Renesas R5F5671CHGFP#30

Overview

R5F5671CHGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671CHGFP#30 datasheet, R5F5671CHGFP#30 pinout, R5F5671CHGFP#30 application, or R5F5671CHGFP#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-diagnostic features for safety-critical embedded designs.

Technical Context

The R5F5671CHGFP#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and QSPIX, and PCLKA/PCLKB up to 120 MHz/60 MHz for peripherals including MTU3a timers, S12AD converters, and RIICHS I²C.

Its peripheral architecture includes EXDMACa (2-channel extended DMA), DTCb (1-channel data transfer controller), and ELC (event link controller) enabling hardware-triggered inter-module coordination - critical for deterministic timing in motor control and real-time communication stacks like CAN FD and USB CDC.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin thin fine-pitch land grid array (TFLGA) package measuring 9 × 9 mm with 0.65-mm ball pitch, optimized for high-density PCB layouts and thermal dissipation in sealed enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5671CHGFP#30, the R5F5670EHGFP#30 trades TSIP and 500 KB flash for lower cost, while the R5F566TEHGFP#30 prioritizes motor-control peripherals over connectivity and security - making R5F5671CHGFP#30 uniquely balanced for secure, connected industrial edge devices.

Availability

R5F5671CHGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, automotive body electronics, and PLC I/O hub applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671CHGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group is designed for secure, real-time industrial edge devices - integrating high-performance computing, comprehensive connectivity (CAN, USB, SD, QSPI), and IEC60730-compliant safety features in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671CHGFP#30?

The R5F5671CHGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark performance. This benchmark reflects its RXv3 CPU core efficiency, double-precision FPU utilization, and optimized memory subsystem - confirming deterministic real-time behavior for demanding embedded applications. The R5F5671CHGFP#30 sustains this performance across its full industrial temperature range (-40°C to +105°C).

Does the R5F5671CHGFP#30 support secure firmware updates and cryptographic operations?

Yes, the R5F5671CHGFP#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true-random number generator (TRNG). Its dual-bank flash enables background firmware updates without halting execution. These features allow the R5F5671CHGFP#30 to implement secure boot, encrypted OTA updates, and tamper-resistant key storage - meeting IEC60730 Class B requirements.

What package type and pin count does the R5F5671CHGFP#30 use?

The R5F5671CHGFP#30 uses the PTLG0145JC-A package: a 145-pin thin fine-pitch land grid array measuring 9 × 9 mm with 0.65-mm ball pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and supports all RX671 Group peripherals including USB, CAN, SDHI, and CTSU - making it ideal for space-constrained industrial designs.

Can the R5F5671CHGFP#30 interface directly with SD memory cards and serial flash devices?

Yes, the R5F5671CHGFP#30 includes a dedicated SD host interface (SDHI) supporting high-speed mode (25 MB/s) and default speed mode (12.5 MB/s) for SD memory and SDIO cards. It also features QSPIX - a quad-SPI memory interface enabling execute-in-place (XIP) from external serial flash. Both interfaces are fully integrated into the R5F5671CHGFP#30's memory map and require no external glue logic.

How does the R5F5671CHGFP#30 support functional safety standards like IEC60730?

The R5F5671CHGFP#30 includes multiple IEC60730-compliant features: oscillation-stoppage detection, hardware CRC acceleration, A/D converter self-diagnostic, register write protection, and independent watchdog timer (IWDTa) with windowing. These capabilities are documented in Renesas' Functional Safety Manual for the RX671 Group and allow the R5F5671CHGFP#30 to serve as the safety controller in Class B applications without external safety monitors.