Renesas R5F5671CHGFM#10

Overview

R5F5671CHGFM#10 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit. It supports CAN 2.0B (2 channels), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX for serial flash boot, and operates from 2.7–3.6 V across –40°C to +105°C.

For engineers reviewing the R5F5671CHGFM#10 datasheet, R5F5671CHGFM#10 pinout, R5F5671CHGFM#10 application, or R5F5671CHGFM#10 equivalent, key selection considerations include its G-grade industrial temperature rating, PLQP0144KA-B 144-pin LFQFP package with 113 GPIOs (20 × 5-V tolerant), TSIP-based AES256/SHA256 encryption, and IEC60730-compliant safety features including self-diagnostic A/D and oscillation-stop detection.

Technical Context

The R5F5671CHGFM#10 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision FPU supporting 21 double-precision floating-point instructions. Its memory subsystem includes dual-bank flash enabling background programming during execution and 384 KB of zero-wait-state SRAM running at full 120 MHz.

Peripherals are clocked via independent domain dividers: ICLK up to 120 MHz (CPU, QSPIX), PCLKA up to 120 MHz (MTU3a, RSPI, RIICHS), PCLKB up to 60 MHz (most timers, SCI, CMT), and dedicated ADCLKs for S12AD units. The ELC enables hardware-triggered inter-module coordination without CPU intervention - e.g., TPUa output compare triggering S12AD conversion or MTU3a PWM edge initiating RTC time capture.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-Profile Quad Flat Package (20 × 20 mm, 0.50-mm pitch), lead-free, RoHS compliant, G-grade (–40°C to +105°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CHGFM#10, the R5F5670EHGFM#10 offers reduced memory and I/O for cost-sensitive designs, while the R5F572MDHDFP#30 delivers higher CPU throughput and larger memory at the expense of touch and SD capabilities - making R5F5671CHGFM#10 optimal for balanced industrial HMI with security, connectivity, and sensing.

Availability

R5F5671CHGFM#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, automotive body controllers, and medical patient monitors requiring stable component supply, long-term lifecycle assurance, and G-grade temperature resilience.

Supply support for R5F5671CHGFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX671 Group is designed for high-integrity industrial human-machine interfaces and edge-connected devices, integrating security (TSIP), functional safety (IEC60730), and rich connectivity (CAN, USB, SDHI, QSPIX) into a single G-grade MCU platform.

FAQ

What is the maximum operating frequency and core architecture of the R5F5671CHGFM#10?

The R5F5671CHGFM#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It achieves 707 CoreMark and includes a double-precision IEEE-754 floating-point unit with 21 dedicated instructions. The core supports 113 instructions, 16 general-purpose registers, and a collective register bank save function for fast context switching - all confirmed in the R01DS0373EJ0120 Rev.1.20 datasheet.

Does the R5F5671CHGFM#10 support secure firmware updates and cryptographic operations?

Yes, the R5F5671CHGFM#10 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true-random number generator (TRNG). It prevents illicit key copying and enables secure boot and OTA updates. These features are documented in Section 1.1 and Chapter 43 of the R01DS0373EJ0120 datasheet, and are hardware-accelerated - not software-emulated - ensuring deterministic timing and side-channel resistance for the R5F5671CHGFM#10.

What package type and temperature grade does the R5F5671CHGFM#10 use?

The R5F5671CHGFM#10 uses the PLQP0144KA-B package: a 144-pin Low-Profile Quad Flat Package measuring 20 × 20 mm with 0.50-mm pitch. It is rated for the G-grade industrial temperature range of –40°C to +105°C, as specified in Table 1.1 and Section 1.3 of the R01DS0373EJ0120 datasheet. This package provides 113 GPIOs, including 20 5-V tolerant pins, and is RoHS-compliant and lead-free.

Can the R5F5671CHGFM#10 interface directly with SD cards and serial flash memory?

Yes, the R5F5671CHGFM#10 includes a full-featured SD host interface (SDHI) supporting 1-/4-bit SD/SDIO buses at up to 25 MB/s (high-speed mode), compliant with SD Physical Layer Spec v3.01. It also integrates QSPIX - a dedicated quad-SPI memory interface supporting extended/dual/quad protocols and XIP from serial flash. Both peripherals are explicitly listed in Table 1.1 and detailed in Chapters 47 (SDHI) and 48 (QSPIX) of the R01DS0373EJ0120 datasheet for the R5F5671CHGFM#10.

How many CAN channels and mailboxes does the R5F5671CHGFM#10 support?

The R5F5671CHGFM#10 supports two CAN 2.0B-compliant channels (ISO11898-1), each with 32 dedicated mailboxes - totaling 64 message buffers. This enables concurrent handling of standard and extended frames across multiple network nodes. The CAN module's mailbox structure, filtering, and interrupt mapping are fully documented in Chapter 35 of the R01DS0373EJ0120 datasheet, confirming this capability for the R5F5671CHGFM#10.