Renesas R5F5671CHGLE#20

Overview

R5F5671CHGLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671CHGLE#20 datasheet, R5F5671CHGLE#20 pinout, R5F5671CHGLE#20 application, or R5F5671CHGLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-diagnostic features for functional safety-critical firmware execution.

Technical Context

The R5F5671CHGLE#20 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT 120-kHz oscillator, enabling independent domain clocking: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI, and PCLKB up to 60 MHz for most peripherals including S12AD units.

Memory architecture includes dual-bank flash for safe over-the-air updates, 8 KB data flash rated for 100,000 erase/write cycles, and 4 KB standby RAM backed by VBATT. Peripheral coherency is managed via Event Link Controller (ELC), supporting 99 internal event signals for timer-triggered ADC conversions, PWM dead-time compensation, and hardware-accelerated interrupt chaining without CPU intervention.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 mm × 9 mm, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad. Designed for high-density PCB layouts and thermal reliability in sealed industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671CHGLE#20, the R5F5670EHGLF#20 reduces security and peripheral count for lower cost, while the R5F572MNDHFP#30 expands networking capability at the expense of package size and power - making R5F5671CHGLE#20 optimal for compact, secure, flash-booted industrial edge nodes.

Availability

R5F5671CHGLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and PLC edge nodes requiring stable component supply across extended temperature and long product lifecycles.

Supply support for R5F5671CHGLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity industrial applications demanding functional safety, secure firmware execution, and rich connectivity - with R5F5671CHGLE#20 optimized for compact, thermally constrained designs needing dual-bank flash, capacitive touch, and IEC60730 compliance.

FAQ

What is the maximum operating frequency and core type of the R5F5671CHGLE#20?

The R5F5671CHGLE#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core, achieving 707 CoreMark performance. It includes double-precision floating-point support compliant with IEEE-754, a collective register bank save function, and memory protection unit (MPU) for secure multitasking. The R5F5671CHGLE#20 leverages these capabilities for deterministic real-time control in industrial applications.

Does the R5F5671CHGLE#20 support secure firmware updates and cryptographic operations?

Yes, the R5F5671CHGLE#20 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true random number generator (TRNG). Its dual-bank flash architecture enables background programming and safe bank swapping - allowing verified firmware images to be loaded into the inactive bank while the active bank continues execution. This design ensures zero-downtime updates in the R5F5671CHGLE#20.

What package type and pin count does the R5F5671CHGLE#20 use?

The R5F5671CHGLE#20 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 mm × 9 mm with 0.65-mm pitch and an exposed thermal pad. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, along with dedicated USB, SDHI, CAN, and QSPIX interfaces. This compact, thermally efficient package suits space-constrained industrial edge devices using the R5F5671CHGLE#20.

How does the R5F5671CHGLE#20 meet IEC60730 functional safety requirements?

The R5F5671CHGLE#20 includes multiple IEC60730-compliant features: oscillation-stoppage detection, CRC-A for memory checking, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter test, and register write protection. These are implemented in hardware and validated per Annex H, enabling Class B certification without external supervision. The R5F5671CHGLE#20 delivers this safety stack alongside full application processing capability.

Which communication interfaces are integrated into the R5F5671CHGLE#20?

The R5F5671CHGLE#20 integrates USB 2.0 FS host/function/OTG, two CAN 2.0B channels (32 mailboxes each), SD host interface (25 MB/s), Quad-SPI (QSPIX), three I²C interfaces (including RIICHS at 3.4 Mbps), up to 13 SCI channels, and RSPI/RSPIA for SPI-compatible peripherals. These interfaces allow the R5F5671CHGLE#20 to serve as a central connectivity hub in multi-protocol industrial systems.