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Renesas R5F5671EDDLK#20

Part No.:
R5F5671EDDLK#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
145-TFLGA
Datasheet:
AetrixR5F5671EDDLK#20.pdf
Description:
IC MCU 32BIT 2MB FLASH 145TFLGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,701

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Product details

Overview

R5F5671EDDLK#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F5671EDDLK#20 datasheet, R5F5671EDDLK#20 pinout, R5F5671EDDLK#20 application, or R5F5671EDDLK#20 equivalent, this page delivers verified specifications, package mapping to PLQP0144KA-B (144-pin LFQFP), functional pin roles, IEC60730-compliant safety features, and validated alternative MCUs for migration or second-sourcing.

Technical Context

The R5F5671EDDLK#20 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and double-precision FPU coprocessor supporting 21 dedicated instructions. It integrates memory protection unit (MPU) with eight configurable regions and supports little-endian or big-endian data arrangement.

Its clock system combines external crystal (8–24 MHz), sub-clock (32.768 kHz), and internal oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocks: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for MTU/RSPI/SCIm, and PCLKB up to 60 MHz for most peripherals including S12AD units.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max - enables deterministic real-time execution with 707 CoreMark performance
Flash Memory2 MB code flash with dual-bank structure - allows safe firmware updates without halting application execution
SRAM384 KB on-chip SRAM, zero-wait-state at 120 MHz - supports large real-time buffers and stack depth for complex control algorithms
A/D ConverterTwo 12-bit S12AD units (8 + 12 channels), 0.48 µs conversion time - enables high-speed sensor acquisition with self-diagnostic capability
SecurityTrusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, TRNG, and key protection - meets IEC60730 Class B security requirements
PackagePLQP0144KA-B, 144-pin LFQFP, 20 × 20 mm, 0.50-mm pitch - compatible with standard surface-mount assembly and thermal management
Operating Temp–40°C to +85°C (D-version) - qualified for industrial ambient environments without derating

Pinout & Package

PLQP0144KA-B is a 144-pin Low-Profile Quad Flat Package (LFQFP) with 0.50-mm pitch, 20 × 20 mm body size, and exposed thermal pad. Pin assignments follow Renesas' standardized RX671 Group pinout layout for 144-pin variants.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1Power supply inputsSeparate analog/digital domains enable noise isolation for precision ADC and RTC operation
VBATTBackup power inputSupplies RTC and backup registers during main power loss - supports battery-backed timekeeping
XTAL/EXTALMain clock oscillator terminalsSupports 8–24 MHz crystal resonator for precise system timing and USB clock derivation
RTCINSub-clock oscillator inputConnects 32.768 kHz crystal for autonomous RTC operation during deep software standby
MTU3A0–MTU3A8PWM waveform output pinsDrive motor control stages via complementary PWM with programmable dead time and phase counting
CAN0TX/CAN0RXCAN channel 0 differential interfaceDirect connection to ISO11898-1 transceiver - supports automotive-grade diagnostics and networked control
USB_DP/USB_DMUSB 2.0 Full-Speed differential pairIntegrated PHY eliminates external transceiver - enables host/function/OTG operation at 12 Mbps
SD0DAT0–SD0DAT34-bit SD bus data linesInterface directly with SD memory cards or SDIO peripherals - supports high-speed mode (25 MB/s)
QSPIX_IO0–QSPIX_IO3Quad-SPI memory interface signalsEnable XIP (execute-in-place) from external serial flash - reduces boot latency and external memory footprint
CTSU0–CTSU16Capacitive touch sensing inputsSupport up to 17 self-capacitance keys or 64 mutual-capacitance keys - no external components required

Key Features

Feature Design Value
Dual-bank flash architectureEnables background programming while executing from alternate bank - critical for over-the-air firmware updates
IEC60730-compliant safety suiteIncludes oscillation-stop detection, CRC-A, IWDTa windowing, A/D self-test, and register write protection - simplifies Class B certification
Event Link Controller (ELC)99 internal event signals routed without CPU intervention - reduces interrupt latency and firmware overhead in time-critical sequences
Trusted Secure IP (TSIP)Hardware-accelerated crypto engine with key encryption, preventing firmware cloning and enabling secure boot verification
SD host interface (SDHI)Compliant with SD Physical Layer Spec v3.01 - supports hot-plug detection, CRC16 data integrity, and DMA-assisted transfers
Capacitive touch sensing unit (CTSUa)Self- and mutual-capacitance modes with built-in noise cancellation - achieves robust touch detection in noisy industrial environments

Applications

Industrial HMI Panels Smart Energy Meters

Use Scenario: Touch-enabled front-panel interface for PLCs and motor drives with real-time status display and parameter configuration.

IC Role / Device Role / Timing Role: Main application controller handling GUI rendering, capacitive touch decoding, CAN/USB communication, and RTC-based logging.

Use Value: Integrated CTSU eliminates external touch controller; dual-bank flash enables field-upgradable UI firmware without service interruption.

Use Scenario: DIN-rail mounted electricity meter with tariff switching, tamper detection, and remote firmware update via cellular modem.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC sampling, secure firmware validation, SD card data logging, and CAN-based grid communication.

Use Value: TSIP ensures cryptographic integrity of firmware updates; RTC with VBATT backup maintains accurate billing timestamps during power outages.

Building Automation Controllers Medical Diagnostic Devices

Use Scenario: HVAC controller interfacing with temperature/humidity sensors, relay banks, and BACnet/IP gateways via RS485-to-USB bridge.

