Renesas R5F5671EDGFP#30

Overview

R5F5671EDGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and secure IoT edge nodes.

For engineers reviewing the R5F5671EDGFP#30 datasheet, R5F5671EDGFP#30 pinout, R5F5671EDGFP#30 application, or R5F5671EDGFP#30 equivalent, key selection criteria include its 144-pin LFQFP package (PLQP0144KA-B), -40°C to +85°C D-grade temperature range, TSIP-based AES256/SHA256 encryption, 12-bit dual A/D converter with self-diagnostic capability, and IEC60730-compliant safety features for functional safety-critical firmware.

Technical Context

The R5F5671EDGFP#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-bank flash enabling background programming and safe firmware updates, alongside 8 KB data flash rated for 100,000 erase/write cycles.

Clock architecture includes PLL-driven 120 MHz system clock (ICLK), independent PCLKA/PCLKB domains (up to 120 MHz/60 MHz), sub-clock oscillator for RTC backup, and dedicated 120 kHz IWDT oscillator. Peripheral timing is strictly partitioned: MTU3a/RSPI/SCIm run on PCLKA; S12AD units synchronize to PCLKC/PCLKD (60 MHz); QSPIX runs at full ICLK speed.

Key Specifications

Pinout & Package

PLQP0144KA-B is a 144-pin Low-profile Quad Flat Package (LFQFP) with 0.50 mm pitch, 20 × 20 mm body size, and exposed thermal pad. Pin assignment follows Renesas' standardized RX671 Group pinout for 144-pin variants, supporting full peripheral mapping including 111 general-purpose I/O pins (20 with 5-V tolerance), dual CAN transceiver pins, USB D+/D−, SDIO bus, QSPIX signals, and CTSU electrode inputs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5670EDGFP#30, the R5F5671EDGFP#30 adds SDHI, QSPIX, and 1 MB more flash for local data logging and firmware flexibility; versus R5F566TEADFP#30, it trades motor-specific timers for broad connectivity and security - making it optimal for connected, certified, and user-interface-rich industrial endpoints.

Availability

R5F5671EDGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, secure IoT gateways, and home appliance controllers requiring stable component supply across multi-year production cycles.

Supply support for R5F5671EDGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group is designed for secure, connected, and safety-certifiable industrial edge devices - integrating TSIP cryptography, IEC60730 compliance features, and rich connectivity to replace discrete security + MCU + interface IC combinations.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDGFP#30?

The R5F5671EDGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark in benchmark testing. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F5671EDGFP#30 delivers deterministic real-time response for control algorithms while maintaining low power consumption in active mode.

Does the R5F5671EDGFP#30 support secure boot and cryptographic operations?

Yes, the R5F5671EDGFP#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true random number generator. It enables hardware-accelerated secure boot, encrypted firmware updates, and runtime key protection. These capabilities are fully implemented in the R5F5671EDGFP#30 silicon and require no external security co-processor - meeting foundational requirements for PSA Level 1 and IEC60730 Class B certification.

What package type and pin count does the R5F5671EDGFP#30 use?

The R5F5671EDGFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 0.50 mm pitch and 20 × 20 mm body size. It provides 111 general-purpose I/O pins (20 with 5-V tolerance), dedicated USB, CAN, SDIO, QSPIX, and CTSU signal routing. This package is RoHS-compliant and qualified for reflow soldering per J-STD-020.

Can the R5F5671EDGFP#30 execute code directly from external serial flash memory?

Yes, the R5F5671EDGFP#30 supports execute-in-place (XIP) from external serial flash via its QSPIX interface. The QSPIX controller handles extended SPI, dual-SPI, and quad-SPI protocols with configurable address width (8–32 bits), enabling fast, low-pin-count memory expansion. This capability is natively supported in the R5F5671EDGFP#30 without external glue logic or address translation - reducing BOM cost and PCB area.

What safety certifications and built-in features does the R5F5671EDGFP#30 support for IEC60730 compliance?

The R5F5671EDGFP#30 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC-A for flash memory, windowed independent watchdog timer (IWDTa), A/D converter self-diagnostic function, and register write protection. These are implemented in silicon and documented in Renesas' IEC60730 safety manual for the RX671 Group - enabling streamlined qualification of end equipment using the R5F5671EDGFP#30 as the safety MCU.