Renesas R5F5671CHGFM#30

Overview

R5F5671CHGFM#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit (CTSU), designed for industrial HMI, secure IoT edge nodes, and automotive body control modules requiring IEC60730 compliance.

For engineers reviewing the R5F5671CHGFM#30 datasheet, R5F5671CHGFM#30 pinout, R5F5671CHGFM#30 application, or R5F5671CHGFM#30 equivalent, key selection criteria include its 145-pin TFLGA package (7 × 7 mm, 0.50-mm pitch), -40°C to +105°C G-grade operation, TSIP-based AES256/SHA256 encryption, and dual-channel CAN 2.0B support with 32 mailboxes per channel.

Technical Context

The R5F5671CHGFM#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little- or big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator - enabling independent watchdog timing and RTC battery backup via VBATT.

Peripheral subsystems are clocked independently: PCLKA drives high-speed peripherals (MTU3a, RSPI, RIICHS) up to 120 MHz; PCLKB clocks timers, UARTs, and ADCs up to 60 MHz; ADCLK for S12AD units runs at up to 60 MHz. The ELC (Event Link Controller) enables hardware-triggered inter-module coordination without CPU intervention.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145KB-A), 7 × 7 mm, 0.50-mm pitch, 113 general-purpose I/O pins (20 with 5-V tolerance), 111 pull-up/resistors, 111 open-drain outputs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGFM#30, the R5F5671CHGFM#30 provides extended temperature operation critical for under-hood or enclosed industrial deployments; versus R5F566TEHGFP#30, it delivers integrated security, capacitive touch, and dual-CAN - eliminating need for external components and reducing system-level validation effort.

Availability

R5F5671CHGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, secure IoT gateways, and automotive body control modules requiring stable component supply across long production lifecycles.

Supply support for R5F5671CHGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX671 Group targets high-integrity embedded systems demanding real-time performance, functional safety (IEC60730), and hardware security - with R5F5671CHGFM#30 optimized for G-grade industrial and automotive body electronics.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F5671CHGFM#30?

The R5F5671CHGFM#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 707 CoreMark performance and includes double-precision IEEE-754 floating-point support, a memory protection unit (MPU), and 113 instructions including DSP and floating-point extensions. This architecture enables deterministic real-time execution for industrial and automotive control tasks.

Does the R5F5671CHGFM#30 support hardware encryption and IEC60730 compliance?

Yes, the R5F5671CHGFM#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, RSA, ECC, SHA256, and a true-random number generator (TRNG) with key protection. It also includes dedicated IEC60730 Class B features: oscillation-stop detection, CRC-A engine, independent watchdog timer (IWDTa) with windowing, A/D self-diagnostic, and register write protection - all confirmed in the R01DS0373EJ0120 datasheet.

What package type and temperature grade does the R5F5671CHGFM#30 use?

The R5F5671CHGFM#30 uses the PTLG0145KB-A package: a 145-pin TFLGA measuring 7 × 7 mm with 0.50-mm pitch. It is qualified for the G-grade temperature range of –40°C to +105°C, making it suitable for under-hood automotive applications and thermally demanding industrial environments where extended thermal margins are required.

How many CAN channels and mailboxes does the R5F5671CHGFM#30 support?

The R5F5671CHGFM#30 integrates two independent CAN 2.0B modules, each supporting 32 configurable mailboxes. Both channels comply with ISO11898-1 and support standard and extended frame formats. Mailbox filtering, priority arbitration, and loopback self-test modes are implemented in hardware - enabling robust multi-node network communication in automotive body control and industrial automation systems.

What is the role of the Event Link Controller (ELC) in the R5F5671CHGFM#30?

The Event Link Controller (ELC) in the R5F5671CHGFM#30 enables direct hardware-to-hardware signal routing between 99 internal peripheral events - such as MTU3a overflow, TPUa capture, or ADC completion - without CPU involvement. This reduces interrupt latency, lowers CPU load, and improves determinism in time-critical applications like motor control, touch scanning, and synchronized sensor acquisition.