Renesas R5F5671CHDFP#30

Overview

R5F5671CHDFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 Mbytes of on-chip code flash with dual-bank support, 384 Kbytes of zero-wait-state SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, motor control gateways, and secure IoT edge nodes.

For engineers reviewing the R5F5671CHDFP#30 datasheet, R5F5671CHDFP#30 pinout, R5F5671CHDFP#30 application, or R5F5671CHDFP#30 equivalent, key selection considerations include its 144-pin LFQFP package (PLQP0144KA-B), 120-MHz real-time performance (707 CoreMark), TSIP-based AES256/SHA256 encryption, IEC60730-compliant safety features, and hardware-accelerated remote control signal reception (REMC).

Technical Context

The R5F5671CHDFP#30 implements the RXv3 CPU core with 16×32-bit general-purpose registers, double-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. It integrates a memory protection unit (MPU) with eight configurable regions and supports little- or big-endian data arrangement.

Clock architecture includes independent PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator. Peripheral clocks are segmented: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most timers and A/D converters - enabling precise timing isolation across subsystems.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.50-mm lead pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CHDFP#30, the R5F5670EHDFP#30 reduces security and connectivity to lower cost, while the R5F566TEHDFP#30 trades touch, crypto, and SD/USB for higher motor-control timing fidelity - making R5F5671CHDFP#30 the balanced choice for secure, connected, human-interface-rich industrial edge devices.

Availability

R5F5671CHDFP#30 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure IoT edge nodes, motor control gateways, and home appliance controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CHDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for secure, connected industrial edge applications - integrating high-performance RXv3 cores, hardware cryptography (TSIP), functional safety features (IEC60730), and rich peripheral sets including CAN, USB, SDHI, and capacitive touch.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CHDFP#30?

The R5F5671CHDFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16-register file, and optimized pipeline - enabling deterministic real-time response in industrial control loops and HMI rendering tasks. The R5F5671CHDFP#30 sustains this speed across its 384 Kbytes of zero-wait-state SRAM and dual-bank flash with ROM cache hit optimization.

Does the R5F5671CHDFP#30 support secure boot and cryptographic acceleration?

Yes, the R5F5671CHDFP#30 integrates Trusted Secure IP (TSIP) hardware accelerators supporting AES128/192/256, SHA256, ECC, RSA, and a true random number generator (TRNG). These modules enable secure boot verification, encrypted firmware updates, and runtime data protection without CPU overhead. Key protection prevents illicit copying, and TSIP is certified for IEC60730 Class B compliance - making the R5F5671CHDFP#30 suitable for safety-critical and regulated IoT deployments.

What package type and pin count does the R5F5671CHDFP#30 use?

The R5F5671CHDFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm lead pitch and an exposed thermal pad. It provides 113 general-purpose I/O pins, of which 20 are 5-V tolerant, along with dedicated pins for USB, SDHI, QSPIX, CAN, and capacitive touch sensing. This package balances high peripheral density with manufacturability in industrial PCB assemblies.

Can the R5F5671CHDFP#30 interface directly with SD cards and serial NOR flash?

Yes, the R5F5671CHDFP#30 includes a full SD host interface (SDHI) supporting 1- and 4-bit SD/SDIO buses at up to 25 MB/s, compliant with SD Physical Layer Spec v3.01. It also integrates QSPIX - a dedicated quad-SPI memory interface supporting extended, dual-, and quad-SPI protocols for XIP execution and fast firmware loading from serial NOR flash. Both peripherals are hardware-controlled with DMA support, reducing CPU load during data transfers - a capability confirmed in the R01DS0373EJ0120 datasheet for the R5F5671CHDFP#30.

What low-power modes and backup capabilities does the R5F5671CHDFP#30 offer?

The R5F5671CHDFP#30 supports four low-power modes: Sleep, All-module Clock Stop, Software Standby, and Deep Software Standby - with current consumption as low as 0.5 µA in deep standby. It includes VBATT pin support to maintain RTC operation, sub-clock oscillator, and 4 Kbytes of backup SRAM during main power loss. Voltage monitoring (LVDA) with three selectable thresholds and digital filtering ensures robust brown-out detection - all documented for the R5F5671CHDFP#30 in its official datasheet Rev.1.20.