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Renesas R5F5671CHGBP#20
- Part No.:
- R5F5671CHGBP#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-TFBGA
- Datasheet:
-
R5F5671CHGBP#20.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 64TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:490
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Product details
Overview
R5F5671CHGBP#20 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit. It supports CAN 2.0B (2 channels), USB 2.0 FS host/function/OTG, SDHI, QSPIX, and 12-bit A/D converters - deployed in industrial HMI and smart appliance control systems.
For engineers reviewing the R5F5671CHGBP#20 datasheet, R5F5671CHGBP#20 pinout, R5F5671CHGBP#20 application, or R5F5671CHGBP#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical firmware.
Technical Context
The R5F5671CHGBP#20 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision floating-point coprocessor supporting 21 FP64 instructions. Its memory subsystem includes 2-MB code flash with ROM cache (8 KB), zero-wait access up to 60 MHz, and background programming/erasing capability.
Peripheral integration centers on deterministic real-time control: MTU3a (9-channel 16/32-bit timer), TPUa (6-channel 16-bit PWM), CMTW (2×32-bit compare-match timers), and ELC-driven event linking across 99 internal signals - enabling hardware-synchronized sensor sampling, motor commutation, and secure boot sequence execution without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark score - enables real-time deterministic control with low-latency ISR response. |
| Memory | 2-MB code flash (dual-bank), 384-KB SRAM, 8-KB data flash (100k erase cycles) - supports safe firmware updates and data logging without runtime interruption. |
| FPU | IEEE-754 double-precision (64-bit) - required for high-accuracy motor control algorithms and sensor fusion computations. |
| Security | Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, and key protection - meets IEC60730 Class B software safety requirements. |
| Package | TFLGA-145 (9 × 9 mm, 0.65-mm pitch) - provides 111 GPIOs with 5-V tolerance and capacitive touch sensing on 17 pins. |
| Temp Range | -40°C to +105°C (G-version) - qualified for under-hood automotive and industrial edge controller environments. |
| Peripherals | CAN 2.0B (2 ch), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX, 12-bit S12AD (20 ch total), CTSU - enables full-system integration without external co-processors. |
Pinout & Package
Package: TFLGA-145 (9 × 9 mm, 0.65-mm pitch), 145-terminal fine-pitch land grid array with exposed thermal pad. Pin 1 marked by dot; solder mask defined pads; RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Core & analog power supply | 2.7–3.6 V operation; separate analog domains ensure ADC accuracy and noise immunity. |
| VBATT | Backup power input | Enables RTC and backup registers during main power loss - critical for time-stamped event logging. |
| XTAL/EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; PLL locks to generate 120-MHz ICLK - primary system timing source. |
| RTCIN | Sub-clock oscillator input | Connects to 32.768-kHz crystal for battery-backed real-time clock with ±30-sec/year accuracy. |
| USB_DP/USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY - reduces BOM cost and layout complexity for USB device/host roles. |
| CTSU_Sx (S0–S16) | Capacitive touch sensing inputs | Self-capacitance mode supports 17 independent keys; mutual-capacitance matrix supports up to 64 keys - no external IC needed for HMI panels. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed - zero-downtime field upgrades. |
| Event Link Controller (ELC) | Hardware interconnect for 99 internal events - eliminates CPU polling and ISR overhead for timer-triggered ADC sampling or PWM dead-time insertion. |
| IEC60730 compliance support | Includes oscillation-stop detection, CRC accelerator, IWDT windowing, and A/D self-diagnostic - reduces certification effort for Class B safety applications. |
| QSPIX interface | Direct XIP (execute-in-place) from quad-SPI flash - accelerates boot time and reduces SRAM footprint for large firmware images. |
| TSIP cryptographic engine | Hardware-accelerated AES256/SHA256 with key isolation - prevents firmware cloning and enables secure OTA update authentication. |
Applications
| Industrial HMI Panel | Smart Appliance Controller |
|---|---|
Use Scenario: Touch-enabled display interface for PLC operator terminals with real-time alarm logging and parameter configuration. IC Role / Device Role / Timing Role: Main application processor executing RTOS, managing CTSU touch scanning, driving SPI LCD, and handling CAN bus diagnostics. Use Value: Integrated CTSU eliminates external touch controller; dual-bank flash enables remote firmware patching without service downtime. | Use Scenario: Washing machine main controller coordinating motor drive, water valve actuation, temperature sensing, and user interface. IC Role / Device Role / Timing Role: Central MCU running safety-certified control loop, interfacing with triac drivers via MTU3a PWM outputs and monitoring NTC sensors via S12AD. Use Value: TSIP and IEC60730 features reduce functional safety validation burden; 105°C rating ensures reliability in enclosed cabinet environments. |
| Automotive Body Control Module | Secure IoT Gateway |
