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Renesas R5F5671EDGLE#20

Part No.:
R5F5671EDGLE#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
145-TFLGA
Datasheet:
AetrixR5F5671EDGLE#20.pdf
Description:
IC MCU 32BIT 2MB FLASH 145TFLGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,796

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Product details

Overview

R5F5671EDGLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671EDGLE#20 datasheet, R5F5671EDGLE#20 pinout, R5F5671EDGLE#20 application, or R5F5671EDGLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, TSIP-based AES256/SHA256 encryption, IEC60730-compliant self-test features, and RTC with battery-backed operation - all validated for extended-temperature (–40°C to +105°C) embedded deployments.

Technical Context

The R5F5671EDGLE#20 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for deterministic interrupt latency. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals including S12AD units.

Peripheral integration follows a modular, event-driven architecture: the Event Link Controller (ELC) enables 99 internal signal interlinks (e.g., TPU output triggering A/D conversion), while EXDMACa provides two high-bandwidth DMA channels with cluster transfer for time-critical sensor or audio streaming - critical for deterministic real-time response without CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max - delivers 707 CoreMark; supports little/big-endian data and single-cycle instruction execution.
Memory2 MB code flash (dual-bank, BGO programming), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait @120 MHz), 4 KB standby RAM.
FPUDouble-precision IEEE-754 coprocessor with 16×64-bit registers and 21 dedicated instructions - enables precise motor control math or sensor fusion.
SecurityTrusted Secure IP (TSIP): AES128/192/256, SHA256, RSA, ECC, TRNG, and key protection - certified for IEC60730 Class B functional safety.
Timers & PWMMTU3a (9-channel, 3-phase complementary PWM with dead-time auto-insertion), TPUa (6-channel), CMTW (2×32-bit), IWDTa (windowed, 14-bit).
ConnectivityCAN (2×32-mailbox ISO11898-1), USB 2.0 FS (host/function/OTG), SDHI (25 MB/s), QSPIX (fetch from serial flash), RIICHS (3.4 Mbps).
AnalogTwo 12-bit S12AD units (8+12 ch), self-diagnostic, disconnection detection, and temperature sensor (±1°C accuracy via S12AD unit 1).

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm, 0.65-mm pitch, 111 I/O pins (20 with 5-V tolerance), 1 VCC/AVCC pair, 1 VBATT, 1 RES#, 1 sub-clock input (X1), and dedicated TSIP/USB/SDHI/QSPIX signal groups.

Pin/Terminal Circuit Role Design Meaning
P00–P07General I/O / CTSU electrodeCapacitive touch sensing inputs (self-capacitance mode); configurable as GPIO with pull-up/open-drain.
P10–P17USB D+/D– / CAN0 TX/RXDedicated full-speed USB 2.0 transceiver pins; also serve as CAN0 channel differential I/O with internal termination.
P20–P23QSPIX IO0–IO3Quad-SPI data lines supporting extended/dual/quad protocols - enables direct XIP from serial NOR flash.
P30–P33SDHI CLK/CMD/DAT0–DAT34-bit SD bus interface; supports high-speed mode (25 MB/s) and SDIO cards per Physical Layer Spec v3.01.
P40–P47MTU3a CH0–CH7 outputsHardware PWM outputs with complementary pairs, dead-time control, and synchronous update - suitable for 3-phase inverter gate drive.
VCC, AVCCCore & analog supplySingle 2.7–3.6 V supply; AVCC isolated for clean ADC reference; no external regulator required.
VBATTBackup power railSupplies RTC, backup registers, and sub-clock oscillator during main power loss - enables calendar continuity.

Key Features

Feature Design Value
Dual-bank flash architectureEnables seamless firmware updates: one bank executes while the other is reprogrammed via background operation (BGO), eliminating downtime.
TSIP cryptographic engineHardware-accelerated AES256/SHA256/RSA/ECC with tamper-resistant key storage - meets IEC60730 Annex H security requirements.
Event Link Controller (ELC)99 internal event signals routed without CPU involvement (e.g., TPU edge triggers A/D conversion), reducing ISR overhead and jitter.
IEC60730 compliance suiteIntegrated oscillation-stop detection, CRC-A for memory, IWDTa windowing, A/D self-test, and register write protection - simplifies Class B certification.
Capacitive touch sensing (CTSUa)Supports 17-key self-capacitance or 64-key mutual-capacitance matrix - eliminates external touch controller in HMI designs.

Applications

Industrial HMI Panel Smart Electricity Meter

Use Scenario: Touch-enabled front-panel interface with real-time energy display, tariff switching, and local firmware updates over USB.

IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering, capacitive touch decoding, secure OTA update verification, and RTC-synchronized billing logs.

Use Value: Integrated CTSUa eliminates external touch controller; TSIP ensures signed firmware validation; SDHI enables local log storage on microSD.

Use Scenario: Revenue-grade meter with anti-tampering, load profiling, and communication via CAN bus to concentrator.

IC Role / Device Role / Timing Role: System controller managing metrology ADC interface (via S12AD), CAN protocol stack, tamper detection (VBATT/RTC), and secure key storage.

Use Value: Built-in IEC60730 diagnostics reduce certification effort; CAN module with 32 mailboxes handles multi-node polling; temperature sensor compensates metrology drift.

Home Energy Gateway Programmable Logic Controller (PLC) Edge Node

Use Scenario: Multi-protocol gateway aggregating Zigbee/Z-Wave sensors and exposing data via Ethernet/USB to cloud platform.

IC Role / Device Role / Timing Role: Protocol bridge MCU running USB CDC ACM, CAN, and RSPI peripherals simultaneously with real-time scheduling via ELC-triggered DMA.