IC Role / Device Role / Timing Role: Real-time coordinator using MTU3a timers for precise PWM fan control and SCIh for LIN-compatible actuator communication.

Use Value: 120 MHz RXv3 core processes multi-sensor fusion in <10 ms; integrated USB host supports plug-and-play configuration tools.

Use Scenario: Portable ultrasound device requiring low-latency image processing, secure patient data storage, and battery-backed operation.

IC Role / Device Role / Timing Role: Central MCU managing SSIE audio streaming, SDHI for DICOM export, temperature sensor calibration, and encrypted data buffering.

Use Value: 384 KB SRAM accommodates real-time image buffers; standby RAM preserves context during sleep; TSIP secures PHI during transfer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F5671EHDLK#20Same RX671 Group die, but PLQP0144KA-B package with 1.5 MB flash instead of 2 MBSuitable where firmware size <1.5 MB and cost optimization is prioritized over future-proofingSelect when full 2 MB flash is not required and BOM cost reduction is critical
R5F566TEHDFP#30RX66T Group MCU, 160 MHz, 1 MB flash, no TSIP, no SDHI, no QSPIX, but enhanced motor control timers (MTU3b)Optimized for inverter-driven motor control with higher PWM resolution, lacking secure boot and serial memory fetchChoose for high-performance motor drives where crypto and external flash boot are unnecessary

Compared with R5F5671EDDLK#20, the R5F5671EHDLK#20 offers identical peripheral set and package but reduced flash capacity, while the R5F566TEHDFP#30 trades security and connectivity for higher PWM timing precision - making the R5F5671EDDLK#20 optimal for connected, certifiable, and field-upgradable embedded systems.

Availability

R5F5671EDDLK#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, building automation controllers, and medical diagnostic devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EDDLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for industrial and consumer applications demanding high computational throughput, functional safety compliance (IEC60730), and rich connectivity - targeting HMI, metering, and networked control systems.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDDLK#20?

The R5F5671EDDLK#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark performance. This score reflects deterministic execution of the RXv3 core's 113-instruction set, including double-precision floating-point and DSP extensions. The R5F5671EDDLK#20 sustains this performance across its full temperature range with zero-wait-state access to 384 KB SRAM and optimized flash cache hit behavior.

Does the R5F5671EDDLK#20 support secure boot and cryptographic operations?

Yes, the R5F5671EDDLK#20 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, RSA, ECC, SHA256, and a true-random number generator. It supports secure boot verification, encrypted firmware storage, and key protection against illicit copying. These capabilities are certified for IEC60730 Class B compliance and are accessible via Renesas' Secure Boot Manager and TSIP driver libraries.

What package type and pin count does the R5F5671EDDLK#20 use?

The R5F5671EDDLK#20 uses the PLQP0144KA-B package: a 144-pin Low-Profile Quad Flat Package with 0.50-mm pitch, 20 × 20 mm body size, and exposed thermal pad. This package maps to the full RX671 Group pinout for 144-pin variants, supporting all peripherals including CAN, USB, SDHI, QSPIX, and CTSU. Pin compatibility is confirmed per Renesas document R01DS0373EJ0120.

Can the R5F5671EDDLK#20 execute code directly from external quad-SPI flash?

Yes, the R5F5671EDDLK#20 supports execute-in-place (XIP) from external serial flash via its QSPIX interface. The QSPIX module supports extended SPI, dual-SPI, and quad-SPI protocols with selectable address widths (8–32 bits), enabling direct instruction fetch without loading into internal RAM. This reduces boot time and extends effective memory capacity beyond on-chip flash limits.

How many A/D converter channels and what resolution does the R5F5671EDDLK#20 provide?

The R5F5671EDDLK#20 integrates two independent 12-bit S12AD units: Unit 0 with 8 input channels and Unit 1 with 12 input channels. Resolution is software-selectable at 8-, 10-, or 12-bit modes, with minimum conversion times of 0.42 µs (8-bit), 0.45 µs (10-bit), and 0.48 µs (12-bit). Both units include self-diagnostic functions and analog input disconnection detection.

Is the R5F5671EDDLK#20 qualified for industrial temperature range operation?

Yes, the R5F5671EDDLK#20 is rated for the industrial temperature range of –40°C to +85°C (D-version), as specified in Renesas documentation R01DS0373EJ0120. It undergoes full characterization across this range for all key parameters including CPU frequency, flash programming/erase endurance, ADC accuracy, and peripheral timing - with no derating required under nominal supply conditions (2.7–3.6 V).

R5F5671EDDLK#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
145-TFLGA
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
113
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5671EDDLK#20 FAQ

1.How can I place an order for R5F5671EDDLK#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5671EDDLK#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5671EDDLK#20 reliable?

The price and inventory of R5F5671EDDLK#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671EDDLK#20 is usually 5 days.

3.What payment methods are accepted for R5F5671EDDLK#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671EDDLK#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F5671EDDLK#20?

R5F5671EDDLK#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5671EDDLK#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5671EDDLK#20?

For technical support, including R5F5671EDDLK#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671EDDLK#20 requirements.

6.How does Aetrix verify that R5F5671EDDLK#20 is sourced from the original manufacturer or authorized distributors?

All R5F5671EDDLK#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671EDDLK#20 meets industry standards.

7.What is the process for return or replacement of R5F5671EDDLK#20?

All R5F5671EDDLK#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671EDDLK#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5671EDDLK#20 part is unused and in its original packaging.

Return procedure for R5F5671EDDLK#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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