, allowing hardware-triggered timer starts, A/D conversions, and DMA transfers without CPU intervention. The MCU supports IEC60730 Class B compliance through oscillation-stop detection, CRC acceleration, register write protection, and A/D self-diagnostic modes using internal reference voltages.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) package measuring 9 × 9 mm with 0.65-mm pitch, designed for high-density PCB layouts and thermal efficiency in industrial enclosures. It provides 111 programmable I/O pins, including 20 with 5-V tolerance, 113 pull-up resistors, and full open-drain capability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CDGFB#30, R5F5671EHDFB#30 offers identical functionality in a larger, more manufacturable package, while R5F566TEADFP#30 trades connectivity for higher-resolution PWM and motor-specific peripherals - making the former a drop-in layout alternative and the latter a functional substitute only in motor-control-dominant systems.

Availability

R5F5671CDGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, building automation, and portable medical devices requiring stable component supply, long-term lifecycle support, and IEC60730-certifiable silicon.

Supply support for R5F5671CDGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is part of Renesas' RX family of 32-bit MCUs, designed specifically for industrial equipment, smart meters, and HMI applications demanding high performance, security, functional safety, and rich connectivity in compact packages.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CDGFB#30?

The R5F5671CDGFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic real-time response in industrial control loops and UI rendering tasks executed by the R5F5671CDGFB#30.

Does the R5F5671CDGFB#30 support secure firmware updates and cryptographic operations?

Yes, the R5F5671CDGFB#30 integrates Trusted Secure IP (TSIP) with hardware acceleration for AES128/192/256, ECC, SHA1/224/256, MD5, and true random number generation. Key protection mechanisms prevent illicit copying, and the TSIP engine enables authenticated, encrypted firmware updates stored on its 2 MB dual-bank flash - a critical capability for field-deployed devices using the R5F5671CDGFB#30.

What package type and pin count does the R5F5671CDGFB#30 use?

The R5F5671CDGFB#30 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins (20 with 5-V tolerance), 113 internal pull-up resistors, and full open-drain capability - optimized for high-density industrial PCBs where thermal performance and miniaturization are essential for the R5F5671CDGFB#30.

Can the R5F5671CDGFB#30 interface directly with SD cards and serial flash memory?

Yes, the R5F5671CDGFB#30 includes a full SD host interface (SDHI) supporting 1- and 4-bit SD/SDIO buses at up to 25 MB/s, compliant with SD Physical Layer Spec v3.01. It also features QSPIX - a dedicated Quad-SPI interface enabling XIP (execute-in-place) from external serial flash memory using extended/dual/quad-SPI protocols - both capabilities are natively supported by the R5F5671CDGFB#30 without external controllers.

How does the R5F5671CDGFB#30 meet IEC60730 Class B safety requirements?

The R5F5671CDGFB#30 meets IEC60730 Class B through integrated hardware features: oscillation-stop detection, CRC calculation unit, windowed independent watchdog timer (IWDTa), memory protection unit (MPU), register write protection, and self-diagnostic A/D converter testing using internal reference voltages. These functions are documented in Renesas' IEC60730 compliance manual for the RX671 Group and are fully implemented in the R5F5671CDGFB#30 silicon.