Renesas R5F5671EDDFB#30

Overview

R5F5671EDDFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and connected appliance control systems.

For engineers reviewing the R5F5671EDDFB#30 datasheet, R5F5671EDDFB#30 pinout, R5F5671EDDFB#30 application, or R5F5671EDDFB#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, MPU, self-diagnostic A/D), RTC with battery backup, and 12-bit dual-unit ADC supporting analog input disconnection detection.

Technical Context

The R5F5671EDDFB#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little- or big-endian data arrangement. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated IWDT oscillator (120 kHz), enabling independent domain clocking: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals and A/D converters.

Memory architecture includes dual-bank 2 MB code flash (no-wait access ≤60 MHz, 1-wait at 120 MHz), 8 KB data flash (100,000 erase cycles), 384 KB zero-wait SRAM, and 4 KB standby RAM backed by VBATT. Peripheral interconnect uses Event Link Controller (ELC) to route 99 internal event signals-enabling timer-triggered ADC conversion, PWM output synchronization, and interrupt-free hardware chaining without CPU intervention.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm ball pitch, 145-ball array with 111 user I/O pins, 20 of which are 5-V tolerant. Thermal pad exposed on underside for enhanced heat dissipation in high-duty-cycle applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EDDFB#30, the R5F566TEADFP#30 reduces memory and interface count for lower-cost implementations, while the R5F572MDHDFB#30 trades touch and SD support for Ethernet and higher performance - making R5F5671EDDFB#30 optimal for touch-enabled, locally stored, CAN/USB-connected edge devices.

Availability

R5F5671EDDFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and home appliance control requiring stable component supply, long-term lifecycle assurance, and traceable sourcing through Renesas-authorized channels.

Supply support for R5F5671EDDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets, with deep expertise in real-time embedded systems and functional safety.

The RX671 Group, including R5F5671EDDFB#30, was designed for high-integrity industrial edge applications demanding rich connectivity, cryptographic security, and human-machine interaction - balancing performance, safety, and peripheral integration in compact packages.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDDFB#30?

The R5F5671EDDFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic real-time execution in demanding industrial control loops.

Does the R5F5671EDDFB#30 support secure boot and cryptographic acceleration?

Yes, the R5F5671EDDFB#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES128/192/256, ECC, SHA256, and TRNG, along with secure key storage and protection against illicit copying. It supports secure boot via ROM bootloader with signature verification, and the MPU enforces memory isolation to prevent unauthorized code execution - meeting IEC60730 Class B requirements.

What package type and pin count does the R5F5671EDDFB#30 use?

The R5F5671EDDFB#30 uses a 145-ball TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and includes dedicated balls for VCC, AVCC, VBATT, USB, SD, QSPIX, and CAN interfaces - optimized for high-density industrial PCB layouts.

Can the R5F5671EDDFB#30 perform simultaneous ADC conversions across both units?

Yes, the R5F5671EDDFB#30 contains two independent 12-bit A/D converter units (S12AD0 and S12AD1) that can operate concurrently. Each unit supports software, timer (MTU/TPU/TMR), or external trigger initiation, and both feature self-diagnostic functions and analog input disconnection detection - enabling synchronized multi-sensor acquisition in energy metering or motor control.

Is the R5F5671EDDFB#30 qualified for extended temperature operation?

Yes, the R5F5671EDDFB#30 is rated for operation from –40°C to +105°C (G-version), validated per JEDEC JESD22-A104 and JESD22-A108. This extended range supports deployment in harsh environments such as industrial enclosures, outdoor metering, and automotive under-hood auxiliary systems - with thermal design aided by its exposed thermal pad in the TFLGA package.