Renesas R5F5671CHGFB#30

Overview

R5F5671CHGFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 Mbyte on-chip code flash with dual-bank capability, 384 Kbyte SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering applications requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671CHGFB#30 datasheet, R5F5671CHGFB#30 pinout, R5F5671CHGFB#30 application, or R5F5671CHGFB#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C temperature grade (G-version), TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical designs.

Technical Context

The R5F5671CHGFB#30 implements the RXv3 CPU core with 113 instructions, including 21 double-precision floating-point operations and DSP extensions, enabling deterministic real-time execution at 707 CoreMark. Its clock architecture supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for ADC/S12AD and most peripherals.

It integrates a memory protection unit (MPU) with eight configurable regions (min. 16-byte granularity), Trusted Secure IP (TSIP) for key-protected AES128/192/256, RSA/ECC, TRNG, and GHASH, alongside hardware-accelerated CRC and self-diagnostic A/D converter functions required for IEC60730 Class B compliance in appliance and industrial control systems.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) package measuring 9 × 9 mm with 0.65-mm ball pitch, designed for high-density PCB layouts and thermal efficiency in industrial control modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CHGFB#30, the R5F5670EHGFB#30 offers identical safety and real-time features in a larger, lower-I/O package without SD/QSPIX, while the R5F572MDHDFB#30 trades TSIP and CTSU for Ethernet and higher clock speed - making R5F5671CHGFB#30 optimal for secure, touch-enabled, storage-integrated industrial controllers.

Availability

R5F5671CHGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and building automation nodes requiring stable component supply across extended product lifecycles.

Supply support for R5F5671CHGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding functional safety, secure firmware execution, and rich peripheral integration - with R5F5671CHGFB#30 optimized for G-grade environments requiring extended temperature operation and cryptographic trust anchors.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CHGFB#30?

The R5F5671CHGFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's dual-issue pipeline, on-chip 32-bit multiplier/divider, and zero-wait-state access to 384 Kbyte SRAM - enabling deterministic real-time response in motor control and protocol stack processing tasks where R5F5671CHGFB#30 is commonly deployed.

Does the R5F5671CHGFB#30 support secure firmware updates and cryptographic acceleration?

Yes, the R5F5671CHGFB#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES128/192/256, SHA256, RSA, ECC, and a true random number generator (TRNG). It supports secure boot verification and encrypted OTA updates via dual-bank flash - allowing R5F5671CHGFB#30 to validate signed firmware images before execution and prevent unauthorized code injection in safety-critical deployments.

What package type and pin count does the R5F5671CHGFB#30 use?

The R5F5671CHGFB#30 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 9 × 9 mm with 0.65-mm ball pitch. This compact, thermally efficient package supports 111 general-purpose I/O pins (20 of which are 5-V tolerant), making R5F5671CHGFB#30 suitable for space-constrained industrial control modules requiring high peripheral density and extended temperature resilience.

Which communication interfaces are integrated into the R5F5671CHGFB#30?

The R5F5671CHGFB#30 integrates CAN (2 channels, ISO11898-1 compliant), USB 2.0 Full-Speed host/function/OTG, SD host interface (25 MB/s), Quad-SPI (QSPIX), 13-channel SCI, 3-channel RSPId, 1-channel RIICHS (3.4 Mbps), and 2-channel RSCI with Manchester encoding. These interfaces allow R5F5671CHGFB#30 to serve as a central hub in multi-protocol industrial systems - for example, connecting CAN field devices, USB configuration tools, SD card logs, and SPI flash firmware storage simultaneously.

Is the R5F5671CHGFB#30 qualified for IEC60730 Class B compliance?

Yes, the R5F5671CHGFB#30 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stoppage detection, hardware CRC calculation unit, self-diagnostic A/D converter, register write protection, and voltage-monitoring reset circuits. These capabilities are documented in Renesas' Functional Safety Manual for the RX671 Group - enabling R5F5671CHGFB#30 to be certified for use in household appliances and industrial equipment where failure detection and recovery are mandatory.