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Renesas R5F5671CDGNE#30
- Part No.:
- R5F5671CDGNE#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R5F5671CDGNE#30.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 48WFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:416
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Product details
Overview
R5F5671CDGNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 1 MB on-chip code flash, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.
For engineers reviewing the R5F5671CDGNE#30 datasheet, R5F5671CDGNE#30 pinout, R5F5671CDGNE#30 application, or R5F5671CDGNE#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, dual-bank flash for safe OTA updates, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical firmware.
Technical Context
The R5F5671CDGNE#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and QSPIX, and PCLKA/PCLKB up to 120 MHz/60 MHz respectively for peripherals including MTU3a timers, RIICHS (3.4 Mbps), and S12AD converters.
Its peripheral set includes two CAN channels (32 mailboxes each), one USB 2.0 FS host/function controller with 2 KB buffer, SDHI supporting 25 MB/s, and CTSUa supporting 17-key self-capacitance or 64-key mutual-capacitance touch - all coordinated via Event Link Controller (ELC) for CPU-offload event chaining without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max - enables deterministic real-time execution with 707 CoreMark performance |
| FPU | Double-precision IEEE-754 coprocessor - supports high-accuracy motor control and sensor fusion math |
| Flash Memory | 1 MB code flash with dual-bank structure - allows background programming and seamless firmware swap during runtime |
| RAM | 384 KB SRAM (no wait states at 120 MHz) + 4 KB standby RAM - retains critical state during deep software standby |
| Security | Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, and key protection - meets IEC60730 Class B requirements |
| Package | PTLG0145JC-A: 145-pin TFLGA, 9 × 9 mm, 0.65-mm pitch - supports high I/O density with 111 general-purpose pins |
| Temperature Range | –40°C to +85°C (D-version) - qualified for industrial ambient operation without derating |
Pinout & Package
PTLG0145JC-A is a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) package measuring 9 × 9 mm with 0.65-mm ball pitch, designed for compact industrial PCB layouts and thermal efficiency in enclosed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Core & analog power supply | Single 2.7–3.6 V supply; AVCC domains isolate ADC reference for noise immunity |
| VBATT | Backup power input | Enables RTC and backup registers during main power loss - supports battery-backed timekeeping |
| XTAL/EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal - provides precise timing source for USB, CAN, and SDHI synchronization |
| USB_DP/USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY - reduces BOM cost and layout complexity |
| SDCLK/SDCMD/SD0–SD3 | SD host bus signals | 4-bit SD bus interface - enables direct connection to SD cards or SDIO peripherals like Wi-Fi modules |
| QSPIX_IO0–IO3 | Quad-SPI data lines | Supports quad-SPI protocol - accelerates boot-from-flash and firmware image loading vs. standard SPI |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables atomic firmware updates with zero downtime - critical for remote industrial devices |
| Capacitive touch sensing unit (CTSUa) | Supports 17 self-capacitance keys or 64 mutual-capacitance keys - eliminates mechanical buttons in HMI designs |
| IEC60730-compliant self-test suite | Includes oscillation-stop detection, CRC-A, IWDTa, A/D self-diagnostic - satisfies Class B functional safety certification |
| Event Link Controller (ELC) | Chains 99 internal events (e.g., timer overflow → ADC trigger → DMA transfer) - removes CPU polling overhead |
| TSIP hardware crypto engine | Offloads AES256/SHA256/TRNG operations - prevents firmware tampering and enables secure OTA updates |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Touch-enabled front panel with real-time data display, local configuration, and firmware update capability. IC Role / Device Role / Timing Role: Main application processor executing RTOS, managing CTSUa touch inputs, driving LCD via parallel interface, and handling USB/SDHI for field updates. Use Value: Dual-bank flash and TSIP enable secure, fail-safe over-the-air updates; 120 MHz CPU ensures smooth GUI rendering and responsive touch latency. | Use Scenario: DIN-rail mounted electricity meter with tariff switching, tamper detection, and communication via CAN or RS-485. IC Role / Device Role / Timing Role: System controller interfacing with metrology ICs (e.g., Renesas R7F0C004), managing RTC calendar, executing IEC60730 diagnostics, and routing CAN/SCI traffic. Use Value: Integrated CAN (2 channels, 32 mailboxes) supports multi-node grid monitoring; self-diagnostic A/D and MPU ensure compliance with IEC62056 and IEC61000-4-30. |
| Home Automation Gateway | Motor Control Edge Node |
Use Scenario: Zigbee/Z-Wave to Ethernet/USB bridge aggregating sensor data and controlling lighting, HVAC, and security subsystems. IC Role / Device Role / Timing Role: Protocol translation hub using USB host for dongles, SDHI for local logging, and multiple SCI/RIIC channels for sensor interconnect. Use Value: 13-channel SCI support enables concurrent connections to legacy UART sensors; QSPIX allows fast boot from encrypted serial flash. | Use Scenario: Compact BLDC motor drive with position feedback, current sensing, and field-oriented control (FOC) execution. IC Role / Device Role / Timing Role: Real-time motor controller running FOC algorithm on RXv3 core, using MTU3a PWM outputs, S12AD for current sampling, and CMTW for precise timing. Use Value: Double-precision FPU accelerates trigonometric calculations in FOC; 0.48 µs A/D conversion enables high-bandwidth current loop closure at >20 kHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5671EDGNE#30 | Same RX671 Group, 2 MB flash (vs. 1 MB), identical pinout and peripherals | Preferred for designs requiring larger firmware image storage or dual-application partitioning | Select when firmware size exceeds 1 MB or future-proofing for feature expansion is required |
| R5F566TEADFP#30 | RX66T Group, 160 MHz, 512 KB flash, no SDHI/QSPIX, enhanced MTU3 for motor control | Optimized for single-shunt FOC motor drives; lacks touch, SD, and crypto acceleration | Choose for cost-sensitive motor-only applications where SDHI, CTSU, and TSIP are unnecessary |
Compared with R5F5671CDGNE#30, the R5F5671EDGNE#30 offers double flash capacity without layout or firmware changes, while the R5F566TEADFP#30 trades connectivity and security for higher CPU speed and motor-specific peripherals - making the R5F5671CDGNE#30 optimal for connected, secure, multi-interface industrial edge nodes.
