Renesas R5F5671EDDFM#30

Overview

R5F5671EDDFM#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated capacitive touch sensing unit (CTSU) supporting up to 64 keys via mutual capacitance. It targets industrial HMI, smart metering, and secure IoT edge nodes requiring real-time control, cryptographic acceleration, and low-power RTC backup.

For engineers reviewing the R5F5671EDDFM#30 datasheet, R5F5671EDDFM#30 pinout, R5F5671EDDFM#30 application, or R5F5671EDDFM#30 equivalent, key selection criteria include its 145-pin TFLGA package (7 × 7 mm, 0.50-mm pitch), TSIP-based AES256/SHA256/ECDSA hardware encryption, SD host interface (25 MB/s), QSPIX for serial flash boot, and IEC60730-compliant safety features including self-diagnostic A/D and oscillation-stop detection.

Technical Context

The R5F5671EDDFM#30 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision FPU with 16×64-bit data registers. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals including S12AD units.

Memory architecture includes 2 MB code flash with ROM cache (8 KB), zero-wait access ≤60 MHz or cache-hit at 120 MHz, and 8 KB data flash rated for 100,000 erase/write cycles. Peripheral integration centers on event-driven operation via ELC (99 internal signals), enabling timer-triggered ADC conversion, PWM dead-time compensation, and autonomous CTSU scanning without CPU intervention.

Key Specifications

Pinout & Package

Package: TFLGA-145 (7 × 7 mm, 0.50-mm pitch), 113 configurable I/O pins with 5-V tolerant inputs on 20 pins, open-drain outputs on all I/O, pull-up resistors on all I/O, and dedicated VBATT pin for RTC/backup register retention.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5671EDDFM#30, the R5F5670EDDFM#30 reduces flash and removes TSIP for cost savings, while the R5F566TEADFP#30 trades touch/crypto/SD for higher PWM precision-making R5F5671EDDFM#30 uniquely balanced for secure, touch-enabled edge nodes.

Availability

R5F5671EDDFM#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure IoT gateway applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EDDFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX671 Group is designed for high-performance, secure, and low-power industrial edge applications-integrating touch, crypto, SD, and safety features into a single 120 MHz MCU platform.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDDFM#30?

The R5F5671EDDFM#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under standard benchmark conditions. This performance stems from its RXv3 CPU core with optimized instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F5671EDDFM#30 maintains this throughput across full-voltage range (2.7–3.6 V) and industrial temperature (–40°C to +105°C).

Does the R5F5671EDDFM#30 support hardware-accelerated cryptography, and which algorithms are implemented?

Yes, the R5F5671EDDFM#30 integrates Renesas' Trusted Secure IP (TSIP) module, providing hardware acceleration for AES128/192/256, TDES, ARC4, RSA, ECC, SHA1/224/256, MD5, GHASH, and a true-random number generator (TRNG). Keys are protected against illicit copying via dedicated secure memory. This enables efficient TLS 1.2/1.3 handshakes, secure boot verification, and encrypted firmware updates without burdening the RXv3 CPU.

What package type and pin count does the R5F5671EDDFM#30 use, and what are its I/O capabilities?

The R5F5671EDDFM#30 uses a 145-pin TFLGA package (7 × 7 mm, 0.50-mm pitch) with 113 configurable I/O pins. It supports 5-V tolerant inputs on 20 pins, open-drain outputs on all I/O, internal pull-up resistors, and switchable drive strength. Dedicated pins include VBATT for RTC backup, RTCIN/RTCOUT for 32.768 kHz crystal, and MD0/MD1 for boot-mode configuration-enabling robust industrial interfacing.

How does the R5F5671EDDFM#30 handle analog-to-digital conversion, and what safety features accompany it?

The R5F5671EDDFM#30 integrates two independent 12-bit S12AD units (8+12 channels), supporting 8/10/12-bit resolution with 0.42–0.48 µs conversion time. Each unit includes self-diagnostic capability-generating internal test voltages (e.g., VREFL0, VREFH0 × 1/2) to verify ADC linearity and offset. Combined with MPU, register write protection, and IEC60730-compliant CRC and IWDTa, the R5F5671EDDFM#30 meets Class B functional safety requirements.

Can the R5F5671EDDFM#30 boot directly from external serial flash, and which interface enables this?

Yes, the R5F5671EDDFM#30 supports direct execution from external serial flash memory via its QSPIX interface. QSPIX implements extended SPI, dual-SPI, and quad-SPI protocols with selectable address width (8–32 bits), enabling fast, secure boot from high-density flash. This eliminates reliance on internal flash for large applications and simplifies field updates-while the dual-bank code flash allows background reprogramming of the active bank.