Renesas R5F5671EDGNE#30

Overview

R5F5671EDGNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart sensor edge nodes requiring deterministic real-time control and secure firmware updates.

For engineers reviewing the R5F5671EDGNE#30 datasheet, R5F5671EDGNE#30 pinout, R5F5671EDGNE#30 application, or R5F5671EDGNE#30 equivalent, key selection considerations include its 145-pin TFLGA (0.65 mm pitch) package, TSIP-based AES256/SHA256 encryption, IEC60730-compliant self-test features, and 12-bit dual A/D converter with analog input disconnection detection.

Technical Context

The R5F5671EDGNE#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and QSPIX, and PCLKA/PCLKB up to 120 MHz/60 MHz respectively for peripherals including MTU3a timers, RIICHS (3.4 Mbps), and S12AD units.

Its peripheral architecture supports concurrent high-throughput data movement via DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel), while event linking (ELC) enables hardware-triggered timer-to-A/D or GPIO-to-interrupt chaining without CPU intervention - critical for low-latency motor control and real-time sensor fusion.

Key Specifications

Pinout & Package

PTLG0145JC-A is a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) package measuring 9 × 9 mm with 0.65 mm pitch, optimized for high-density PCB layouts and thermal performance in industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EDGNE#20, the #30 offers extended temperature range for harsh environments; versus R5F566TEADFP#30, it trades raw motor-control throughput for broader peripheral integration - making it superior for HMI-rich, secure, storage-enabled edge nodes.

Availability

R5F5671EDGNE#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, motor drive controllers, and secure gateway modules requiring stable component supply across long-lifecycle production programs.

Supply support for R5F5671EDGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX671 Group - including R5F5671EDGNE#30 - was designed for secure, real-time edge intelligence in industrial automation, targeting applications demanding high integration, functional safety, and robust connectivity without compromising on computational throughput.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EDGNE#30?

The R5F5671EDGNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic execution for real-time control loops and signal processing tasks within the R5F5671EDGNE#30.

Does the R5F5671EDGNE#30 support secure boot and cryptographic operations?

Yes, the R5F5671EDGNE#30 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, RSA, ECC, and a true-random number generator (TRNG). It enables secure boot via flash signature verification and hardware-enforced key protection - fulfilling IEC60730 Class B requirements. These capabilities are intrinsic to the R5F5671EDGNE#30 silicon and require no external security IC.

What package type and pin count does the R5F5671EDGNE#30 use?

The R5F5671EDGNE#30 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 9 × 9 mm with 0.65 mm pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and supports full peripheral routing including USB, CAN, SDHI, and QSPIX - confirmed in Renesas datasheet R01DS0373EJ0120.

Can the R5F5671EDGNE#30 execute code directly from external serial flash memory?

Yes, the R5F5671EDGNE#30 supports execute-in-place (XIP) from external serial flash via its QSPIX interface. The QSPIX module implements quad-SPI protocols and allows direct instruction fetch - reducing reliance on internal flash and enabling flexible memory expansion. This capability is natively supported by the R5F5671EDGNE#30 without external glue logic or address translation.

How does the R5F5671EDGNE#30 handle analog-to-digital conversion for sensor inputs?

The R5F5671EDGNE#30 integrates two independent 12-bit A/D converters (S12AD units): Unit 0 with 8 channels and Unit 1 with 12 channels. Each supports selectable resolution (8/10/12 bits), scan modes, self-diagnostic voltage generation, and analog input disconnection detection. Conversion starts can be triggered by software, timers (MTU/TPU/TMR), or external signals - all fully configurable within the R5F5671EDGNE#30's register set.