Availability
R5F5671CDGNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home automation gateways, and motor control edge nodes requiring stable component supply across extended product lifecycles.
Supply support for R5F5671CDGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX671 Group targets industrial and consumer applications demanding high performance, functional safety, and rich connectivity - with R5F5671CDGNE#30 optimized for secure, touch-enabled edge devices needing USB, SD, CAN, and crypto acceleration.
FAQ
What is the maximum operating frequency and core type of the R5F5671CDGNE#30?
The R5F5671CDGNE#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz, delivering 707 CoreMark performance. It includes double-precision IEEE-754 floating-point support and a collective register bank save function. This specification is confirmed in the official Renesas datasheet R01DS0373EJ0120 Rev.1.20, page 1. The R5F5671CDGNE#30 achieves deterministic real-time response essential for industrial control loops and motor algorithms.
Does the R5F5671CDGNE#30 support secure firmware updates and cryptographic functions?
Yes, the R5F5671CDGNE#30 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, SHA256, TRNG, and key protection mechanisms. These features enable secure boot, encrypted firmware storage, and authenticated OTA updates - satisfying IEC60730 Class B requirements. The TSIP block is documented in Section 1.1.11 of the R01DS0373EJ0120 datasheet. R5F5671CDGNE#30 uses these capabilities to prevent illicit key copying and ensure firmware integrity in field-deployed devices.
What package type and pin count does the R5F5671CDGNE#30 use?
The R5F5671CDGNE#30 is packaged in a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) with part code PTLG0145JC-A, measuring 9 × 9 mm and featuring a 0.65-mm ball pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant. This package is explicitly listed in Table 1.2 of the R01DS0373EJ0120 datasheet. The R5F5671CDGNE#30's compact footprint supports high-density industrial PCB designs while maintaining thermal performance.
Which communication interfaces are integrated into the R5F5671CDGNE#30?
The R5F5671CDGNE#30 integrates USB 2.0 Full-Speed host/function (with OTG), two CAN 2.0B channels (32 mailboxes each), SD host interface (25 MB/s), Quad-SPI (QSPIX), three I²C channels (including RIICHS at 3.4 Mbps), 13 SCI channels, two RSCI with Manchester encoding, and RSPI/RSPIA for SPI-compatible peripherals. These are detailed in Sections 1.1.7–1.1.9 of R01DS0373EJ0120. The R5F5671CDGNE#30 leverages this multi-protocol support to serve as a central connectivity hub in heterogeneous industrial networks.
Is the R5F5671CDGNE#30 suitable for functional safety-certified applications?
Yes, the R5F5671CDGNE#30 includes dedicated features for IEC60730 Class B compliance: oscillation-stoppage detection, CRC-A accelerator, independent watchdog timer (IWDTa), A/D converter self-diagnostic, and register write protection. These are explicitly enumerated in the "Useful functions for IEC60730 compliance" section of the R01DS0373EJ0120 datasheet. The R5F5671CDGNE#30 is designed to simplify certification efforts for industrial control, smart meters, and home appliances requiring functional safety assurance.
R5F5671CDGNE#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, QSPI, SCI, SPI, UART/USART
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 33
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5671CDGNE#30 FAQ
1.How can I place an order for R5F5671CDGNE#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5671CDGNE#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5671CDGNE#30 reliable?
The price and inventory of R5F5671CDGNE#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671CDGNE#30 is usually 5 days.
3.What payment methods are accepted for R5F5671CDGNE#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671CDGNE#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5671CDGNE#30?
R5F5671CDGNE#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5671CDGNE#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5671CDGNE#30?
For technical support, including R5F5671CDGNE#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671CDGNE#30 requirements.
6.How does Aetrix verify that R5F5671CDGNE#30 is sourced from the original manufacturer or authorized distributors?
All R5F5671CDGNE#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671CDGNE#30 meets industry standards.
7.What is the process for return or replacement of R5F5671CDGNE#30?
All R5F5671CDGNE#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671CDGNE#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5671CDGNE#30 part is unused and in its original packaging.
Return procedure for R5F5671CDGNE#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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