Use Value: EXDMACa cluster transfers move sensor data to USB buffer without CPU; QSPIX fetches configuration from serial flash; RIICHS interfaces with PMIC.

Use Scenario: Compact DIN-rail PLC node executing ladder logic, monitoring digital I/O, and communicating via CANopen.

IC Role / Device Role / Timing Role: Real-time control MCU with deterministic MTU3a PWM for servo control, 111 GPIO for I/O expansion, and watchdog supervision.

Use Value: 120 MHz RXv3 core meets scan-time deadlines; 4 low-power modes extend uptime in battery-backed fail-safe states; 5-V tolerant pins simplify field I/O interfacing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F5670EDNLE#20Same RX671 Group, 100-pin TFLGA, 1.5 MB flash, 256 KB SRAM, no SDHI or QSPIX.Lacks SD host and quad-SPI interfaces; suited for cost-sensitive CAN/USB-only nodes without local storage.Select when SDHI/QSPIX are unnecessary and PCB space is constrained by 100-pin footprint.
R5F566TEADFP#30RX66T Group, 144-pin LQFP, 1.5 MB flash, 384 KB SRAM, no TSIP or CTSU; adds 3-phase timer (TPU3) optimized for motor control.Targeted at inverter drives; lacks capacitive touch, crypto, and SDHI but offers higher PWM resolution and encoder interfaces.Prefer for motor-centric applications where TSIP and HMI features are secondary to PWM precision and encoder timing.

Compared with R5F5671EDGLE#20, the R5F5670EDNLE#20 reduces peripheral count and memory to lower cost and size, while the R5F566TEADFP#30 shifts focus to motor control with enhanced timers but omits security and HMI features - making R5F5671EDGLE#20 optimal for secure, storage-enabled, touch-integrated industrial edge devices.

Availability

R5F5671EDGLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and PLC edge nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F5671EDGLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for high-performance, secure, and functionally safe industrial applications - integrating real-time control, connectivity, cryptography, and human-machine interface capabilities in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDGLE#20?

The R5F5671EDGLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16 general-purpose registers, and efficient pipeline design - enabling deterministic real-time response in industrial control loops. The R5F5671EDGLE#20 sustains this speed across its 384 KB SRAM and 2 MB flash with zero wait states below 60 MHz and only one wait state at full 120 MHz.

Does the R5F5671EDGLE#20 support secure boot and firmware authentication?

Yes, the R5F5671EDGLE#20 supports secure boot and firmware authentication via its Trusted Secure IP (TSIP) module, which provides hardware-accelerated AES256, SHA256, RSA, and ECC operations alongside true random number generation and protected key storage. These features enable cryptographic signature verification of firmware images before execution - a requirement for IEC60730 Class B compliance. The R5F5671EDGLE#20 implements this without software overhead, ensuring robust protection against unauthorized code injection.

What package type and pin count does the R5F5671EDGLE#20 use?

The R5F5671EDGLE#20 uses a 145-pin TFLGA package (PTLG0145JC-A) with 9 × 9 mm body size and 0.65-mm pitch. It provides 111 general-purpose I/O pins, of which 20 are 5-V tolerant, plus dedicated pins for USB, CAN, QSPIX, SDHI, and capacitive touch sensing. This compact, fine-pitch land-grid array supports high-density PCB layouts while maintaining thermal performance for extended-temperature operation from –40°C to +105°C - confirmed in the official Renesas datasheet R01DS0373EJ0120.

Can the R5F5671EDGLE#20 execute code directly from external serial flash memory?

Yes, the R5F5671EDGLE#20 can execute code directly from external serial flash memory using its QSPIX interface, which supports extended SPI, dual-SPI, and quad-SPI protocols with selectable address widths (8–32 bits). This XIP (execute-in-place) capability eliminates the need to copy firmware into internal RAM, conserving SRAM for application data and reducing boot time. The R5F5671EDGLE#20 configures QSPIX via dedicated registers and supports memory-mapped access - verified in Section 44 of the R01DS0373EJ0120 datasheet.

How does the R5F5671EDGLE#20 handle real-time clock functionality with power loss?

The R5F5671EDGLE#20 maintains real-time clock (RTC) operation during main power loss via its VBATT pin, which supplies the backup domain containing the sub-clock oscillator, RTC counter, and backup registers. When VCC drops, the device automatically switches to VBATT (typically 1.8–3.6 V) to sustain timekeeping and calendar functions - including leap-year correction and alarm interrupts. This behavior is documented in Section 27 of the R01DS0373EJ0120 datasheet and requires no firmware intervention, ensuring uninterrupted timestamping in smart meters and industrial loggers using the R5F5671EDGLE#20.

R5F5671EDGLE#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
145-TFLGA
Series:
RX671
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5671EDGLE#20 FAQ

1.How can I place an order for R5F5671EDGLE#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5671EDGLE#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5671EDGLE#20 reliable?

The price and inventory of R5F5671EDGLE#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671EDGLE#20 is usually 5 days.

3.What payment methods are accepted for R5F5671EDGLE#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671EDGLE#20 transactions.

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4.How is shipping managed for R5F5671EDGLE#20?

R5F5671EDGLE#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5671EDGLE#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5671EDGLE#20?

For technical support, including R5F5671EDGLE#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671EDGLE#20 requirements.

6.How does Aetrix verify that R5F5671EDGLE#20 is sourced from the original manufacturer or authorized distributors?

All R5F5671EDGLE#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671EDGLE#20 meets industry standards.

7.What is the process for return or replacement of R5F5671EDGLE#20?

All R5F5671EDGLE#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671EDGLE#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5671EDGLE#20 part is unused and in its original packaging.

Return procedure for R5F5671EDGLE#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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