Renesas R5F5671CDGFP#30

Overview

R5F5671CDGFP#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit (CTSU). It supports USB 2.0 FS host/function, dual CAN 2.0B, SD host interface, QSPIX for serial flash boot, and hardware encryption via TSIP (AES128/192/256, ECC, TRNG). Used in industrial HMI, smart metering, and secure IoT edge nodes requiring real-time control and tamper-resistant firmware.

For engineers reviewing the R5F5671CDGFP#30 datasheet, R5F5671CDGFP#30 pinout, R5F5671CDGFP#30 application, or R5F5671CDGFP#30 equivalent, key selection criteria include its 144-pin LFQFP package with 113 GPIOs (20 × 20 mm, 0.5-mm pitch), -40°C to +85°C operating range (D-version), dual-bank flash for safe firmware updates, and IEC60730-compliant safety features including oscillation-stop detection, CRC accelerator, and A/D self-diagnostic.

Technical Context

The R5F5671CDGFP#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and support for both little- and big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator - enabling independent watchdog operation during deep software standby.

Peripheral subsystems are clocked across four domains: ICLK (up to 120 MHz for CPU/QSPIX), PCLKA (up to 120 MHz for MTU/RSPI/RIICHS), PCLKB (up to 60 MHz for most peripherals), and PCLKC/PCLKD (60 MHz for S12AD units). The ELC (Event Link Controller) enables 99 internal event signals to trigger timer, ADC, or DMA actions without CPU intervention - critical for deterministic real-time response.

Key Specifications

Pinout & Package

PLQP0144KA-B is a 144-pin Low-profile Quad Flat Package (LFQFP) measuring 20 × 20 mm with 0.50-mm lead pitch. It provides 113 general-purpose I/O pins, including 20 with 5-V tolerance, plus dedicated power, ground, reset, clock, and debug (JTAG/FINE) terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5671EHDFP#30, the R5F5671CDGFP#30 offers larger memory for complex GUI or encrypted firmware storage; versus R5F566TEADFP#30, it delivers mandatory TSIP and CTSU for secure, touch-enabled edge devices - making it irreplaceable in certified medical or utility applications.

Availability

R5F5671CDGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure IoT gateway designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CDGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX671 Group - including R5F5671CDGFP#30 - was designed for secure, real-time embedded applications demanding high computational throughput, cryptographic acceleration, and robust human-machine interaction, particularly in energy infrastructure and industrial automation.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CDGFP#30?

The R5F5671CDGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under standard benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384-KB SRAM - enabling deterministic execution for real-time control loops and signal processing tasks in the R5F5671CDGFP#30.

Does the R5F5671CDGFP#30 support hardware encryption and IEC60730 compliance?

Yes, the R5F5671CDGFP#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, ECC, SHA256, and a true random number generator. It also includes IEC60730 Class B compliance features such as oscillation-stop detection, CRC accelerator, independent watchdog timer with windowing, A/D converter self-diagnostic, and register write protection - all documented in the R01DS0373EJ0120 datasheet for the R5F5671CDGFP#30.

What package type and pin count does the R5F5671CDGFP#30 use?

The R5F5671CDGFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm lead pitch. It provides 113 general-purpose I/O pins (20 with 5-V tolerance), plus dedicated power, clock, reset, and JTAG/FINE debug terminals - fully detailed in Section 1.3 of the R5F5671CDGFP#30 datasheet.

Can the R5F5671CDGFP#30 boot from external serial flash memory?

Yes, the R5F5671CDGFP#30 supports booting from external serial flash via its QSPIX interface, which implements extended SPI, dual-SPI, and quad-SPI protocols. The QSPIX module operates synchronously with ICLK up to 120 MHz and supports address widths of 8, 16, 24, or 32 bits - enabling fast, secure boot from encrypted external memory in the R5F5671CDGFP#30.

What are the key differences between R5F5671CDGFP#30 and R5F5671EHDFP#30?

The R5F5671CDGFP#30 and R5F5671EHDFP#30 share identical package, peripherals, and security features, but differ in memory capacity: R5F5671CDGFP#30 has 2-MB code flash and 384-KB SRAM, while R5F5671EHDFP#30 has 1.5-MB flash and 256-KB SRAM. Both support dual-bank operation and TSIP, making R5F5671EHDFP#30 a cost-optimized alternative when firmware size permits - confirmed in Renesas document R01DS0373EJ0120 for both R5F5671CDGFP#30 and R5F5671EHDFP#30.