Use Scenario: Door module managing window lift, mirror adjustment, and interior lighting with LIN/UART communication to central ECU. IC Role / Device Role / Timing Role: CAN/LIN node processor with hardware CRC and IWDT windowing for ASIL-B–aligned diagnostics and fault recovery. Use Value: Dual CAN channels enable redundant bus communication; -40°C to +105°C operation meets automotive under-dash thermal requirements. | Use Scenario: Edge gateway aggregating BLE/Zigbee sensor data, encrypting payloads, and forwarding via cellular or Ethernet to cloud platform. IC Role / Device Role / Timing Role: Secure host processor performing TLS handshake acceleration via TSIP, managing SDHI for local log storage, and scheduling periodic OTA checks. Use Value: Hardware TRNG and AES256 prevent key extraction; QSPIX allows encrypted firmware image storage in external flash with XIP capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5671EHGBP#20 | Same RX671 Group silicon, but 145-pin TFLGA-0.50mm pitch (7 × 7 mm); 113 GPIOs vs. 111; identical peripherals and memory. | Smaller footprint suits space-constrained designs; requires PCB redesign due to different pitch and pin assignment. | Select when board area is constrained and 0.50-mm assembly capability exists. |
| R5F566TEHDFP#30 | RX66T Group part: 160-MHz CPU, no TSIP, no CTSU, 1.5-MB flash, 256-KB SRAM, 100-pin LQFP. | Targeted at motor control only; lacks USB, SDHI, QSPIX, and security features - unsuitable for HMI or secure gateway use cases. | Consider only for cost-sensitive motor drive applications where encryption and touch are unnecessary. |
Compared with R5F5671EHGBP#20, the R5F5671CHGBP#20 offers larger PCB real estate margin and simplified 0.65-mm pitch assembly, while R5F566TEHDFP#30 trades security and connectivity for raw motor-control throughput - making the R5F5671CHGBP#20 optimal for integrated HMI+control+security applications.
Availability
R5F5671CHGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart appliance control, automotive body electronics, and secure IoT gateway designs requiring stable component supply across multi-year production cycles.
Supply support for R5F5671CHGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX671 Group targets high-integrity embedded systems requiring real-time performance, functional safety compliance (IEC60730), and rich connectivity - designed specifically for HMI, appliance, and gateway applications demanding integrated touch, encryption, and dual-bank firmware resilience.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F5671CHGBP#20?
The R5F5671CHGBP#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark. This performance level is measured under standard conditions using the EEMBC CoreMark benchmark and reflects the efficiency of the RXv3 CPU core with its 16-register bank and dual-precision FPU - directly enabling complex control algorithms in the R5F5671CHGBP#20 without external co-processing.
Does the R5F5671CHGBP#20 support secure firmware updates?
Yes, the R5F5671CHGBP#20 supports secure firmware updates via its dual-bank flash architecture and Trusted Secure IP (TSIP). The dual-bank feature allows background programming of one bank while executing from the other, ensuring zero-downtime updates. TSIP provides hardware-accelerated AES256 decryption and SHA256 signature verification - both essential for authenticated and encrypted OTA updates in the R5F5671CHGBP#20.
What package type and pin count does the R5F5671CHGBP#20 use?
The R5F5671CHGBP#20 uses a 145-pin TFLGA package with 0.65-mm pitch and 9 × 9 mm body size. It provides 111 general-purpose I/O pins, including 17 dedicated CTSU channels, 20 5-V-tolerant inputs, and integrated USB DP/DM pins - all documented in the R01DS0373EJ0120 datasheet for the R5F5671CHGBP#20.
How does the R5F5671CHGBP#20 meet IEC60730 Class B requirements?
The R5F5671CHGBP#20 meets IEC60730 Class B requirements through integrated hardware features: oscillation-stop detection, CRC calculation accelerator, windowed independent watchdog timer (IWDTa), A/D converter self-diagnostic, and register write protection. These are implemented in silicon and validated per Renesas' IEC60730 compliance documentation - reducing software certification effort for safety-critical firmware running on the R5F5671CHGBP#20.
Can the R5F5671CHGBP#20 interface directly with serial flash memory?
Yes, the R5F5671CHGBP#20 interfaces directly with serial flash memory via its QSPIX peripheral, supporting extended SPI, dual-SPI, and quad-SPI protocols. It enables execute-in-place (XIP) operation from external flash, eliminating the need to copy code to internal RAM - improving boot speed and memory efficiency for large applications on the R5F5671CHGBP#20.
R5F5671CHGBP#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-TFBGA
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5671CHGBP#20 FAQ
1.How can I place an order for R5F5671CHGBP#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5671CHGBP#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5671CHGBP#20 reliable?
The price and inventory of R5F5671CHGBP#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671CHGBP#20 is usually 5 days.
3.What payment methods are accepted for R5F5671CHGBP#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671CHGBP#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5671CHGBP#20?
R5F5671CHGBP#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5671CHGBP#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5671CHGBP#20?
For technical support, including R5F5671CHGBP#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671CHGBP#20 requirements.
6.How does Aetrix verify that R5F5671CHGBP#20 is sourced from the original manufacturer or authorized distributors?
All R5F5671CHGBP#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671CHGBP#20 meets industry standards.
7.What is the process for return or replacement of R5F5671CHGBP#20?
All R5F5671CHGBP#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671CHGBP#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5671CHGBP#20 part is unused and in its original packaging.
Return procedure for R5F5671CHGBP#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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